TW428223B - Apparatus for plating a substrate - Google Patents

Apparatus for plating a substrate

Info

Publication number
TW428223B
TW428223B TW088117038A TW88117038A TW428223B TW 428223 B TW428223 B TW 428223B TW 088117038 A TW088117038 A TW 088117038A TW 88117038 A TW88117038 A TW 88117038A TW 428223 B TW428223 B TW 428223B
Authority
TW
Taiwan
Prior art keywords
substrate
plating
plating apparatus
process section
loading
Prior art date
Application number
TW088117038A
Other languages
English (en)
Inventor
Fumio Kuriyama
Naoaki Ogure
Akihisa Hongo
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10282844A external-priority patent/JP2000109994A/ja
Priority claimed from JP28284598A external-priority patent/JP4044223B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of TW428223B publication Critical patent/TW428223B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemically Coating (AREA)
TW088117038A 1998-10-05 1999-10-04 Apparatus for plating a substrate TW428223B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10282844A JP2000109994A (ja) 1998-10-05 1998-10-05 基板メッキ装置
JP28284598A JP4044223B2 (ja) 1998-10-05 1998-10-05 基板メッキ装置

Publications (1)

Publication Number Publication Date
TW428223B true TW428223B (en) 2001-04-01

Family

ID=26554799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088117038A TW428223B (en) 1998-10-05 1999-10-04 Apparatus for plating a substrate

Country Status (5)

Country Link
US (1) US6495004B1 (zh)
EP (1) EP1048756A4 (zh)
KR (1) KR100694563B1 (zh)
TW (1) TW428223B (zh)
WO (1) WO2000020663A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100637890B1 (ko) * 1999-07-08 2006-10-23 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 도금방법 및 도금처리설비
US20020043466A1 (en) * 1999-07-09 2002-04-18 Applied Materials, Inc. Method and apparatus for patching electrochemically deposited layers using electroless deposited materials
KR20010107766A (ko) 2000-05-26 2001-12-07 마에다 시게루 기판처리장치 및 기판도금장치
US20060011487A1 (en) * 2001-05-31 2006-01-19 Surfect Technologies, Inc. Submicron and nano size particle encapsulation by electrochemical process and apparatus
WO2003017359A1 (en) * 2001-08-13 2003-02-27 Ebara Corporation Semiconductor device and production method therefor, and plating solution
TWI591710B (zh) * 2002-11-15 2017-07-11 荏原製作所股份有限公司 基板處理裝置及基板處理方法
AU2003298904A1 (en) * 2002-12-05 2004-06-30 Surfect Technologies, Inc. Coated and magnetic particles and applications thereof
JP2007525595A (ja) * 2004-02-04 2007-09-06 サーフェクト テクノロジーズ インク． メッキ装置及び方法
TW201401359A (zh) * 2012-04-30 2014-01-01 Applied Materials Inc 用以分隔流動樑式輸送器與半導體基板清潔環境的方法及設備
KR101396919B1 (ko) * 2012-12-13 2014-05-19 한국생산기술연구원 폴리머 필름과 금속층 간의 접합력 향상 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63255821A (ja) * 1987-04-13 1988-10-24 Kobe Steel Ltd 磁気デイスク用基盤の変色防止法
US4746414A (en) * 1987-09-08 1988-05-24 The United States Of America As Represented By The Secretary Of The Navy Zero discharge spray rinse system for electroplating operations
US5488964A (en) * 1991-05-08 1996-02-06 Tokyo Electron Limited Washing apparatus, and washing method
JP3654923B2 (ja) * 1994-02-28 2005-06-02 野村マイクロ・サイエンス株式会社 ウェハの保管方法及びその輸送方法
JP2762230B2 (ja) * 1994-03-25 1998-06-04 信越半導体株式会社 シリコンウエーハの保管方法
JPH09289185A (ja) * 1996-04-22 1997-11-04 Hitachi Ltd 半導体ウェハ洗浄装置
JP3583883B2 (ja) * 1997-01-24 2004-11-04 日本エレクトロプレイテイング・エンジニヤース株式会社 自動ウェーハめっき装置
US5960956A (en) * 1997-02-19 1999-10-05 St. Jude Medical, Inc. Storage container
US5932077A (en) * 1998-02-09 1999-08-03 Reynolds Tech Fabricators, Inc. Plating cell with horizontal product load mechanism

Also Published As

Publication number Publication date
KR100694563B1 (ko) 2007-03-13
WO2000020663A1 (en) 2000-04-13
US6495004B1 (en) 2002-12-17
EP1048756A1 (en) 2000-11-02
EP1048756A4 (en) 2006-06-21
KR20010032642A (ko) 2001-04-25

Similar Documents

Publication Publication Date Title
JP4070075B2 (ja) 化学気相蒸着方法及び装置
KR100597024B1 (ko) 기판의 도금장치
EP0782889A3 (en) Method and apparatus for washing or for washing-drying substrates
KR20070082587A (ko) 기판처리장치 및 기판도금장치
TW428223B (en) Apparatus for plating a substrate
JPS587830A (ja) 薄片状物品の洗浄方法及び装置
KR100673817B1 (ko) 기판처리장치 및 기판처리장치에 있어서의 기판반송장치
US20040194814A1 (en) Apparatus and process for stripping resist
US6841056B2 (en) Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
JPS61247034A (ja) 半導体スライスの洗浄方法
US20050109627A1 (en) Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features
JPH11315383A (ja) 基板のめっき装置
KR100637401B1 (ko) 로봇 척 세정조 겸용 기판 린스조, 이를 포함하는 습식세정 장치 및 기판 세정 방법
JP4044223B2 (ja) 基板メッキ装置
US6890414B2 (en) Purification system and method
JP3197304B2 (ja) 基板液処理装置及び基板液処理方法
US6183611B1 (en) Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate
JPH0684873A (ja) ウエーハ処理装置
JP2005314762A (ja) 電気メッキ装置
JPH03116819A (ja) 半導体装置の製造方法および装置
KR20050016904A (ko) 금속 부식을 감소시키면서 기판을 전기 화학적으로처리하는 장치 및 방법
JP2000160349A (ja) 無電解めっき装置
JP2000160391A (ja) 半導体基板のメッキ方法およびメッキ装置
JPH1129881A (ja) ウェハのエッチング処理装置
JP2000109999A5 (zh)

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent