TW364153B - Structure of jointing metal element and ceramic element and method thereof - Google Patents

Structure of jointing metal element and ceramic element and method thereof

Info

Publication number
TW364153B
TW364153B TW087101133A TW87101133A TW364153B TW 364153 B TW364153 B TW 364153B TW 087101133 A TW087101133 A TW 087101133A TW 87101133 A TW87101133 A TW 87101133A TW 364153 B TW364153 B TW 364153B
Authority
TW
Taiwan
Prior art keywords
metal element
jointing metal
ceramic
ceramic element
jointing
Prior art date
Application number
TW087101133A
Other languages
English (en)
Inventor
Ryusuke Ushikoshi
Hideyoshi Tsuruta
Tomoyuki Fujii
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Application granted granted Critical
Publication of TW364153B publication Critical patent/TW364153B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Resistance Heating (AREA)
TW087101133A 1997-01-29 1998-01-26 Structure of jointing metal element and ceramic element and method thereof TW364153B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1538497 1997-01-29
JP32257097A JP3954177B2 (ja) 1997-01-29 1997-11-25 金属部材とセラミックス部材との接合構造およびその製造方法

Publications (1)

Publication Number Publication Date
TW364153B true TW364153B (en) 1999-07-11

Family

ID=26351515

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087101133A TW364153B (en) 1997-01-29 1998-01-26 Structure of jointing metal element and ceramic element and method thereof

Country Status (6)

Country Link
US (1) US6057513A (zh)
EP (1) EP0856881B1 (zh)
JP (1) JP3954177B2 (zh)
KR (2) KR100333785B1 (zh)
DE (1) DE69834002T2 (zh)
TW (1) TW364153B (zh)

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JP5104687B2 (ja) * 2008-09-19 2012-12-19 日本電気株式会社 接合シート及び電子回路装置並びに製造方法
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WO2014179811A1 (en) 2013-05-03 2014-11-06 Alfred E. Mann Foundation For Scientific Research Multi-branch stimulation electrode for subcutaneous field stimulation
WO2014179813A1 (en) 2013-05-03 2014-11-06 Alfred E. Mann Foundtion For Scientific Research Implant recharger handshaking system and method
US9780596B2 (en) 2013-07-29 2017-10-03 Alfred E. Mann Foundation For Scientific Research Microprocessor controlled class E driver
US20150028805A1 (en) 2013-07-29 2015-01-29 Alfred E. Mann Foundation For Scientific Research Implant charging field control through radio link
JP6503351B2 (ja) 2013-07-29 2019-04-17 アルフレッド イー． マン ファウンデーション フォー サイエンティフィック リサーチ 埋め込み可能なデバイス用の高効率磁気リンク
WO2015146563A1 (ja) * 2014-03-27 2015-10-01 日本碍子株式会社 セラミックスプレートと金属製の円筒部材との接合構造
US9855423B2 (en) 2014-08-15 2018-01-02 Axonics Modulation Technologies, Inc. Systems and methods for neurostimulation electrode configurations based on neural localization
US9555246B2 (en) 2014-08-15 2017-01-31 Axonics Modulation Technologies, Inc. Electromyographic lead positioning and stimulation titration in a nerve stimulation system for treatment of overactive bladder
CA2958210C (en) 2014-08-15 2023-09-26 Axonics Modulation Technologies, Inc. Integrated electromyographic clinician programmer for use with an implantable neurostimulator
CA2958197C (en) 2014-08-15 2023-09-26 Axonics Modulation Technologies, Inc. External pulse generator device and associated methods for trial nerve stimulation
CN106659882A (zh) 2014-08-15 2017-05-10 艾克索尼克斯调制技术股份有限公司 用于进行神经刺激以减轻膀胱功能障碍和其他适应症的可植入引线附着结构
US10682521B2 (en) 2014-08-15 2020-06-16 Axonics Modulation Technologies, Inc. Attachment devices and associated methods of use with a nerve stimulation charging device
JP6356598B2 (ja) * 2014-12-25 2018-07-11 京セラ株式会社 半導体製造装置用部品
EP3242721B1 (en) 2015-01-09 2019-09-18 Axonics Modulation Technologies, Inc. Attachment devices and associated methods of use with a nerve stimulation charging device
EP3242712B1 (en) 2015-01-09 2019-04-10 Axonics Modulation Technologies, Inc. Patient remote and associated methods of use with a nerve stimulation system
EP3242718B1 (en) 2015-01-09 2019-05-08 Axonics Modulation Technologies, Inc. Improved antenna and methods of use for an implantable nerve stimulator
WO2017011305A1 (en) 2015-07-10 2017-01-19 Axonics Modulation Technologies, Inc. Implantable nerve stimulator having internal electronics without asic and methods of use
JP6497248B2 (ja) 2015-07-13 2019-04-10 住友電気工業株式会社 ウェハ保持体
US10195423B2 (en) 2016-01-19 2019-02-05 Axonics Modulation Technologies, Inc. Multichannel clip device and methods of use
US9517338B1 (en) 2016-01-19 2016-12-13 Axonics Modulation Technologies, Inc. Multichannel clip device and methods of use
CA3012828C (en) 2016-01-29 2024-04-30 Axonics Modulation Technologies, Inc. Methods and systems for frequency adjustment to optimize charging of implantable neurostimulator
US10376704B2 (en) 2016-02-12 2019-08-13 Axonics Modulation Technologies, Inc. External pulse generator device and associated methods for trial nerve stimulation
KR101904275B1 (ko) * 2016-06-09 2018-10-05 (주)티티에스 기판지지장치의 처리방법
JP6693832B2 (ja) * 2016-07-29 2020-05-13 日本特殊陶業株式会社 セラミックス部材
KR102356748B1 (ko) * 2017-10-30 2022-01-27 니뽄 도쿠슈 도교 가부시키가이샤 전극 매설 부재
JP2021513902A (ja) 2018-02-22 2021-06-03 アクソニクス モジュレーション テクノロジーズ インコーポレイテッド 試験的神経刺激のための神経刺激リードおよび使用方法
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Also Published As

Publication number Publication date
KR19980070933A (ko) 1998-10-26
KR100333785B1 (ko) 2002-06-20
EP0856881A3 (en) 1999-10-27
EP0856881B1 (en) 2006-03-29
DE69834002D1 (de) 2006-05-18
KR20060086492A (ko) 2006-08-01
JPH10273371A (ja) 1998-10-13
EP0856881A2 (en) 1998-08-05
JP3954177B2 (ja) 2007-08-08
US6057513A (en) 2000-05-02
DE69834002T2 (de) 2006-11-16

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