CN1299520A - 集成电路组件丝焊安装至散热器的技术 - Google Patents

集成电路组件丝焊安装至散热器的技术 Download PDF

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CN1299520A
CN1299520A CN99804454A CN99804454A CN1299520A CN 1299520 A CN1299520 A CN 1299520A CN 99804454 A CN99804454 A CN 99804454A CN 99804454 A CN99804454 A CN 99804454A CN 1299520 A CN1299520 A CN 1299520A
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radiator
assembly
mounting flange
package
wire
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L·C·莱顿
T·W·莫勒尔
B·阿尔
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Ericsson Inc
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Abstract

IC组件的导热的安装凸缘直接设置在散热器表面上,处于附着至散热器的单层PC板的相应部分之间,使得从组件的两侧延伸出来的引线位于相应的相邻PC板部分上形成的对应导电区域上。通过一根或多根可变形的焊丝,相应组件引线各自连接至对应PC板区域。除了将组件引线电连接至相应PC板部分之外,焊丝共同地固定组件到散热器上,允许在各凸缘与散热器表面之间响应于热应力而发生横向移动。

Description

集成电路组件丝焊安装至散热器的技术
本发明涉及集成电路组件的领域，更具体地说涉及将集成电路组件固定在散热器上的安装技术。
集成电路(IC)在从通信到消费电子的工业领域中广泛使用。例如，在通常称作晶体管基片(chip)的硅片上制造一个或多个晶体管单元来做成功率晶体管IC。该晶体管基片附着在绝缘层上，绝缘层一般是导热但不导电的陶瓷衬底。陶瓷衬底本身安装在一个导热的安装凸缘上。覆盖该衬底和晶体管基片的保护外壳固定在凸缘上，从而构成了功率晶体管IC“组件”。
为了连接晶体管基片的公共端子到例如相邻的印刷电路(PC)板上的其它的电路元件，各种导电(例如薄的金属)引线可以固定在该组件上并从该组件里引出来。例如，对于双极性结型功率晶体管，固定在组件上的各个导电引线分别地连接到晶体管基片上的基极、发射极和集电极。
由于功率晶体管组件在工作时产生大量的热量，组件的安装凸缘的底表面一般直接固定在PC板下面的金属散热器上。例如，单层PC板在顶和底导电表面间有非导电的介质材料，其中底表面用作参考地(电平)。这个底表面通常用螺钉或焊料连接到下面的金属散热器上，以使底表面和散热器相对于安装在PC板顶表面的任何电路元件具有相同的地电位。
有一些固定IC组件至散热器上的公知技术。例如，如图1所示，一个典型的IC组件20可以通过组件安装凸缘26的底表面和散热器22的表面间的焊接部分28，固定到散热器22上。
尽管这种方法较简单，但与相应的(通常为金属的)安装凸缘26和散热器22相比，焊接材料28总是具有不同的热膨胀系数。结果，由于相应层间的热膨胀应力，具体地说，当IC组件20每次使用期间经受温度的重复变化时，安装凸缘26和散热器22间的结合将变脆弱，或者甚至受到破坏。另外，中间焊接材料层28的存在可能影响凸缘26和散热器22间的导热效率。这种方法还有另外一个缺点，即，为了修理或更换而拆卸IC组件20时，整个散热器22必须加热至使焊接部分28破裂，从而使得在同一散热器22上的任何其它的焊接变弱。
参考图2，作为焊接的一种变换方式，IC组件20可以采用通过位于安装凸缘26各端的开孔的一对螺钉24固定到散热器22上。参考图3和图4，固定IC组件到散热器上的另一种技术是，将一个或多个螺钉30插入散热器22的表面。弹生的金属条32从螺钉30处延伸，使其成形能够将一个夹持力加到IC组件20的外壳上，由此配置一个大致居中的力，这个力使安装凸缘26固定在散热器22上。
还有申请号为S/N 08/956193、名称为“固定集成电路组件到散热器上的安装结构”的待审美国专利申请公开了将集成电路组件固定在散热器上的另一种方法，其中给出的全部教导均在此引作参考。正如其中所揭示的和在图5中所示出的，IC元件组件40的保护壳50的上表面52设有一个中心凸起54。形成为条形并具有从曲线底面60延伸的相对端56和58的弹生固位弹簧46设有一个开口62，其尺寸适合与中心凸起54配合。
为了将IC组件40安装在散热器42上，当IC组件40的安装凸缘45插入从散热器42凸起的基本平行的壁44和48之间时，固位弹簧开口62与组件外壳凸起54压配合，这样，相对的固位弹簧端56和58基本相同地从组件外壳50向远处延伸，不过是以相反的角度。壁44和48彼此的距离正好使得当凸缘45插入并顶在散热器42上时，相对的固位弹簧端56和58产生彼此间适度的压缩。
壁44和48每个上都有多个凹槽64和68，它们以“棘轮式”浮雕图形方式基本平行于散热器42延伸。一旦安装凸缘45压在散热器42上，相对的弹簧端56和58就由相应壁凹槽64和68固位。用这种方式，弹簧46向组件外壳50施加固位力，从而将安装凸缘45固定在散热器42上，如图中箭头70所示。
用上面描绘的任何一种固定IC组件至散热器上的方法，一旦IC组件固定在散热器上，从组件延伸出来的电引线(图1-5中未示出)就必须连接到相应导电表面引线或区域，例如位于安装至散热器的相邻PC板上的引线或区域。
参照图6，通过常规的焊接部分84，IC组件80的安装凸缘86装在散热器82上。单层PC板88还固定在散热器82上，例如通过邻近组件80的两侧的螺钉(未示出)。PC板包括金属顶表面90、介质材料层92和金属底表面94，其中，对于焊接在PC板88的顶表面的电路元件(未示出)而言，底表面94和附着的散热器82共同起到参考地的作用。从组件80的相对两侧延伸的引线96和98通过相应焊接部分100和102连接到PC板88的顶表面90上形成的对应导电路径。
至于上面结合图1描述的在相应组件凸缘(28)和散热器(22)之间使用焊接连接所存在的问题，由于焊接材料、导电表面90和各(金属)引线间的不同的热膨胀系数，焊接部分100和102容易出现问题。尤其是，在重复加热和冷却以后，焊接材料可以结晶，使得焊接部分100和102变脆和/或失效，导致各引线96和98抬起并与PC板88的表面90分离。
因此，希望提供改进的结构来固定IC元件组件至散热器，由此免除焊接。
本发明提供了一种固定IC组件到散热器上的改进结构，该结构提供了将从组件延伸出来的引线到位于相邻的PC板表面上的相应导电路径的非焊接连接。
在优选实施例中，IC组件的导热的安装凸缘直接设置在附着至散热器的单层PC板的各部分之间的散热器表面上，从而从组件的相对两侧面延伸出来的电引线放置在位于各相邻PC板部分的表面上形成的导电区域的上面。根据本发明的第一方面，各组件引线用一个或多根可变形的焊丝连接到对应的PC板区域。除了将组件引线电连接到相应的PC板部分外，焊丝共同地将组件按这样的方式固定在散热器上：允许在各凸缘与散热器表面之间响应于热应力而发生横向移动。
正如对于本领域的普通技术人员能清楚理解的，后面将呈现其它的和进一步的目的和优点。
附图示出了本发明的设计和应用，为了便于图示，不同的实施例中的类似元件用相同的参考数字表示，其中：
图1是第一种现有技术安装结构的侧视图，其中IC组件用焊接或其它的方法连接到散热器上；
图2是第二种现有技术安装结构的部分剖开的侧视图，其中用安装螺钉直接将IC组件连接到散热器上；
图3是第三种现有技术安装结构的侧视图，其中单个固位螺钉和从其延伸的固位条用来固定IC组件到散热器上；
图4是第四种现有技术安装方案的侧视图，其中一对固位螺钉和从其延伸的固位条用来固定IC组件到散热器上；
图5是安装IC组件到散热器上的又一种结构的部分剖开的侧视图，其中一个弹生的带状固位弹簧固定在组件的保护壳的中心并且由一对从散热器凸出的相对壁保持就位；
图6是焊接到散热器上的IC组件的部分剖开的侧视图，其中，相邻PC板上的导电表面引线通过现有技术的焊接连接方式连接至从组件延伸出来的各引线；
图7是一种优选的功率晶体管组件的顶视图，它是通过多根可变形的焊丝连接从组件延伸出来的各引线到附着至散热器的相邻PC板部分的导电区域，而连接到散热器上的；
图8是图7所示结构的部分剖开的侧视图。
参照图7，功率晶体管组件110放置在散热器112上，处于附着至散热器112上的单层PC板的第一部分和第二部分113和114之间。该晶体管组件110包括附着在一侧130上的第一组多根引线117、119和121，以及附着到第二侧132上的第二组多根引线137、139和141。具体地说，该组件10如此安置在散热器112上：第一侧130上的电引线117、119和121在第一PC板部分113的表面上形成的对应导电区域116、118和120的上面延伸，而相反侧132上的电引线137、139和141在第二PC板部分114的表面上形成的导电区域136、138和140的上面延伸。
在优选实施例中，导电区域116、118、120、136、138和140是这样形成的：通过选择地除去第一和第二PC板部分113和114的导电的(即金属的)顶表面的部分，从而暴露下面的介质材料115。介质材料115的暴露区域起到限定各个导电区域116、118、120、136、138和140的非导电边界的作用。
晶体管组件引线117、119、121、137、139和141，通过多根相应的弹性导电焊丝122、124、126、142、144和146连接到对应的导电的PC板区域116、118、120、136、138和140。焊丝122、124、126、142、144和146最好是由适合的材料，例如铝、金或铝合金制成的，它们将组件引线117、119、121、137、139和141电连接到相应的导电PC板区域116、118、120、136、138和140，同时共同地固定组件110到散热器112上。
更具体地说，相应的多根焊丝122、124、126、142、144和146在一端焊接到相应的导电PC板区域116、118、120、136、138和140，而在另一端焊接在相应组件引线117、119、121、137、139和141上。各焊丝优选通过常规的方法连接到相应的导电区域和组件引线，常规方法例如公知的超声丝焊技术。
从图8可以清楚地看到，按箭头150所指的方向，金属丝的弹性提供了对相应组件引线的作用力，从而将晶体管组件110下面的安装凸缘152直接压在散热器112上。由于组件凸缘152没有固定位置，所示的安装结构允许组件110相对于散热器112横向移动，如箭头128所示，从而避免了否则可能产生的任何热应力。另外，使用焊丝将组件引线117、119、121、137、139和141连接到相应PC板导电区域116、118、120、136、138和140上的至少一个优点是不需要焊接。
因此，优选实施例已经披露了将IC组件固定在散热器上的改进安装结构。尽管已经图示和描述了本发明的的实施例和应用，但本领域的普通技术人员将能理解，在不脱离本发明的构思的情况下，可能有很多改进和应用。
因此，本发明的范围仅由所附权利要求的实质内容限制。

Claims (6)

1．一种电组合件，包括：
一个集成电路组件，它包括安装凸缘和电引线，电引线固定在组件上并从组件延伸出去；
一个散热器，安装凸缘直接接触该散热器；
一个导电表面，它附着在散热器上邻近集成电路组件；和
多根弹性的导电的金属丝，它们在一端连接到导电表面，在另一端连接至电引线，金属丝固定安装凸缘到散热器上。
2．根据权利要求1的电组合件，其中，导电表面包括单层PC板。
3．根据权利要求1的电组合件，其中，安装凸缘相对于散热器可以横向移动。
4．一种电路组合件，包括：
一个集成电路组件，它包括：
一个安装凸缘，
连接到该组件第—侧和从该第一侧延伸出来的第一电引线，和
连接到该组件第二侧和从该第二侧延伸出来的第二电引线；一个散热器，安装凸缘直接与该散热器接触；第一导电表面，它附着在散热器上，邻近组件第—侧；第二导电表面，它附着在散热器上，邻近组件第二侧；
第一组多根弹性的导电的金属丝，它们在一端连接至第一导电表面，在另一端连接至第一电引线；和
第二组多根弹性的导电的金属丝，它们在—端连接至第二导电表面，在另一端连接至第二电引线；
第一组和第二组多根金属丝可移动地将安装凸缘固定在散热器上。
5．根据权利要求4的电组合件，其中，第一和第二导电表面各自包括一单层PC板。
6．根据权利要求4的电组合件，其中，安装凸缘相对于散热器可横向移动。
CN99804454A 1998-04-03 1999-03-29 集成电路组件丝焊安装至散热器的技术 Pending CN1299520A (zh)

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