JP2002529924A - 化学機械平坦化法に用いられる研磨パッドをコンディショニングする方法及び装置 - Google Patents

化学機械平坦化法に用いられる研磨パッドをコンディショニングする方法及び装置

Info

Publication number
JP2002529924A
JP2002529924A JP2000580799A JP2000580799A JP2002529924A JP 2002529924 A JP2002529924 A JP 2002529924A JP 2000580799 A JP2000580799 A JP 2000580799A JP 2000580799 A JP2000580799 A JP 2000580799A JP 2002529924 A JP2002529924 A JP 2002529924A
Authority
JP
Japan
Prior art keywords
roller
polishing pad
pad
pressure
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000580799A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002529924A5 (enExample
Inventor
マイケル ラブンスキ
タック ヒュイン
アンソニー メイアー
アンドリュー ジェイ ネイジェンガスト
グレン ダブリュー トラヴィス
Original Assignee
ラム リサーチ コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ラム リサーチ コーポレイション filed Critical ラム リサーチ コーポレイション
Publication of JP2002529924A publication Critical patent/JP2002529924A/ja
Publication of JP2002529924A5 publication Critical patent/JP2002529924A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000580799A 1998-11-09 1999-10-25 化学機械平坦化法に用いられる研磨パッドをコンディショニングする方法及び装置 Pending JP2002529924A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/188,779 1998-11-09
US09/188,779 US6086460A (en) 1998-11-09 1998-11-09 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
PCT/US1999/024841 WO2000027585A1 (en) 1998-11-09 1999-10-25 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Publications (2)

Publication Number Publication Date
JP2002529924A true JP2002529924A (ja) 2002-09-10
JP2002529924A5 JP2002529924A5 (enExample) 2006-12-21

Family

ID=22694491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000580799A Pending JP2002529924A (ja) 1998-11-09 1999-10-25 化学機械平坦化法に用いられる研磨パッドをコンディショニングする方法及び装置

Country Status (7)

Country Link
US (2) US6086460A (enExample)
EP (1) EP1128932A4 (enExample)
JP (1) JP2002529924A (enExample)
KR (1) KR100642405B1 (enExample)
AU (1) AU1224400A (enExample)
TW (1) TW436374B (enExample)
WO (1) WO2000027585A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013237151A (ja) * 2013-07-30 2013-11-28 Nitta Haas Inc 研磨パッドのコンディショナー

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US6196899B1 (en) * 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6244944B1 (en) 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6579797B1 (en) * 2000-01-25 2003-06-17 Agere Systems Inc. Cleaning brush conditioning apparatus
US6343977B1 (en) * 2000-03-14 2002-02-05 Worldwide Semiconductor Manufacturing Corp. Multi-zone conditioner for chemical mechanical polishing system
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6468134B1 (en) * 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
JP3768399B2 (ja) * 2000-11-17 2006-04-19 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
US20040194239A1 (en) * 2001-06-27 2004-10-07 Macdonald Ronald Anthony Container washing apparatus
KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
US6645052B2 (en) 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
US20030190874A1 (en) * 2002-04-02 2003-10-09 So Joseph K. Composite conditioning tool
TWI286964B (en) 2003-03-25 2007-09-21 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US6958005B1 (en) * 2004-03-30 2005-10-25 Lam Research Corporation Polishing pad conditioning system
US6969307B2 (en) * 2004-03-30 2005-11-29 Lam Research Corporation Polishing pad conditioning and polishing liquid dispersal system
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
US7354337B2 (en) * 2005-08-30 2008-04-08 Tokyo Seimitsu Co., Ltd. Pad conditioner, pad conditioning method, and polishing apparatus
US8251776B2 (en) * 2006-01-23 2012-08-28 Freescale Semiconductor, Inc. Method and apparatus for conditioning a CMP pad
KR100943740B1 (ko) * 2008-06-02 2010-02-23 세메스 주식회사 Ｌｃｄ 패널 및 반도체 기판의 연마 장치
US20100062693A1 (en) * 2008-09-05 2010-03-11 Taiwan Semiconductor Manufacturing Co., Ltd. Two step method and apparatus for polishing metal and other films in semiconductor manufacturing
US20100291841A1 (en) * 2009-05-14 2010-11-18 Chien-Min Sung Methods and Systems for Water Jet Assisted CMP Processing
KR101126382B1 (ko) * 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계식 연마시스템의 컨디셔너
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US20140310895A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc. Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing
US11059145B2 (en) * 2017-08-10 2021-07-13 Tokyo Electron Limited Dressing apparatus and dressing method for substrate rear surface polishing member
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

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JPH1110521A (ja) * 1997-06-17 1999-01-19 Sony Corp ウェーハ研磨装置
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JPH1148122A (ja) * 1997-08-04 1999-02-23 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
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JPH11333697A (ja) * 1998-05-28 1999-12-07 Nkk Corp Ｃｍｐ装置のドレッサーシステム

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JPH10118916A (ja) * 1996-10-24 1998-05-12 Sony Corp 化学的機械研磨法及びその装置
JPH1118124A (ja) * 1997-06-03 1999-01-22 At & T Wireless Services Inc 時刻記録方法及びシステム並びにメッセージ送信方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013237151A (ja) * 2013-07-30 2013-11-28 Nitta Haas Inc 研磨パッドのコンディショナー

Also Published As

Publication number Publication date
EP1128932A1 (en) 2001-09-05
US6328637B1 (en) 2001-12-11
US6086460A (en) 2000-07-11
EP1128932A4 (en) 2007-01-10
TW436374B (en) 2001-05-28
WO2000027585A1 (en) 2000-05-18
KR20010092725A (ko) 2001-10-26
AU1224400A (en) 2000-05-29
KR100642405B1 (ko) 2006-11-03

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