TW430828B - Multilayer conductive polymer device and method of manufacturing same - Google Patents

Multilayer conductive polymer device and method of manufacturing same

Info

Publication number
TW430828B
TW430828B TW088118846A TW88118846A TW430828B TW 430828 B TW430828 B TW 430828B TW 088118846 A TW088118846 A TW 088118846A TW 88118846 A TW88118846 A TW 88118846A TW 430828 B TW430828 B TW 430828B
Authority
TW
Taiwan
Prior art keywords
electrode
polymer layer
external electrode
external
internal
Prior art date
Application number
TW088118846A
Other languages
English (en)
Inventor
Andrew Brian Barrett
Dennis Walsh
Original Assignee
Bourns Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bourns Inc filed Critical Bourns Inc
Application granted granted Critical
Publication of TW430828B publication Critical patent/TW430828B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/028—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of organic substances

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Thermistors And Varistors (AREA)
  • Emergency Protection Circuit Devices (AREA)
TW088118846A 1998-11-13 1999-10-29 Multilayer conductive polymer device and method of manufacturing same TW430828B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/191,921 US6236302B1 (en) 1998-03-05 1998-11-13 Multilayer conductive polymer device and method of manufacturing same

Publications (1)

Publication Number Publication Date
TW430828B true TW430828B (en) 2001-04-21

Family

ID=22707462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088118846A TW430828B (en) 1998-11-13 1999-10-29 Multilayer conductive polymer device and method of manufacturing same

Country Status (8)

Country Link
US (1) US6236302B1 (zh)
EP (1) EP1133776A1 (zh)
JP (1) JP2002530851A (zh)
KR (1) KR20010087389A (zh)
CN (1) CN1328689A (zh)
AU (1) AU1454400A (zh)
TW (1) TW430828B (zh)
WO (1) WO2000030127A1 (zh)

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KR100495133B1 (ko) * 2002-11-28 2005-06-14 엘에스전선 주식회사 피티씨 서미스터
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CN101740189A (zh) * 2009-12-31 2010-06-16 上海长园维安电子线路保护股份有限公司 表面贴装型过电流保护元件
EP2636047A2 (de) * 2010-11-03 2013-09-11 Epcos AG Keramisches vielschichtbauelement und verfahren zur herstellung eines keramischen vielschichtbauelements
US10821339B2 (en) 2014-02-20 2020-11-03 Parsons Xtreme Golf, LLC Golf club heads and methods to manufacture golf club heads
US11141633B2 (en) 2014-02-20 2021-10-12 Parsons Xtreme Golf, LLC Golf club heads and methods to manufacture golf club heads
TWI651830B (zh) * 2015-02-17 2019-02-21 立昌先進科技股份有限公司 多功能小型化表面黏著型電子元件及其製法
CN105427976A (zh) * 2015-02-28 2016-03-23 上海长园维安电子线路保护有限公司 具有电阻正温度效应的表面贴装型过电流保护元件及其制造方法
DE102017121041A1 (de) * 2017-05-24 2018-11-29 Webasto SE Heizgerät und Verfahren zur Herstellung desselben
KR102411960B1 (ko) * 2019-11-18 2022-06-22 재단법인대구경북과학기술원 유연한 기판의 3차원 구조물 기반의 신경전극 및 이의 제조 방법
CN115359982B (zh) * 2022-09-15 2023-11-14 深圳市韬略科技有限公司 一种叠片式静电抑制器及封装方法

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Also Published As

Publication number Publication date
AU1454400A (en) 2000-06-05
EP1133776A1 (en) 2001-09-19
WO2000030127A1 (en) 2000-05-25
KR20010087389A (ko) 2001-09-15
CN1328689A (zh) 2001-12-26
US6236302B1 (en) 2001-05-22
JP2002530851A (ja) 2002-09-17

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