TW368747B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TW368747B TW368747B TW086106943A TW86106943A TW368747B TW 368747 B TW368747 B TW 368747B TW 086106943 A TW086106943 A TW 086106943A TW 86106943 A TW86106943 A TW 86106943A TW 368747 B TW368747 B TW 368747B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit
- voltage
- drop
- semiconductor device
- active
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8347664A JPH10189877A (ja) | 1996-12-26 | 1996-12-26 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW368747B true TW368747B (en) | 1999-09-01 |
Family
ID=18391756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086106943A TW368747B (en) | 1996-12-26 | 1997-05-23 | Semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (1) | US5862096A (zh) |
JP (1) | JPH10189877A (zh) |
KR (1) | KR100276399B1 (zh) |
CN (2) | CN1267994C (zh) |
TW (1) | TW368747B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI567903B (zh) * | 2014-03-13 | 2017-01-21 | 東芝股份有限公司 | 半導體裝置 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3199987B2 (ja) | 1995-08-31 | 2001-08-20 | 株式会社東芝 | 半導体集積回路装置およびその動作検証方法 |
JP3421530B2 (ja) * | 1997-04-11 | 2003-06-30 | 東芝マイクロエレクトロニクス株式会社 | 半導体記憶装置 |
JPH11203862A (ja) * | 1998-01-13 | 1999-07-30 | Mitsubishi Electric Corp | 半導体記憶装置 |
KR20000032290A (ko) * | 1998-11-13 | 2000-06-15 | 윤종용 | 멀티-뱅크 구조를 가지는 반도체 메모리 장치 |
JP4963144B2 (ja) * | 2000-06-22 | 2012-06-27 | ルネサスエレクトロニクス株式会社 | 半導体集積回路 |
US6661279B2 (en) | 2001-04-11 | 2003-12-09 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit which outputs first internal power supply voltage and second internal power supply voltage lower than first internal supply power voltage |
JP4790158B2 (ja) * | 2001-06-11 | 2011-10-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR100399437B1 (ko) | 2001-06-29 | 2003-09-29 | 주식회사 하이닉스반도체 | 내부 전원전압 발생장치 |
JP2003100075A (ja) * | 2001-09-25 | 2003-04-04 | Mitsubishi Electric Corp | 半導体記憶装置 |
US6677804B2 (en) * | 2002-02-11 | 2004-01-13 | Micron Technology, Inc. | Dual bandgap voltage reference system and method for reducing current consumption during a standby mode of operation and for providing reference stability during an active mode of operation |
JP2003264256A (ja) * | 2002-03-08 | 2003-09-19 | Hitachi Ltd | 半導体装置 |
EP1398793B1 (fr) * | 2002-09-06 | 2014-05-21 | CSEM Centre Suisse d'Electronique et de Microtechnique S.A. - Recherche et Développement | Circuit intégré numérique réalisé en technologie MOS |
JP2004133800A (ja) * | 2002-10-11 | 2004-04-30 | Renesas Technology Corp | 半導体集積回路装置 |
JP4070654B2 (ja) * | 2003-04-04 | 2008-04-02 | ローム株式会社 | 半導体集積回路装置 |
KR100558475B1 (ko) * | 2003-04-16 | 2006-03-07 | 삼성전자주식회사 | 반도체 메모리 장치 및 이 장치의 배치 방법 |
US7227804B1 (en) * | 2004-04-19 | 2007-06-05 | Cypress Semiconductor Corporation | Current source architecture for memory device standby current reduction |
JP4703133B2 (ja) * | 2004-05-25 | 2011-06-15 | ルネサスエレクトロニクス株式会社 | 内部電圧発生回路および半導体集積回路装置 |
JP4488800B2 (ja) * | 2004-06-14 | 2010-06-23 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
KR100729356B1 (ko) | 2005-08-23 | 2007-06-15 | 삼성전자주식회사 | 플래시 메모리 장치의 레이아웃 구조 |
KR100735010B1 (ko) * | 2005-09-08 | 2007-07-03 | 삼성전자주식회사 | 플래시 메모리 장치 및 그것을 위한 전압 발생회로 |
KR100715147B1 (ko) | 2005-10-06 | 2007-05-10 | 삼성전자주식회사 | 전류소모를 감소시키는 내부전원전압 발생회로를 가지는멀티칩 반도체 메모리 장치 |
KR100802073B1 (ko) * | 2006-05-31 | 2008-02-12 | 주식회사 하이닉스반도체 | 반도체메모리소자의 내부전압 공급장치 |
JP2008159128A (ja) * | 2006-12-22 | 2008-07-10 | Elpida Memory Inc | 半導体記憶装置 |
JP2008159145A (ja) * | 2006-12-22 | 2008-07-10 | Elpida Memory Inc | 半導体記憶装置 |
CN101950520B (zh) * | 2010-08-25 | 2012-12-26 | 友达光电股份有限公司 | 电平移位器、时钟输出信号的产生方法及其平面显示装置 |
TWI405407B (zh) * | 2010-12-06 | 2013-08-11 | Novatek Microelectronics Corp | 電流驅動器、電子裝置及電流驅動方法 |
US8811075B2 (en) * | 2012-01-06 | 2014-08-19 | Sandisk Technologies Inc. | Charge cycling by equalizing and regulating the source, well, and bit line levels during write operations for NAND flash memory: verify to program transition |
KR102113717B1 (ko) * | 2013-12-30 | 2020-05-21 | 에스케이하이닉스 주식회사 | 반도체 장치 |
CN107633866A (zh) * | 2017-10-20 | 2018-01-26 | 上海华力微电子有限公司 | 一种半导体器件的电编程熔丝结构 |
US10910358B2 (en) * | 2019-01-30 | 2021-02-02 | Micron Technology, Inc. | Integrated assemblies having capacitive units, and having resistive structures coupled with the capacitive units |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4028415A1 (de) * | 1990-09-07 | 1992-03-12 | Jacobs Suchard Ag | Verfahren zur verbesserung von kaffee-sekundaerextrakten bei der herstellung von loeslichem kaffee |
JP3057100B2 (ja) * | 1991-02-12 | 2000-06-26 | 株式会社日立製作所 | 半導体集積回路装置 |
JP3085782B2 (ja) * | 1992-05-29 | 2000-09-11 | 株式会社東芝 | 半導体記憶装置 |
US5325336A (en) * | 1992-09-10 | 1994-06-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device having power line arranged in a meshed shape |
JP3705842B2 (ja) * | 1994-08-04 | 2005-10-12 | 株式会社ルネサステクノロジ | 半導体装置 |
JP3583482B2 (ja) * | 1994-10-04 | 2004-11-04 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
JP3574506B2 (ja) * | 1995-06-13 | 2004-10-06 | 松下電器産業株式会社 | 半導体記憶装置 |
-
1996
- 1996-12-26 JP JP8347664A patent/JPH10189877A/ja active Pending
-
1997
- 1997-05-23 TW TW086106943A patent/TW368747B/zh active
- 1997-07-03 KR KR1019970030868A patent/KR100276399B1/ko not_active IP Right Cessation
- 1997-08-01 US US08/904,592 patent/US5862096A/en not_active Expired - Fee Related
- 1997-09-04 CN CNB02107979XA patent/CN1267994C/zh not_active Expired - Fee Related
- 1997-09-04 CN CN97118410A patent/CN1104052C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI567903B (zh) * | 2014-03-13 | 2017-01-21 | 東芝股份有限公司 | 半導體裝置 |
Also Published As
Publication number | Publication date |
---|---|
KR19980063362A (ko) | 1998-10-07 |
JPH10189877A (ja) | 1998-07-21 |
KR100276399B1 (ko) | 2000-12-15 |
CN1186344A (zh) | 1998-07-01 |
CN1492507A (zh) | 2004-04-28 |
US5862096A (en) | 1999-01-19 |
CN1104052C (zh) | 2003-03-26 |
CN1267994C (zh) | 2006-08-02 |
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