SG81268A1 - Ic testing appartus - Google Patents

Ic testing appartus

Info

Publication number
SG81268A1
SG81268A1 SG9901609A SG1999001609A SG81268A1 SG 81268 A1 SG81268 A1 SG 81268A1 SG 9901609 A SG9901609 A SG 9901609A SG 1999001609 A SG1999001609 A SG 1999001609A SG 81268 A1 SG81268 A1 SG 81268A1
Authority
SG
Singapore
Prior art keywords
appartus
testing
testing appartus
Prior art date
Application number
SG9901609A
Other languages
English (en)
Inventor
Hiroto Nakamura
Noboru Saito
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of SG81268A1 publication Critical patent/SG81268A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Discharge Of Articles From Conveyors (AREA)
SG9901609A 1998-04-02 1999-03-31 Ic testing appartus SG81268A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10106923A JPH11287842A (ja) 1998-04-02 1998-04-02 Ｉｃ試験装置

Publications (1)

Publication Number Publication Date
SG81268A1 true SG81268A1 (en) 2001-06-19

Family

ID=14445949

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9901609A SG81268A1 (en) 1998-04-02 1999-03-31 Ic testing appartus

Country Status (7)

Country Link
JP (1) JPH11287842A (ja)
KR (1) KR100722643B1 (ja)
CN (1) CN1171093C (ja)
DE (1) DE19914775A1 (ja)
MY (1) MY125922A (ja)
SG (1) SG81268A1 (ja)
TW (1) TW429316B (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067000A1 (fr) * 2001-02-21 2002-08-29 Advantest Corporation Insert destine a un dispositif de test de composants electroniques
JP2003066104A (ja) * 2001-08-22 2003-03-05 Advantest Corp インサートおよびこれを備えた電子部品ハンドリング装置
DE10297654B4 (de) * 2002-03-06 2010-08-05 Advantest Corp. Halteeinsatz und Handhabungsvorrichtung mit einem solchen Halteeinsatz für elektronische Bauelemente
JP4043339B2 (ja) 2002-10-22 2008-02-06 川崎マイクロエレクトロニクス株式会社 試験方法および試験装置
KR100613168B1 (ko) 2004-10-01 2006-08-17 삼성전자주식회사 반도체소자 테스트용 인서트 블럭
JP2006292727A (ja) * 2005-03-18 2006-10-26 Alps Electric Co Ltd 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法
KR100659153B1 (ko) 2006-01-26 2006-12-19 삼성전자주식회사 지지판을 구비하는 반도체 패키지용 인서트
KR100647494B1 (ko) * 2006-03-29 2006-11-23 주식회사 엠디플렉스 전자회로 검사장치 및 그 검사방법
US7522401B2 (en) * 2006-05-26 2009-04-21 Intel Corporation Static dissipative layer system and method
JP4927493B2 (ja) * 2006-10-13 2012-05-09 株式会社エンプラス 電気部品用ソケット
JP5490529B2 (ja) * 2007-04-04 2014-05-14 日本発條株式会社 導電性接触子ユニット
US7545158B2 (en) * 2007-04-12 2009-06-09 Chroma Ate Inc. Method for testing system-in-package devices
WO2008125011A1 (fr) * 2007-04-12 2008-10-23 Semiconductor Testing Advanced Research Lab Inc. Procédé et appareil pour tester des dispositifs de système en boîtier, des dispositifs micro sd
JP2012163550A (ja) * 2011-01-18 2012-08-30 Unitechno Inc 半導体搬送治具
JP2013137286A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品試験装置
TWI470233B (zh) * 2012-09-28 2015-01-21 Taiwan Elite Nano Technology Corp 探針結構及其製造方法
KR102010275B1 (ko) * 2013-04-03 2019-08-13 (주)테크윙 반도체소자 테스트용 핸들러
CN103412251A (zh) * 2013-07-24 2013-11-27 昆山迈致治具科技有限公司 一种具有行程控制机构的pcb板性能检测治具
KR102220334B1 (ko) * 2014-10-16 2021-02-25 세메스 주식회사 전자 부품을 수납하기 위한 인서트 조립체
JP6404104B2 (ja) * 2014-12-11 2018-10-10 株式会社エンプラス 電気部品用ソケット
CN106290990A (zh) * 2015-06-10 2017-01-04 鸿劲科技股份有限公司 可同时多颗电子元件定位的定位装置及其应用的作业设备
CN105929321B (zh) * 2016-06-12 2023-03-03 深圳市斯纳达科技有限公司 集成电路测试设备
JP6842355B2 (ja) * 2017-04-28 2021-03-17 株式会社アドバンテスト 電子部品試験装置用のキャリア
CN110572954A (zh) * 2019-09-11 2019-12-13 苏州汇川技术有限公司 引脚装配导向件及电路板组件
TWI760230B (zh) * 2020-06-09 2022-04-01 台灣愛司帝科技股份有限公司 晶片檢測方法、晶片檢測結構以及晶片承載結構
CN113884511B (zh) * 2021-09-28 2023-09-29 北京环境特性研究所 一种材料透射率测试支架及测试系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06102311A (ja) * 1992-09-21 1994-04-15 Kawasaki Steel Corp 半導体パッケージのテスト方法およびその装置
JPH07122625A (ja) * 1993-10-22 1995-05-12 Sony Corp 半導体装置の位置決め方法
US5675957A (en) * 1995-04-24 1997-10-14 Mirae Corporation Device loading/unloading apparatus for semiconductor device handler
GB2316536A (en) * 1996-08-23 1998-02-25 Advantest Corp Semiconductor device transporting and handling apparatus
WO1999023502A1 (en) * 1997-10-31 1999-05-14 Teradyne, Inc. System to simultaneously test trays of integrated circuit packages

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199531A (ja) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp 半導体測定装置
JPH05326757A (ja) * 1990-12-18 1993-12-10 Toshiba Corp Ｉｃソケット
US5635832A (en) * 1994-06-15 1997-06-03 Advantest Corporation IC carrier for use with an IC handler
JP3644553B2 (ja) * 1995-11-20 2005-04-27 株式会社アドバンテスト Ｉｃソケット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06102311A (ja) * 1992-09-21 1994-04-15 Kawasaki Steel Corp 半導体パッケージのテスト方法およびその装置
JPH07122625A (ja) * 1993-10-22 1995-05-12 Sony Corp 半導体装置の位置決め方法
US5675957A (en) * 1995-04-24 1997-10-14 Mirae Corporation Device loading/unloading apparatus for semiconductor device handler
GB2316536A (en) * 1996-08-23 1998-02-25 Advantest Corp Semiconductor device transporting and handling apparatus
WO1999023502A1 (en) * 1997-10-31 1999-05-14 Teradyne, Inc. System to simultaneously test trays of integrated circuit packages

Also Published As

Publication number Publication date
MY125922A (en) 2006-08-30
KR19990082895A (ko) 1999-11-25
CN1230691A (zh) 1999-10-06
JPH11287842A (ja) 1999-10-19
KR100722643B1 (ko) 2007-05-28
DE19914775A1 (de) 1999-11-11
TW429316B (en) 2001-04-11
CN1171093C (zh) 2004-10-13

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