KR100642405B1 - 화학 기계적 평탄화에 사용되는 폴리싱 패드를 조절하기위한 장치 및 방법 - Google Patents

화학 기계적 평탄화에 사용되는 폴리싱 패드를 조절하기위한 장치 및 방법 Download PDF

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Publication number
KR100642405B1
KR100642405B1 KR1020017005824A KR20017005824A KR100642405B1 KR 100642405 B1 KR100642405 B1 KR 100642405B1 KR 1020017005824 A KR1020017005824 A KR 1020017005824A KR 20017005824 A KR20017005824 A KR 20017005824A KR 100642405 B1 KR100642405 B1 KR 100642405B1
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South Korea
Prior art keywords
roller
polishing pad
pad
adjusting
pressure
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Expired - Fee Related
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KR1020017005824A
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English (en)
Korean (ko)
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KR20010092725A (ko
Inventor
마이클 라분스키
탁 휴연
안토니 메이어
앤드류제이. 나겐가스트
글렌더블유. 트라비스
Original Assignee
램 리서치 코포레이션
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Publication of KR20010092725A publication Critical patent/KR20010092725A/ko
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Publication of KR100642405B1 publication Critical patent/KR100642405B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02—Wheels in one piece

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020017005824A 1998-11-09 1999-10-25 화학 기계적 평탄화에 사용되는 폴리싱 패드를 조절하기위한 장치 및 방법 Expired - Fee Related KR100642405B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/188,779 1998-11-09
US09/188,779 US6086460A (en) 1998-11-09 1998-11-09 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Publications (2)

Publication Number Publication Date
KR20010092725A KR20010092725A (ko) 2001-10-26
KR100642405B1 true KR100642405B1 (ko) 2006-11-03

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Family Applications (1)

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KR1020017005824A Expired - Fee Related KR100642405B1 (ko) 1998-11-09 1999-10-25 화학 기계적 평탄화에 사용되는 폴리싱 패드를 조절하기위한 장치 및 방법

Country Status (7)

Country Link
US (2) US6086460A (enExample)
EP (1) EP1128932A4 (enExample)
JP (1) JP2002529924A (enExample)
KR (1) KR100642405B1 (enExample)
AU (1) AU1224400A (enExample)
TW (1) TW436374B (enExample)
WO (1) WO2000027585A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100943740B1 (ko) * 2008-06-02 2010-02-23 세메스 주식회사 Ｌｃｄ 패널 및 반도체 기판의 연마 장치
KR20180126082A (ko) * 2012-08-20 2018-11-26 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6248009B1 (en) * 1999-02-18 2001-06-19 Ebara Corporation Apparatus for cleaning substrate
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6196899B1 (en) * 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6244944B1 (en) 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6579797B1 (en) * 2000-01-25 2003-06-17 Agere Systems Inc. Cleaning brush conditioning apparatus
US6343977B1 (en) * 2000-03-14 2002-02-05 Worldwide Semiconductor Manufacturing Corp. Multi-zone conditioner for chemical mechanical polishing system
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6468134B1 (en) * 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
JP3768399B2 (ja) * 2000-11-17 2006-04-19 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
US20040194239A1 (en) * 2001-06-27 2004-10-07 Macdonald Ronald Anthony Container washing apparatus
KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
US6645052B2 (en) 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
US20030190874A1 (en) * 2002-04-02 2003-10-09 So Joseph K. Composite conditioning tool
TWI286964B (en) 2003-03-25 2007-09-21 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US6958005B1 (en) * 2004-03-30 2005-10-25 Lam Research Corporation Polishing pad conditioning system
US6969307B2 (en) * 2004-03-30 2005-11-29 Lam Research Corporation Polishing pad conditioning and polishing liquid dispersal system
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
US7354337B2 (en) * 2005-08-30 2008-04-08 Tokyo Seimitsu Co., Ltd. Pad conditioner, pad conditioning method, and polishing apparatus
US8251776B2 (en) * 2006-01-23 2012-08-28 Freescale Semiconductor, Inc. Method and apparatus for conditioning a CMP pad
US20100062693A1 (en) * 2008-09-05 2010-03-11 Taiwan Semiconductor Manufacturing Co., Ltd. Two step method and apparatus for polishing metal and other films in semiconductor manufacturing
US20100291841A1 (en) * 2009-05-14 2010-11-18 Chien-Min Sung Methods and Systems for Water Jet Assisted CMP Processing
KR101126382B1 (ko) * 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계식 연마시스템의 컨디셔너
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
US20140310895A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc. Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing
JP5554440B2 (ja) * 2013-07-30 2014-07-23 ニッタ・ハース株式会社 研磨パッドのコンディショナー
US11059145B2 (en) * 2017-08-10 2021-07-13 Tokyo Electron Limited Dressing apparatus and dressing method for substrate rear surface polishing member
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753269A (en) * 1971-05-21 1973-08-21 R Budman Abrasive cloth cleaner
US4318250A (en) * 1980-03-31 1982-03-09 St. Florian Company, Ltd. Wafer grinder
US4672985A (en) * 1985-03-18 1987-06-16 Mohr Larry D Belt cleaning apparatus
US4720939A (en) * 1986-05-23 1988-01-26 Simpson Products, Inc. Wide belt sander cleaning device
DE3625286A1 (de) * 1986-07-25 1988-02-04 Flier Gustav Schleifscheibenreinigung durch beaufschlagung des kuehlwassers mit ultraschall, insbesondere in anwendung fuer schleifmaschinen
US4934102A (en) * 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
EP0517594B1 (fr) * 1991-06-06 1995-12-13 Commissariat A L'energie Atomique Machine de polissage à bande microabrasive tendue et à tête support de plaquette perfectionnée
WO1993001896A1 (en) * 1991-07-22 1993-02-04 Robert Keith Smith Belt cleaner
JP3036348B2 (ja) * 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
US5547417A (en) * 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
US5622526A (en) * 1994-03-28 1997-04-22 J. D. Phillips Corporation Apparatus for trueing CBN abrasive belts and grinding wheels
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
EP0696495B1 (en) * 1994-08-09 1999-10-27 Ontrak Systems, Inc. Linear polisher and method for semiconductor wafer planarization
US5575707A (en) * 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US5643044A (en) * 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
US5775983A (en) * 1995-05-01 1998-07-07 Applied Materials, Inc. Apparatus and method for conditioning a chemical mechanical polishing pad
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5611943A (en) * 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
US5655951A (en) * 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
JPH10118916A (ja) * 1996-10-24 1998-05-12 Sony Corp 化学的機械研磨法及びその装置
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US5871390A (en) 1997-02-06 1999-02-16 Lam Research Corporation Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing
WO1998045090A1 (en) * 1997-04-04 1998-10-15 Obsidian, Inc. Polishing media magazine for improved polishing
US6239719B1 (en) * 1997-06-03 2001-05-29 At&T Wireless Services, Inc. Method for time-stamping a message based on a recipient location
JPH1110521A (ja) * 1997-06-17 1999-01-19 Sony Corp ウェーハ研磨装置
US5899798A (en) 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
JPH1148122A (ja) * 1997-08-04 1999-02-23 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
US6196896B1 (en) 1997-10-31 2001-03-06 Obsidian, Inc. Chemical mechanical polisher
JPH11300599A (ja) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd ワークの片面研磨方法及び装置
US5897426A (en) 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
JPH11333697A (ja) * 1998-05-28 1999-12-07 Nkk Corp Ｃｍｐ装置のドレッサーシステム
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100943740B1 (ko) * 2008-06-02 2010-02-23 세메스 주식회사 Ｌｃｄ 패널 및 반도체 기판의 연마 장치
KR20180126082A (ko) * 2012-08-20 2018-11-26 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
KR102025600B1 (ko) * 2012-08-20 2019-09-27 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
US10707103B2 (en) 2012-08-20 2020-07-07 Ebara Corporation Substrate cleaning apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
EP1128932A1 (en) 2001-09-05
US6328637B1 (en) 2001-12-11
US6086460A (en) 2000-07-11
EP1128932A4 (en) 2007-01-10
TW436374B (en) 2001-05-28
WO2000027585A1 (en) 2000-05-18
KR20010092725A (ko) 2001-10-26
AU1224400A (en) 2000-05-29
JP2002529924A (ja) 2002-09-10

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