TW359852B - Apparatus for measuring an aerial image using transmitted light and reflected light - Google Patents

Apparatus for measuring an aerial image using transmitted light and reflected light

Info

Publication number
TW359852B
TW359852B TW086107831A TW86107831A TW359852B TW 359852 B TW359852 B TW 359852B TW 086107831 A TW086107831 A TW 086107831A TW 86107831 A TW86107831 A TW 86107831A TW 359852 B TW359852 B TW 359852B
Authority
TW
Taiwan
Prior art keywords
aerial image
light
measuring
reflected light
photomask
Prior art date
Application number
TW086107831A
Other languages
English (en)
Inventor
Jin-Houg Park
Young-Hun Yu
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW359852B publication Critical patent/TW359852B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
TW086107831A 1996-10-10 1997-06-06 Apparatus for measuring an aerial image using transmitted light and reflected light TW359852B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960045127A KR100200734B1 (ko) 1996-10-10 1996-10-10 에어리얼 이미지 측정 장치 및 방법

Publications (1)

Publication Number Publication Date
TW359852B true TW359852B (en) 1999-06-01

Family

ID=19476992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086107831A TW359852B (en) 1996-10-10 1997-06-06 Apparatus for measuring an aerial image using transmitted light and reflected light

Country Status (4)

Country Link
US (1) US6184976B1 (zh)
JP (1) JPH10123062A (zh)
KR (1) KR100200734B1 (zh)
TW (1) TW359852B (zh)

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US7379175B1 (en) 2002-10-15 2008-05-27 Kla-Tencor Technologies Corp. Methods and systems for reticle inspection and defect review using aerial imaging
US7027143B1 (en) * 2002-10-15 2006-04-11 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths
US7123356B1 (en) 2002-10-15 2006-10-17 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging and die-to-database detection
KR101056142B1 (ko) * 2004-01-29 2011-08-10 케이엘에이-텐코 코포레이션 레티클 설계 데이터의 결함을 검출하기 위한 컴퓨터로구현되는 방법
JP4596801B2 (ja) * 2004-03-22 2010-12-15 株式会社東芝 マスク欠陥検査装置
JP4904034B2 (ja) * 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
DE102005032601A1 (de) * 2005-01-07 2006-07-20 Heidelberger Druckmaschinen Ag Druckmaschine
US7769225B2 (en) 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
WO2008071324A1 (en) * 2006-12-15 2008-06-19 Carl Zeiss Sms Gmbh Apparatus for measurement of structures on photolithographic masks
US7877722B2 (en) 2006-12-19 2011-01-25 Kla-Tencor Corp. Systems and methods for creating inspection recipes
WO2008086282A2 (en) * 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US7738093B2 (en) 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US8213704B2 (en) * 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
JP5489002B2 (ja) * 2007-07-12 2014-05-14 カール ゼイス エスエムエス リミテッド Ｄｕｖ透過マッピングのための方法と装置
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
KR101448971B1 (ko) * 2007-08-20 2014-10-13 케이엘에이-텐코어 코오포레이션 실제 결함들이 잠재적으로 조직적인 결함들인지 또는 잠재적으로 랜덤인 결함들인지를 결정하기 위한 컴퓨터-구현 방법들
US8139844B2 (en) * 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101623747B1 (ko) 2008-07-28 2016-05-26 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
BR112015019969B1 (pt) 2013-03-15 2021-01-05 Iris International, Inc. método para a obtenção de imagens de partículas usando um sistema de análise de partículas configurado para focalização hidrodinâmica combinada da viscosidade e da geometria, e sistema de análise de partículas que realiza focalização hidrodinâmica combinada da viscosidade e da geometria para partículas de imagem em uma amostra de sangue
BR112015021902B1 (pt) 2013-03-15 2021-06-15 Iris International, Inc Líquido para alinhamento de partícula e organela intracelular
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
CN109781033B (zh) * 2019-03-04 2020-11-06 杭州晶耐科光电技术有限公司 一种透明材质三维轮廓重构的深紫外结构光精密检测装置

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US5235400A (en) * 1988-10-12 1993-08-10 Hitachi, Ltd. Method of and apparatus for detecting defect on photomask
JP2796316B2 (ja) * 1988-10-24 1998-09-10 株式会社日立製作所 欠陥または異物の検査方法およびその装置
US5563702A (en) * 1991-08-22 1996-10-08 Kla Instruments Corporation Automated photomask inspection apparatus and method
IL118872A (en) * 1996-07-16 2000-06-01 Orbot Instr Ltd Optical inspection method and apparatus

Also Published As

Publication number Publication date
US6184976B1 (en) 2001-02-06
KR100200734B1 (ko) 1999-06-15
JPH10123062A (ja) 1998-05-15
KR19980026620A (ko) 1998-07-15

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MM4A Annulment or lapse of patent due to non-payment of fees