TW429316B - IC test apparatus - Google Patents
IC test apparatusInfo
- Publication number
- TW429316B TW429316B TW088104557A TW88104557A TW429316B TW 429316 B TW429316 B TW 429316B TW 088104557 A TW088104557 A TW 088104557A TW 88104557 A TW88104557 A TW 88104557A TW 429316 B TW429316 B TW 429316B
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- tested
- test apparatus
- precision
- match
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Discharge Of Articles From Conveyors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10106923A JPH11287842A (ja) | 1998-04-02 | 1998-04-02 | Ic試験装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429316B true TW429316B (en) | 2001-04-11 |
Family
ID=14445949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088104557A TW429316B (en) | 1998-04-02 | 1999-03-23 | IC test apparatus |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPH11287842A (ja) |
KR (1) | KR100722643B1 (ja) |
CN (1) | CN1171093C (ja) |
DE (1) | DE19914775A1 (ja) |
MY (1) | MY125922A (ja) |
SG (1) | SG81268A1 (ja) |
TW (1) | TW429316B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384242B (zh) * | 2007-04-12 | 2013-02-01 | Chroma Ate Inc | 用於檢測系統整合型封裝裝置的方法 |
TWI717595B (zh) * | 2017-04-28 | 2021-02-01 | 日商阿德潘鐵斯特股份有限公司 | 電子元件測試裝置用之載具 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002067000A1 (fr) * | 2001-02-21 | 2002-08-29 | Advantest Corporation | Insert destine a un dispositif de test de composants electroniques |
JP2003066104A (ja) * | 2001-08-22 | 2003-03-05 | Advantest Corp | インサートおよびこれを備えた電子部品ハンドリング装置 |
WO2003075024A1 (en) * | 2002-03-06 | 2003-09-12 | Advantest Corporation | Insert and electronic component handler comprising it |
JP4043339B2 (ja) | 2002-10-22 | 2008-02-06 | 川崎マイクロエレクトロニクス株式会社 | 試験方法および試験装置 |
KR100613168B1 (ko) | 2004-10-01 | 2006-08-17 | 삼성전자주식회사 | 반도체소자 테스트용 인서트 블럭 |
JP2006292727A (ja) * | 2005-03-18 | 2006-10-26 | Alps Electric Co Ltd | 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法 |
KR100659153B1 (ko) | 2006-01-26 | 2006-12-19 | 삼성전자주식회사 | 지지판을 구비하는 반도체 패키지용 인서트 |
KR100647494B1 (ko) * | 2006-03-29 | 2006-11-23 | 주식회사 엠디플렉스 | 전자회로 검사장치 및 그 검사방법 |
US7522401B2 (en) * | 2006-05-26 | 2009-04-21 | Intel Corporation | Static dissipative layer system and method |
JP4927493B2 (ja) * | 2006-10-13 | 2012-05-09 | 株式会社エンプラス | 電気部品用ソケット |
WO2008123608A1 (ja) * | 2007-04-04 | 2008-10-16 | Nhk Spring Co., Ltd. | 導電性接触子ホルダおよび導電性接触子ユニット |
WO2008125011A1 (fr) * | 2007-04-12 | 2008-10-23 | Semiconductor Testing Advanced Research Lab Inc. | Procédé et appareil pour tester des dispositifs de système en boîtier, des dispositifs micro sd |
JP2012163550A (ja) * | 2011-01-18 | 2012-08-30 | Unitechno Inc | 半導体搬送治具 |
JP2013137286A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品試験装置 |
TWI470233B (zh) * | 2012-09-28 | 2015-01-21 | Taiwan Elite Nano Technology Corp | 探針結構及其製造方法 |
KR102010275B1 (ko) * | 2013-04-03 | 2019-08-13 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
CN103412251A (zh) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | 一种具有行程控制机构的pcb板性能检测治具 |
KR102220334B1 (ko) * | 2014-10-16 | 2021-02-25 | 세메스 주식회사 | 전자 부품을 수납하기 위한 인서트 조립체 |
JP6404104B2 (ja) * | 2014-12-11 | 2018-10-10 | 株式会社エンプラス | 電気部品用ソケット |
CN106290990A (zh) * | 2015-06-10 | 2017-01-04 | 鸿劲科技股份有限公司 | 可同时多颗电子元件定位的定位装置及其应用的作业设备 |
CN105929321B (zh) * | 2016-06-12 | 2023-03-03 | 深圳市斯纳达科技有限公司 | 集成电路测试设备 |
CN110572954A (zh) * | 2019-09-11 | 2019-12-13 | 苏州汇川技术有限公司 | 引脚装配导向件及电路板组件 |
TWI760230B (zh) * | 2020-06-09 | 2022-04-01 | 台灣愛司帝科技股份有限公司 | 晶片檢測方法、晶片檢測結構以及晶片承載結構 |
CN113884511B (zh) * | 2021-09-28 | 2023-09-29 | 北京环境特性研究所 | 一种材料透射率测试支架及测试系统 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04199531A (ja) * | 1990-11-28 | 1992-07-20 | Mitsubishi Electric Corp | 半導体測定装置 |
JPH05326757A (ja) * | 1990-12-18 | 1993-12-10 | Toshiba Corp | Icソケット |
JPH06102311A (ja) * | 1992-09-21 | 1994-04-15 | Kawasaki Steel Corp | 半導体パッケージのテスト方法およびその装置 |
JPH07122625A (ja) * | 1993-10-22 | 1995-05-12 | Sony Corp | 半導体装置の位置決め方法 |
JP2761562B2 (ja) * | 1994-06-15 | 1998-06-04 | 株式会社アドバンテスト | Icハンドラのic搬送キャリア |
KR0146216B1 (ko) * | 1995-04-24 | 1998-11-02 | 정문술 | 반도체 소자검사기의 소자로딩,언로딩장치 |
JP3644553B2 (ja) * | 1995-11-20 | 2005-04-27 | 株式会社アドバンテスト | Icソケット |
JPH1058367A (ja) * | 1996-08-23 | 1998-03-03 | Advantest Corp | Ic搬送装置 |
US6097201A (en) * | 1997-10-31 | 2000-08-01 | Kinetrix, Inc. | System to simultaneously test trays of integrated circuit packages |
-
1998
- 1998-04-02 JP JP10106923A patent/JPH11287842A/ja active Pending
-
1999
- 1999-03-23 TW TW088104557A patent/TW429316B/zh not_active IP Right Cessation
- 1999-03-31 DE DE19914775A patent/DE19914775A1/de not_active Ceased
- 1999-03-31 SG SG9901609A patent/SG81268A1/en unknown
- 1999-04-01 MY MYPI99001249A patent/MY125922A/en unknown
- 1999-04-02 CN CNB991047974A patent/CN1171093C/zh not_active Expired - Fee Related
- 1999-04-02 KR KR1019990011644A patent/KR100722643B1/ko not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384242B (zh) * | 2007-04-12 | 2013-02-01 | Chroma Ate Inc | 用於檢測系統整合型封裝裝置的方法 |
TWI717595B (zh) * | 2017-04-28 | 2021-02-01 | 日商阿德潘鐵斯特股份有限公司 | 電子元件測試裝置用之載具 |
Also Published As
Publication number | Publication date |
---|---|
SG81268A1 (en) | 2001-06-19 |
JPH11287842A (ja) | 1999-10-19 |
CN1171093C (zh) | 2004-10-13 |
CN1230691A (zh) | 1999-10-06 |
KR19990082895A (ko) | 1999-11-25 |
MY125922A (en) | 2006-08-30 |
DE19914775A1 (de) | 1999-11-11 |
KR100722643B1 (ko) | 2007-05-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW429316B (en) | IC test apparatus | |
TW428096B (en) | IC testing apparatus | |
ATE371196T1 (de) | Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten | |
HK1199106A1 (en) | Improved integrated circuit contact with test apparatus | |
MY114793A (en) | Test section for use in an ic handler | |
TW200506394A (en) | Electronic part test device (1) | |
TW200741212A (en) | Probe card covering system and method for testing integrated circuits | |
TW200700301A (en) | Method of holding an electronic component in a controlled orientation during parametric testing | |
DE50206869D1 (de) | Führungssystem für Kontaktstecker | |
EP0903755A3 (en) | Ciruit and method to externally adjust internal circuit timing | |
TW334607B (en) | Method for high speed testing a semiconductor device | |
PT1724397E (pt) | Método e dispositivo para medir parâmetros de uma viaférrea | |
TW557736U (en) | Device for adjusting components of a chair | |
MY125628A (en) | Ic testing apparatus | |
TWI256122B (en) | Integrated circuit and associated packaged integrated circuit | |
EP0851235A3 (en) | Circuit and method to externally adjust internal circuit timing | |
DE59208473D1 (de) | Prüfvorrichtung für integrierte Schaltkreise | |
TW367415B (en) | Test method for ball grid array integrated circuit | |
MY126215A (en) | Apparatus and method for testing semiconductor devices | |
MXPA05007729A (es) | Aparato de fijacion. | |
ATE270937T1 (de) | Vorrichtung zur verbindung zweier bauteile | |
ATE222369T1 (de) | System und verfahren zur prüfhalterungscharakterisierung | |
ATE245779T1 (de) | Dichtungseinrichtung | |
EP0961216A3 (en) | IC card-based test apparatus and method | |
DE50011088D1 (de) | Vorrichtung zur Verbindung zweier Teile |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MK4A | Expiration of patent term of an invention patent |