TW346428B - Retainer apparatus for polishing a workpiece - Google Patents

Retainer apparatus for polishing a workpiece

Info

Publication number
TW346428B
TW346428B TW085111377A TW85111377A TW346428B TW 346428 B TW346428 B TW 346428B TW 085111377 A TW085111377 A TW 085111377A TW 85111377 A TW85111377 A TW 85111377A TW 346428 B TW346428 B TW 346428B
Authority
TW
Taiwan
Prior art keywords
workpiece
polishing
recesses
opening
pressure plate
Prior art date
Application number
TW085111377A
Other languages
English (en)
Inventor
Kim Inki
Original Assignee
Speedfam Corporpration
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corporpration filed Critical Speedfam Corporpration
Application granted granted Critical
Publication of TW346428B publication Critical patent/TW346428B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW085111377A 1996-04-19 1996-09-17 Retainer apparatus for polishing a workpiece TW346428B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/635,020 US5695392A (en) 1995-08-09 1996-04-19 Polishing device with improved handling of fluid polishing media

Publications (1)

Publication Number Publication Date
TW346428B true TW346428B (en) 1998-12-01

Family

ID=24546103

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085111377A TW346428B (en) 1996-04-19 1996-09-17 Retainer apparatus for polishing a workpiece

Country Status (7)

Country Link
US (1) US5695392A (zh)
JP (1) JPH1034530A (zh)
KR (1) KR970072155A (zh)
DE (1) DE19715460C2 (zh)
GB (1) GB2312181B (zh)
SG (1) SG65646A1 (zh)
TW (1) TW346428B (zh)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
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JP3106418B2 (ja) * 1996-07-30 2000-11-06 株式会社東京精密 研磨装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6139428A (en) * 1996-12-17 2000-10-31 Vsli Technology, Inc. Conditioning ring for use in a chemical mechanical polishing machine
GB2344302B (en) * 1997-09-01 2002-11-06 United Microelectronics Corp Chemical-mechanical polishing machine and retainer ring thereof
DE19839086B4 (de) * 1997-09-01 2007-03-15 United Microelectronics Corp. Rückhaltering für eine chemisch-mechanische Poliervorrichtung und chemisch-mechanische Poliervorrichtung damit
US5944593A (en) * 1997-09-01 1999-08-31 United Microelectronics Corp. Retainer ring for polishing head of chemical-mechanical polish machines
US6062963A (en) * 1997-12-01 2000-05-16 United Microelectronics Corp. Retainer ring design for polishing head of chemical-mechanical polishing machine
US6241582B1 (en) * 1997-09-01 2001-06-05 United Microelectronics Corp. Chemical mechanical polish machines and fabrication process using the same
KR19990030719A (ko) * 1997-10-04 1999-05-06 로버트 에이치. 씨. 챠오 씨엠피 장비의 폴리싱 헤드용 리테이너 링
US5967885A (en) * 1997-12-01 1999-10-19 Lucent Technologies Inc. Method of manufacturing an integrated circuit using chemical mechanical polishing
EP0923122B1 (en) * 1997-12-01 2011-09-07 Lucent Technologies Inc. Method of manufacturing an integrated circuit using chemical mechanical polishing and fixture for chemical mechanical polishing
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6251215B1 (en) 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6146260A (en) * 1998-08-03 2000-11-14 Promos Technology, Inc. Polishing machine
KR100542723B1 (ko) * 1998-09-03 2006-04-06 삼성전자주식회사 반도체장치 제조용 씨엠피설비의 연마헤드
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
US6136710A (en) * 1998-10-19 2000-10-24 Chartered Semiconductor Manufacturing, Ltd. Chemical mechanical polishing apparatus with improved substrate carrier head and method of use
US6089961A (en) * 1998-12-07 2000-07-18 Speedfam-Ipec Corporation Wafer polishing carrier and ring extension therefor
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6281128B1 (en) * 1999-06-14 2001-08-28 Agere Systems Guardian Corp. Wafer carrier modification for reduced extraction force
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US6602114B1 (en) 2000-05-19 2003-08-05 Applied Materials Inc. Multilayer retaining ring for chemical mechanical polishing
US6447380B1 (en) * 2000-06-30 2002-09-10 Lam Research Corporation Polishing apparatus and substrate retainer ring providing continuous slurry distribution
EP2085181A1 (en) * 2000-07-31 2009-08-05 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
US6419567B1 (en) * 2000-08-14 2002-07-16 Semiconductor 300 Gmbh & Co. Kg Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US6848980B2 (en) 2001-10-10 2005-02-01 Applied Materials, Inc. Vibration damping in a carrier head
US6676497B1 (en) 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US6776695B2 (en) * 2000-12-21 2004-08-17 Lam Research Corporation Platen design for improving edge performance in CMP applications
US6722942B1 (en) 2001-05-21 2004-04-20 Advanced Micro Devices, Inc. Chemical mechanical polishing with electrochemical control
US6758939B2 (en) * 2001-08-31 2004-07-06 Speedfam-Ipec Corporation Laminated wear ring
US20030070757A1 (en) * 2001-09-07 2003-04-17 Demeyer Dale E. Method and apparatus for two-part CMP retaining ring
US6835125B1 (en) 2001-12-27 2004-12-28 Applied Materials Inc. Retainer with a wear surface for chemical mechanical polishing
US6890249B1 (en) 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
JP2005515904A (ja) 2002-01-22 2005-06-02 マルチ プレイナー テクノロジーズ インコーポレイテッド スラリー分配のための形状付けされた表面を持つ保持リングを有する化学的機械研磨装置及び方法
US6739958B2 (en) 2002-03-19 2004-05-25 Applied Materials Inc. Carrier head with a vibration reduction feature for a chemical mechanical polishing system
US6689258B1 (en) 2002-04-30 2004-02-10 Advanced Micro Devices, Inc. Electrochemically generated reactants for chemical mechanical planarization
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
DE10247179A1 (de) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
DE10247180A1 (de) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
US20040259485A1 (en) * 2002-10-02 2004-12-23 Ensinger Kunstsofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
TWM255104U (en) * 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing
US6945845B2 (en) * 2003-03-04 2005-09-20 Applied Materials, Inc. Chemical mechanical polishing apparatus with non-conductive elements
DE10311830A1 (de) * 2003-03-14 2004-09-23 Ensinger Kunststofftechnologie Gbr Abstandhalterprofil für Isolierglasscheiben
US6974371B2 (en) * 2003-04-30 2005-12-13 Applied Materials, Inc. Two part retaining ring
US6979251B2 (en) * 2003-06-26 2005-12-27 Lsi Logic Corporation Method and apparatus to add slurry to a polishing system
JP2005034959A (ja) * 2003-07-16 2005-02-10 Ebara Corp 研磨装置及びリテーナリング
US6821192B1 (en) 2003-09-19 2004-11-23 Applied Materials, Inc. Retaining ring for use in chemical mechanical polishing
US20050113002A1 (en) * 2003-11-24 2005-05-26 Feng Chen CMP polishing heads retaining ring groove design for microscratch reduction
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
US7048621B2 (en) * 2004-10-27 2006-05-23 Applied Materials Inc. Retaining ring deflection control
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
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US20080171494A1 (en) * 2006-08-18 2008-07-17 Applied Materials, Inc. Apparatus and method for slurry distribution
KR100826590B1 (ko) 2006-11-22 2008-04-30 주식회사 실트론 화학적 기계적 연마장치
US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US8033895B2 (en) 2007-07-19 2011-10-11 Applied Materials, Inc. Retaining ring with shaped profile
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
JP5375895B2 (ja) * 2011-08-17 2013-12-25 旭硝子株式会社 研磨システム
KR101392401B1 (ko) * 2012-11-30 2014-05-07 이화다이아몬드공업 주식회사 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
US10046255B1 (en) * 2015-07-02 2018-08-14 James R. Walker Dual filter pump assembly
US9744640B2 (en) * 2015-10-16 2017-08-29 Applied Materials, Inc. Corrosion resistant retaining rings
JP7329438B2 (ja) * 2016-07-25 2023-08-18 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ用の保持リング
CN107650009B (zh) * 2017-11-20 2023-08-25 山东省科学院新材料研究所 一种新型晶片研磨抛光机

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Also Published As

Publication number Publication date
JPH1034530A (ja) 1998-02-10
US5695392A (en) 1997-12-09
DE19715460A1 (de) 1997-10-30
DE19715460C2 (de) 2002-02-21
GB2312181A (en) 1997-10-22
GB9707727D0 (en) 1997-06-04
GB2312181B (en) 1999-09-29
KR970072155A (ko) 1997-11-07
SG65646A1 (en) 1999-06-22

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