KR970072155A - 유동 폴리싱 매체 처리 폴리싱 디바이스 - Google Patents

유동 폴리싱 매체 처리 폴리싱 디바이스 Download PDF

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Publication number
KR970072155A
KR970072155A KR1019970014630A KR19970014630A KR970072155A KR 970072155 A KR970072155 A KR 970072155A KR 1019970014630 A KR1019970014630 A KR 1019970014630A KR 19970014630 A KR19970014630 A KR 19970014630A KR 970072155 A KR970072155 A KR 970072155A
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South Korea
Prior art keywords
retainer
recess
retainer ring
reference line
radial reference
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KR1019970014630A
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English (en)
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김인기
Original Assignee
크리스토퍼 이이. 아우거
스피드팸 코포레이션
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Application filed by 크리스토퍼 이이. 아우거, 스피드팸 코포레이션 filed Critical 크리스토퍼 이이. 아우거
Publication of KR970072155A publication Critical patent/KR970072155A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

본원은 그 기계가공 동안에 얇은 워크피스를 보유하는 리테이너 링에 관한 것으로서, 상기 리테이너 링은 기계가공 작업에 사용되는 연마재 슬러리의 분배가 용이하도록 설계되어진다.

Description

유동 폴리싱 매체 처리 폴리싱 디바이스
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 리테이너 디바이스의 한 실시예의 평면도.

Claims (13)

  1. 위크 피스를 폴리싱하는 리테이너 장치에 있어서, 상기 리테이너 장치는; 폴리싱 표면에 대한 워크 피스를 폴리싱 하는데 하 방향 압력을 워크 피스에 적용하는 워크 피스 위에 압력 판 부분과; 상부 및 하부 표면, 실내 공동부(cavity)를 한정하도록 압력 판과 공동작하는 내 표면, 및 외표면을 가진 리테이너 부분과; 실내 공동부 내에 한 점(point)으로부터 방사되는 반경방향 기준 선과 부합하지 않는 리세스로서, 내 표면으로부터외 표면으로 연장되는 다수개의 리세스를 한정하는리테이너 부분의 하부 표면 및; 내 개구(opening)보다 크기가 크고, 외 표면에 외 개구와 내 표면에 예비설정된 크기의 내 개구를 가진 리세스를 포함하는 것을 특징으로 하는 리테이너 장치.
  2. 제1항에 있어서, 상기 리세스는 반경 기준선으로부터 각도 옵셋되는 각각의 직선을 따라 연장되는 것을 특징으로 하는 리테이너 장치.
  3. 제2항에 있어서, 상기 직선은 반경 기준 선으로부터의 량과 유사한 각도 옵셋인 것을 특징으로 하는 리테이너 장치.
  4. 제1항에 있어서, 상기 리세스는 반경 기준 선으로부터 유사한 방향으로 옵셋되는 각각의 곡선진 선을 따라 연장되고, 여기서 리세스는 개별적으로 일정한 깊이를 갖는 것을 특징으로 하는 리테이너 장치.
  5. 제1항에 있어서, 상기 리세스는 그 내 개구에 샤프한 코너가 있고 직사각형 단면을 가지는 것을 특징으로 하는 리테이너 장치.
  6. 제1항에 있어서, 압력 판과 리테이너 부분은 분리 형성되고, 압력 판은 리테이너 부분의 실내 공동부내로 연장되는 것을 특징으로 하는 리테이너 장치.
  7. 제1항에 있어서, 압력 판과 리테이너 부분은 단일체 몸체를 포함하도록 일체 형성되는 것을 특징으로 하는 리테이너 장치.
  8. 워크 피스를 폴리싱하는 리테이너 링 장치에 있어서, 상기 리테이너 링 장치는; 상부 및 하부 표면, 리테이너 링의 상부 표면에 압력 판에 리테이너를 연결하는 장착 수단, 리테이너 링 내의 공동부(cavity)를 한정하는 내 표면 및, 외 표면을 가진 리테이너 링과; 실내 공동 내의 한 점(point)으로부터 방사되는 반경방향 기준 선과 부합하지 않는 리세스로서, 내 표면으로부터 외 표면으로 연장되는 다수개의 리세스를 한정하는 리테이너 링의 하부 표면 및; 내 개구(opening)보다 크기가 크고, 외 표면에 외 개구와 내 표면에 예비설정된 크기의 내 개구를 가진 리세스를 포함하는 것을 특징으로 하는 리테이너 링 장치.
  9. 제8항에 있어서, 상기 리세스는 반경 기준선으로부터 각도 옵셋되는 각각의 직선을 따라 연장되는 것을 특징으로 하는 리테이너 링 장치.
  10. 제9항에 있어서, 상기 직선은 반경 기준 선으로부터의 량과 유사한 각도 옵셋인 것을 특징으로 하는 리테이너 링 장치.
  11. 제8항에 있어서, 상기 리세스는 반경 기준 선으로부터 유사한 방향으로 옵셋되는 각각의 곡선진 선을 따라 연장되고, 여기서 리세스는 개별적으로 일정한 깊이를 갖는 것을 특징으로 하는 리테이너 링 장치.
  12. 제11항에 있어서, 상기 리세스는 동일 깊이를 갖는 것을 특징으로 하는 리테이너 링 장치.
  13. 제12항에 있어서, 상기 리세스는 직사각 단면을 가지고 그 내 개구에 샤프한 코너를 형성하는 것을 특징으로 하는 리테이너 링 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970014630A 1996-04-19 1997-04-19 유동 폴리싱 매체 처리 폴리싱 디바이스 KR970072155A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/635,020 US5695392A (en) 1995-08-09 1996-04-19 Polishing device with improved handling of fluid polishing media
US08/635,020 1996-04-19

Publications (1)

Publication Number Publication Date
KR970072155A true KR970072155A (ko) 1997-11-07

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Country Status (7)

Country Link
US (1) US5695392A (ko)
JP (1) JPH1034530A (ko)
KR (1) KR970072155A (ko)
DE (1) DE19715460C2 (ko)
GB (1) GB2312181B (ko)
SG (1) SG65646A1 (ko)
TW (1) TW346428B (ko)

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KR100524118B1 (ko) * 1997-10-04 2006-01-27 유나이티드 마이크로일렉트로닉스 코퍼레이션 씨엠피장비와그장비를이용한제조공정

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GB2312181B (en) 1999-09-29
GB2312181A (en) 1997-10-22
TW346428B (en) 1998-12-01
SG65646A1 (en) 1999-06-22
DE19715460A1 (de) 1997-10-30
GB9707727D0 (en) 1997-06-04
DE19715460C2 (de) 2002-02-21
JPH1034530A (ja) 1998-02-10
US5695392A (en) 1997-12-09

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