TW423131B - Wire bond attachment of a integrated circuit package to a heat sink - Google Patents

Wire bond attachment of a integrated circuit package to a heat sink Download PDF

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Publication number
TW423131B
TW423131B TW088105209A TW88105209A TW423131B TW 423131 B TW423131 B TW 423131B TW 088105209 A TW088105209 A TW 088105209A TW 88105209 A TW88105209 A TW 88105209A TW 423131 B TW423131 B TW 423131B
Authority
TW
Taiwan
Prior art keywords
heat sink
package
conductive surface
mounting flange
board
Prior art date
Application number
TW088105209A
Other languages
English (en)
Inventor
Larry C Leighton
Thomas W Moller
Bengt Ahl
Original Assignee
Ericsson Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Inc filed Critical Ericsson Inc
Application granted granted Critical
Publication of TW423131B publication Critical patent/TW423131B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/481—Disposition
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    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Description

423131 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 Μ A7 ----— _Β7______ 五、發明說明（1 ) 發明簌_ 所提發明屬於積體電路封裝範圍，且特別爲，將一積體 電路封裝固定至一散熱片上之安装配置。 背景 積體電路（"ICs")在工業上自通信至消費電子均廣爲使 用。例如’一功率電晶體乃由一或多個電晶體單元在矽圓 片上组立而形成，一般稱之如電晶體"晶片"。電晶體晶片 接合於一常爲-陶磁基底爲熱傳導而非導片之絕緣層。陶磁 基雇本身接合至熱傳導之安裝凸緣上，—保護用蓋子將基 底與電晶體晶片蓋起並固定於凸緣上，如此形成一電晶體 1C”封裝"。 不同之電氣導電（例如薄金屬）之引線接至封装並自封裝 引出目的爲將電晶體晶片之共同端子連接至其他設置如附 近之印刷電路（"PC”）板上。例如，一雙極接合型功率電晶 體各對應之引線接至封裝連接至電晶體晶片之基極，射極 及集極β 因爲電晶體封裝在使用中會產生大量之熱量，封裝安裝 凸緣之底部表面一般直接固定於PC板下一金屬散熱片上， 例如’ 一單—層PC板在相對立之上部及底部導電表面間有 一電介質材料層，其中底層表面功能如一參考接地。此底 層表面通常以螺絲或以錫焊接至下部之金屬散熱片上，如 此底層表面與散熱器相對於接至Pc板之上部表面之 電路元件而言爲同一接地電位。 ° 有數種已知之技術將一封裝固定至一散熱片表面上。例 ____ -4- 本紙張尺度適用中國因家標準（CNS)A4規格（210 X 297公爱）
423131 A7 B7
經濟部智慧財產局員工消費合作社印製 五、發明說明（2 ) 如如圖I所示’將封裝安裝凸緣26與散熱片22之表面間藉 一錫焊連接28將1C封裝20固定至散熱片22上之一例。 此一施做相當簡單，錫焊焊接材料28相對於安裝凸緣26 及散熱片22(標準金屬）具有不變之不同之熱膨脹係數。結 果，由於相對應之各層間熱膨脹應力特別當IC封裝受到每 次使用反覆之溫變化時使安裝凸緣與散熱片2 2間之結合變 弱甚至破壞。近爾加入之結合層28之存在可能使凸緣26與 散熱片22間之熱傳導效果減低。此種施做方式更進一步之 缺點爲，由於檢修或更換將IC封裝2〇予以移去時，爲了打 開錫焊結合2 8需將全部之教熱片予以加熱，如此使同一散 熱片2 2之其他錫焊結合之應力亦變弱。 參見圖2爲使用一錫焊結合之另一替代方式’ ic封裝2〇 利用一對螺絲24穿過位於安裝凸綠26之對應端之開孔將之 固疋至散熱片22上。參見圖3及4 ’如向上突出情形乃爲將 一1C封裝以一個或多個螺絲30插入至散熱片22來固定至散 熱片上。一有彈力之金屬帶32由螺絲30延伸形成如同在— 1C封裝20蓋子上加上一夾子’如此可獲得一確實之向中心 力將安裝凸26”固定”於散熱片上。 另有固定1C封裝至熱散片之方法揭示且記述於待審美國 專利申請案S/N 08/956,193發明名稱"固定一積體電路封裝 至一散熱片之安裝配置·'，其亦併入此處供參考其全部所敎 導。在圖5中亦爲將1C封裝固定至一散熱器之另—方式， 其特點，爲一1C封裝40之保護蓋子50之上部表面上有一中 心突起物54。一有彈力之保持彈簧做成一帶形狀其帶狀曲 -5- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1«---ΊΙΙΙΙΙ--- - I . (請先閱讀背面之注意事項-寫本頁 訂·_ -線- 4 23 彳 3 1 A7 B7 3 五、發明說明（ 線底表面60上有一開孔合於中心突起物54處，帶狀曲線伸 延至具有相反之二端56及58 » 將一 1C封裝40安裝於一散熱片42上，可將保持彈簧開孔 62壓入配合之封裝蓋子突出物54上，且將ic封裝40及安 裝凸緣45插入並使確實平行於突出於散熱片42之牆44及 48上，雖然角度相反，結果使保持彈簧相對應二端56及 58自封裝子50延伸所得效果一樣。牆44及48相距有一段 距離以達成相反之保持彈簧二端56及58當凸緣45插入至 散熱片42上時’使相互間產生適當之餐力。 踏44及48二邊有相對應之多數之切口且64及68以"棘齒 ’’釋放方式確實平行於散熱片42上。一旦安裝凸緣45受力 壓至散熱片上’由於相對應牆上之切口 64及68使相反之彈 簧端56及58保持於原位。此—方式如箭頭7〇所示彈簧46 加支持力於封裝蓋子50上，如此安裝凸緣45在散熱片上即 予固定。 任何上面將1C封裝固定至一散熱片上之所示之方式，一 但將1C封裝固定至散熱片，電氣引線自封裝延伸出（圖卜5 未示出）必連接於相對立之即接合至散熱片位於靠近之pc 板之導電表面引線或導電面上。 見圖6可由圖示看出—Ic封裝8〇之安裝凸緣86經一慣常 之錫焊焊接84安裝至一散熱片82上。一單一層pc板“亦 同樣藉由靠近封裝80二側之螺絲（未示出）固定至散熱片82 上^ PC板包括有一金屬上部表面9〇，一電介質材料層 92，及一金屬底層表面94，其中底層表面94接於散熱器 -6 - 本紙張尺度適用中國國家標準(CNS)Ad榻这 [Ί 1 !1!裝 i—！ — I 訂 -----—！線 (請先閲讀背面之注意事項-^:寫本頁) 經濟部智慧財產局員工消費合作杜印製 Μ V J \ 3 I" 4 23131 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（4 82上’其集合功能相對於接至pc板88之上部表面之電路 元件（未示出）而言如一參考接地。相對應之引線96及98自 相反之封裝8 0之二侧延伸並經相對立之錫焊焊接100及102 連接至在PC板88之上部表面90所形成之相屬之導電迴路 上〇 由於前述圖1使用錫焊以接合相對應之封裝凸緣（28)及 散熱片（2 2 )所造成之問題β錫焊連接10〇及丨〇2極易由二錫 焊材料間導電面90及相對應之（金屬）引線96及98因不同熱 膨張係數而產生問題。特別者，錫焊材料在多次之加熱及 冷卻後易成結晶使焊接1〇〇及102變弱及/或失敗，使相對 立之引線96及98蹺起且自PC板之表面脱離。 因之，提出將一1C元件封裝固定至一散熱片上避免使用 錫焊之改善配置是有其需要地。 發明摘要 本發明對一 1C元件封裝安裝至一散熱片上提出改善配置 方式爲由封裝延伸而出之引線與靠近之一 PC板表面相對應 之導電通路提供非焊踢底之連接β 在所選之具體實施例中，IC封装之熱傳導凸緣直接放置 於相對立接至散熱片上之單—層PC板層面間之散熱片上， 如此使封裝相反二側延伸之電氣引線在相對應之靠近之pc 板層面之表面所形成所屬導電表面上定位。按照發明之第 方面，相對立之封裝引線由一或數個软結合電線各自被 接於相屬之PC板面上《除封裝引線電氣連接至相對立之 PC板層面外，結合線將封裝集合安裝至散熱片之方式使相 t纸張尺度適財關家標準（CNS_)A4規格⑵G κ 297公^· I··---1------裝· ----- - - 訂 ------- -- 線 (請先閱讀背面之注意事項寫本頁) / 4 23 13 A7 B7 五 、發明說明（ 5 對應之凸緣與散熱片表面間在熱應力反應下允許二者有侧 向之移動。 對精予此一技藝之士不難了解，其他及進一步之目的及 優點在此後予以説明之。 l-鱼重要説明 圖面示出本發明之設計及利用，其中在不同之具體實施 例中相似之元件爲便於顯示之目的均以相同之參考號碼作 爲參考，其中： 圖1爲一第一種先前技藝之安裝配置之侧面圖，其中一 封裝以錫焊或其他方式結合於一散熱片上； 圖2爲一第二種先前技藝之安裝配置之部分切割之侧面 圖，其中使用安裝螺絲直接將一 1C封装固定至一散熱片 上。 圖3爲一第三種先前技藝之安裝配置之側面圖，其中一單 一保持螺絲及保持帶自此延伸用以固定一 1C封裝至—散熱 片上〇 圖4爲一第四種先前技藝之安裝配置之側面圖，其中一對 保持螺絲及一保持帶在其中延伸用作將一 1C封裝固定至一 散熱片上。 圖5爲仍爲進一步之將一 IC固定至一散熱片之配置部分 切割之侧面圖’其一有彈力之，帶狀保持彈簧附著於—封 裝保護蓋子之中心上，且以一對相反由散熱片上突出之牆 來使之定於原位。 圖6爲一 1C封裝以錫焊結合至一散熱片之部分切割之侧 ____ _ 8 · 11!1!裝 i I C諳先閱讀背面之注意事項寫本頁) 訂- -線- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格⑵〇 297公釐） 423131 A7 B7 五、發明說明（6 面圖，藉由在一靠近PC板導電表面引線經一先前技藝以錫 焊焊接連接至相對應自封裝延伸之引線上。 圖7爲一所選之功率電晶體封裝接合至一散熱片乃利用— 多數之軟結合電線將由封裝延伸相對應之引線連接至散熱 片靠近PC板層面所形成之導電表面上之頂視圖；及 圖8爲圖7配置之一部分切割之侧面圖。 所選具體實施例之詳細説明 參見圖7，一功率電晶體封裝110在接合至散熱片112之 單一層PC板板之第一及第二層面Π3及114間之一散熱片上 定位。功率電晶體i 10包括接至一侧13〇上之一第一多數之 引線117 ’ 119及121 ’及接至一相反侧132上之一第二多數 之引線137 ’ 139及141。特別者，封裝11〇定位於散熱片 上，其第一侧13 0之電氣引線117，119及12 1在相對應之第 一 PC板層面113表面所形成相屬之導電表面U6 6 118及 120上延伸及在相反側132之電氣引線137，139及141在相 對應之第二PC板層面II4表面所形成相屬之導電表面136， 138及140上延伸。 在一所選之具體實施例中，導電面116，118，120， 136，138，及140乃由相對應之第一及第二pc板層面113 及114之導電之（即金屬之）上部表面選擇性之將部分予以除 去而將下部電介質材料115予以露出而形成者。電介質材 料115之露出面其功能如·-非導電之限界以限定相對應之 導電面 116，118，120，136，138，及 140。 電晶體封裝引線117，119，121，137，139及141以相對 -9- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) —-----------裝— (請先閲請背面之注f項ri寫本頁) :5J* i線- 經濟部智慧財產局員工消費合作社印製 423131 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（7 ) 應之多數之彈力之導電結合電線122，124，126，142， 144及146連接至相屬之導電pc板面116，118，120， 136 ’ 138 ’ 及 140 上。結合電線 122，124，126，142， 144，及146最好由適當材料如鋁，金，或—鋁合金在集合 將封裝110固定至散熱片之同時亦將封裝引線，119， 121，137 ’ 139及141與PC板相對立之PC板面116，118， 120 ’ 136，138及140電氣耦合。 更特別者，相對應之多數結合電氣電線122，124， 126 ’ 142，144及146結合於相對應之導電PC板面116， 118，120，130，138及140之一端及在封裝引線1Π , 119，121，137，139及141之另一端。每一單獨之結合線 之結合最好採慣常之方式例如已知之超音波電線之結合技 術將相對應之導電面與封裝引線連接。 由圖8可以看出’有彈力之電線提供一與相對應之封裝引 線相反之力其方向如箭頭15 0所示，如此將電晶體封裝11 〇 下之安裝凸緣152壓向散熱片112。因封裝凸緣152並非固 定於原位’顯示之安裝架構相對於散熱片允許封裝11〇向 侧向移動如箭頭128所示，可避免任何其他原因而生之熱 應力。近爾’採結合線將封裝引線117，119，121，137， 139，及U1與相對應之導電Pc板面116，ι18，120， 136 ’ 138，及140連接可使錫焊連接不再需要最少有此一 優點。 所選具體實施例已揭示如改善之將一1C封裝固定至一散 熱片之安裝配置’在本發明之具體實施例及應用上示出及 10- C請先閱讀背面之注$項再彡·，片本頁) •裝· —訂 線
干 I Μ 公 4 23 13 1 " A7 B7 五、發明說明（8 ) 説明中，對熟於此一技藝之士很顯然能在不達背發明之概 念下是有可能由此做出許多修改及應用的。 因之，發明之範圍除所附之申請專利範圍外均不設限。 -n n l^i It I * n (請先閱讀背面之注意事項-Y寫本頁) J 0 . 言 -線 經濟部智慧財產局員工消費合作社印製 •11 本紙張尺度過用t國國家標準（CNTS)A4規格（210 X 297公釐）

Claims (1)

  1. A8 B8 C8 D8 423131 I 六、申請專利範圍 1. 一種電氣组合，包含： —積禮電路封裝包括一安裝凸緣及一電氣引線，電氣 引線接至封裝並自此向外延伸； 一散熱片’安裝凸緣直接與散熱片接觸； 一導電表面在靠近積體電路封裝處接合至散熱片；及 —多數有彈力，導電電線之一端接至導電表面及另一 端接至電氣引線’電線將安裝凸緣固定至散熱片上。 2. 如申請專利範圍第1項之電氣組合，其中導電表面包括 一單一層PC板。 3. 如申請專利範圍第1項之電氣組合，其中安裝凸緣相對 於散熱片爲側向可移動者。 4. 一種電氣電路組合，包含： —積體電路封裝，封裝包括一安裝凸緣； 矛 电氣引線接至封裝之一第一側並由此延仲； 一第二電氣引線接至封裝之第二侧，並自此延伸； 一散熱片’安裝凸緣直接定位於並與散熱片接觸； 一第一導電表面在靠近封裝之第一侧處接合至散熱 片； 一第二導電表面在靠近封裝之第二側處接合至散熱 片； 、 一第一多數之有彈力，導電之電線之一端接至第一導 電表面，及另一端接至第—電氣引線；及 一第二多數之有彈力，導電之電線之一端接至第二導 電表面’及另一端接至第二電氣引線； -12- 本紙張从適财g國家標準（CNS ) (請先閲讀背面之注意事項再橡寫本頁) -裝 訂 經濟部智慧財產局員工消費合作社印製 4 23131 A8 B8 CS D8 六、申請專利範圍 第一及第二多數之電線將凸緣固定至散熱片爲可 移動者。 _ι 5. 如申請專利範圍第4項之電^合，其中與一第一及第 二導電表面包含一單一層pc_ 6. 如申請專利範圍第4项之電合，其中安裝凸緣相對 於散熱片爲側向可移動者。 3/ W (請先閱讀背面之注意事項再填寫本頁) -裝 訂 經濟部智慧財產局員工消費合作社印製 -13- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）
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KR20010074468A (ko) 2001-08-04
JP2002510880A (ja) 2002-04-09
CN1299520A (zh) 2001-06-13
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US5933327A (en) 1999-08-03
EP1068639A1 (en) 2001-01-17
WO1999052147A1 (en) 1999-10-14

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