TW332908B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TW332908B TW332908B TW086107833A TW86107833A TW332908B TW 332908 B TW332908 B TW 332908B TW 086107833 A TW086107833 A TW 086107833A TW 86107833 A TW86107833 A TW 86107833A TW 332908 B TW332908 B TW 332908B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- positioning board
- forming process
- producing
- device includes
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 abstract 4
- 238000005429 filling process Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8321973A JPH10163368A (ja) | 1996-12-02 | 1996-12-02 | 半導体装置の製造方法及び半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW332908B true TW332908B (en) | 1998-06-01 |
Family
ID=18138504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086107833A TW332908B (en) | 1996-12-02 | 1997-06-06 | Semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (1) | US5930603A (zh) |
JP (1) | JPH10163368A (zh) |
KR (1) | KR100268608B1 (zh) |
DE (1) | DE19724533A1 (zh) |
TW (1) | TW332908B (zh) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6881611B1 (en) * | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
DE69730940T2 (de) * | 1996-07-12 | 2005-03-10 | Fujitsu Ltd., Kawasaki | Verfahren zur herstellung einer halbleiteranordnung |
US6534337B1 (en) * | 1997-05-15 | 2003-03-18 | Texas Instruments Incorporated | Lead frame type plastic ball grid array package with pre-assembled ball type contacts |
JPH113953A (ja) * | 1997-06-10 | 1999-01-06 | Fujitsu Ltd | 半導体装置の製造方法及び半導体装置 |
US5888850A (en) * | 1997-09-29 | 1999-03-30 | International Business Machines Corporation | Method for providing a protective coating and electronic package utilizing same |
US6380001B1 (en) * | 1998-01-29 | 2002-04-30 | Vlsi Technology, Inc. | Flexible pin count package for semiconductor device |
EP1747889B1 (en) * | 1998-05-18 | 2010-03-10 | Seiko Epson Corporation | Ink cartridge for an ink-jet printing apparatus |
DE19846662A1 (de) * | 1998-10-09 | 2000-04-20 | Siemens Ag | Elektronisches Modul, insbesondere Multichipmodul mit einer Mehrlagenverdrahtung und Verfahren zu seiner Herstellung |
US6323060B1 (en) | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
JP3521325B2 (ja) * | 1999-07-30 | 2004-04-19 | シャープ株式会社 | 樹脂封止型半導体装置の製造方法 |
US7156361B1 (en) * | 1999-09-02 | 2007-01-02 | Micron Technology, Inc. | Method and apparatus for forming metal contacts on a substrate |
US6295730B1 (en) * | 1999-09-02 | 2001-10-02 | Micron Technology, Inc. | Method and apparatus for forming metal contacts on a substrate |
US6484927B1 (en) * | 1999-11-05 | 2002-11-26 | Delaware Capital Formation Corporation | Method and apparatus for balling and assembling ball grid array and chip scale array packages |
US6329220B1 (en) | 1999-11-23 | 2001-12-11 | Micron Technology, Inc. | Packages for semiconductor die |
US6184064B1 (en) * | 2000-01-12 | 2001-02-06 | Micron Technology, Inc. | Semiconductor die back side surface and method of fabrication |
US6242284B1 (en) * | 2000-05-05 | 2001-06-05 | Advanced Semiconductor Engineering, Inc. | Method for packaging a semiconductor chip |
JP2001338947A (ja) * | 2000-05-26 | 2001-12-07 | Nec Corp | フリップチップ型半導体装置及びその製造方法 |
US6404043B1 (en) * | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
US6348399B1 (en) * | 2000-07-06 | 2002-02-19 | Advanced Semiconductor Engineering, Inc. | Method of making chip scale package |
US6559537B1 (en) * | 2000-08-31 | 2003-05-06 | Micron Technology, Inc. | Ball grid array packages with thermally conductive containers |
DE10104258A1 (de) * | 2001-01-31 | 2002-08-22 | Infineon Technologies Ag | Verfahren zum Aufbringen einer strukturierten Schicht auf ein Trägersubstrat |
US6462273B1 (en) * | 2001-03-16 | 2002-10-08 | Micron Technology, Inc. | Semiconductor card and method of fabrication |
US20020190367A1 (en) * | 2001-06-15 | 2002-12-19 | Mantz Frank E. | Slice interconnect structure |
US20030002267A1 (en) * | 2001-06-15 | 2003-01-02 | Mantz Frank E. | I/O interface structure |
US6573460B2 (en) * | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Post in ring interconnect using for 3-D stacking |
US6573461B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Retaining ring interconnect used for 3-D stacking |
JP4001112B2 (ja) * | 2002-03-29 | 2007-10-31 | 松下電器産業株式会社 | 熱伝導性基板の製造方法 |
US6856010B2 (en) * | 2002-12-05 | 2005-02-15 | Staktek Group L.P. | Thin scale outline package |
US6879050B2 (en) * | 2003-02-11 | 2005-04-12 | Micron Technology, Inc. | Packaged microelectronic devices and methods for packaging microelectronic devices |
US20040207990A1 (en) * | 2003-04-21 | 2004-10-21 | Rose Andrew C. | Stair-step signal routing |
JP4545022B2 (ja) * | 2005-03-10 | 2010-09-15 | 三洋電機株式会社 | 回路装置およびその製造方法 |
US8033016B2 (en) | 2005-04-15 | 2011-10-11 | Panasonic Corporation | Method for manufacturing an electrode and electrode component mounted body |
JP4729963B2 (ja) * | 2005-04-15 | 2011-07-20 | パナソニック株式会社 | 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 |
US7160755B2 (en) * | 2005-04-18 | 2007-01-09 | Freescale Semiconductor, Inc. | Method of forming a substrateless semiconductor package |
US7727813B2 (en) * | 2007-11-26 | 2010-06-01 | Infineon Technologies Ag | Method for making a device including placing a semiconductor chip on a substrate |
JP4560113B2 (ja) * | 2008-09-30 | 2010-10-13 | 株式会社東芝 | プリント回路板及びプリント回路板を備えた電子機器 |
JP5285144B2 (ja) * | 2009-03-26 | 2013-09-11 | シャープ株式会社 | チップ部品実装構造、チップ部品実装方法および液晶表示装置 |
CN102862945A (zh) * | 2011-07-01 | 2013-01-09 | 英属维尔京群岛商杰群科技有限公司 | 塑封内空封装的结构 |
TWM505698U (zh) * | 2011-07-08 | 2015-07-21 | Pac Tach Entpr Co Ltd | 塑封預模內空封裝之結構改良 |
US8933468B2 (en) * | 2012-03-16 | 2015-01-13 | Princeton University Office of Technology and Trademark Licensing | Electronic device with reduced non-device edge area |
JP7205787B2 (ja) * | 2017-07-31 | 2023-01-17 | 大日本印刷株式会社 | 電子部品搭載基板およびその製造方法 |
JP6962052B2 (ja) * | 2017-07-31 | 2021-11-05 | 大日本印刷株式会社 | 電子部品搭載基板およびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3719981A (en) * | 1971-11-24 | 1973-03-13 | Rca Corp | Method of joining solder balls to solder bumps |
US5219117A (en) * | 1991-11-01 | 1993-06-15 | Motorola, Inc. | Method of transferring solder balls onto a semiconductor device |
US5381848A (en) * | 1993-09-15 | 1995-01-17 | Lsi Logic Corporation | Casting of raised bump contacts on a substrate |
US5643831A (en) * | 1994-01-20 | 1997-07-01 | Fujitsu Limited | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device |
US5607099A (en) * | 1995-04-24 | 1997-03-04 | Delco Electronics Corporation | Solder bump transfer device for flip chip integrated circuit devices |
US5829668A (en) * | 1996-09-03 | 1998-11-03 | Motorola Corporation | Method for forming solder bumps on bond pads |
-
1996
- 1996-12-02 JP JP8321973A patent/JPH10163368A/ja not_active Withdrawn
-
1997
- 1997-05-27 US US08/863,280 patent/US5930603A/en not_active Expired - Fee Related
- 1997-06-06 TW TW086107833A patent/TW332908B/zh active
- 1997-06-11 DE DE19724533A patent/DE19724533A1/de not_active Ceased
- 1997-06-20 KR KR1019970026076A patent/KR100268608B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE19724533A1 (de) | 1998-06-04 |
KR19980063339A (ko) | 1998-10-07 |
KR100268608B1 (ko) | 2000-10-16 |
US5930603A (en) | 1999-07-27 |
JPH10163368A (ja) | 1998-06-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW332908B (en) | Semiconductor device | |
AU637092B2 (en) | A sealing method for a semiconductor device package | |
EP0603514A3 (en) | Method for thinning a semiconductor substrate. | |
SG96180A1 (en) | Resin sealing method and apparatus for a semiconductor device | |
KR970008346B1 (en) | Method for forming a semiconductor device | |
EP0653786A3 (en) | Method or manufacture of a semiconductor device. | |
SG48465A1 (en) | Method of producing epoxy resin-encapsulated semiconductor device | |
EP0603849A3 (en) | A method for manufacturing a semiconductor substrate using a bonding method, and a semiconductor substrate made by this method. | |
EP0434195A3 (en) | Semiconductor device package and manufacturing method. | |
GB2314676B (en) | Method for forming shallow junction of a semiconductor device | |
EP0681330A3 (en) | Electronic module with cooling for semiconductors and its manufacture. | |
AU5415998A (en) | Method for encapsulating a chip on a carrier | |
GB9812639D0 (en) | Method for producing a semiconductor device | |
EP0131379A3 (en) | Semiconductor device having a heterojunction, and method for producing it | |
GB2305736B (en) | Method for aligning micro patterns of a semiconductor device | |
EP0558856A3 (en) | A method for producing a semiconductor laser device | |
SG45511A1 (en) | Process for forming a semiconductor device | |
GB2300304B (en) | Method of producing a semiconductor device | |
AU1451500A (en) | Apparatus for and method of manufacturing a semiconductor die carrier | |
EP0702401A3 (en) | Method of manufacturing a semiconductor substrate suitable for IGBTs | |
SG90015A1 (en) | Resin sealing/molding apparatus for electronic parts | |
GB2300303B (en) | Method of producing a semiconductor device | |
IL135066A0 (en) | A method for producing an optical registration carrier by means of a master mould, a device suitable for carrying out such a method, an optical registration carrier, a method for verifying such an optical registration carrier | |
TW324852B (en) | Improved fabricating method of semiconductor device | |
GB2265049B (en) | A method for producing a semiconductor device |