SG96180A1 - Resin sealing method and apparatus for a semiconductor device - Google Patents

Resin sealing method and apparatus for a semiconductor device

Info

Publication number
SG96180A1
SG96180A1 SG9900145A SG1999000145A SG96180A1 SG 96180 A1 SG96180 A1 SG 96180A1 SG 9900145 A SG9900145 A SG 9900145A SG 1999000145 A SG1999000145 A SG 1999000145A SG 96180 A1 SG96180 A1 SG 96180A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
resin sealing
sealing method
resin
semiconductor
Prior art date
Application number
SG9900145A
Inventor
Tsutomu Miyagawa
Kunihiro Aoki
Masahiro Kodama
Fumio Miyajima
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG96180A1 publication Critical patent/SG96180A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/008—Using vibrations during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83102—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
SG9900145A 1998-01-23 1999-01-22 Resin sealing method and apparatus for a semiconductor device SG96180A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1138298 1998-01-23
JP10345318A JP3017485B2 (en) 1998-01-23 1998-12-04 Resin sealing method and resin sealing device for semiconductor device

Publications (1)

Publication Number Publication Date
SG96180A1 true SG96180A1 (en) 2003-05-23

Family

ID=26346800

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9900145A SG96180A1 (en) 1998-01-23 1999-01-22 Resin sealing method and apparatus for a semiconductor device

Country Status (7)

Country Link
US (2) US6261501B1 (en)
EP (1) EP0933808B1 (en)
JP (1) JP3017485B2 (en)
KR (1) KR100335675B1 (en)
DE (1) DE69939915D1 (en)
SG (1) SG96180A1 (en)
TW (1) TW500656B (en)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3017485B2 (en) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 Resin sealing method and resin sealing device for semiconductor device
JP3490606B2 (en) * 1998-03-20 2004-01-26 富士通株式会社 Mold for semiconductor device manufacturing
JP3494586B2 (en) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 Resin sealing device and resin sealing method
JP4077118B2 (en) * 1999-06-25 2008-04-16 富士通株式会社 Semiconductor device manufacturing method and semiconductor device manufacturing mold
US20020089836A1 (en) * 1999-10-26 2002-07-11 Kenzo Ishida Injection molded underfill package and method of assembly
JP3581814B2 (en) * 2000-01-19 2004-10-27 Ｔｏｗａ株式会社 Resin sealing method and resin sealing device
JP3423912B2 (en) * 2000-02-10 2003-07-07 Ｔｏｗａ株式会社 Electronic component, resin sealing method for electronic component, and resin sealing device
US6855385B2 (en) * 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
AU2001264968A1 (en) * 2000-05-31 2001-12-11 Honeywell International, Inc. Filling device
DE10196262T1 (en) 2000-05-31 2003-05-15 Honeywell Int Inc filling system
US6506332B2 (en) * 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
US6800232B2 (en) * 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
JP2002009096A (en) * 2000-06-20 2002-01-11 Apic Yamada Corp Method and apparatus for resin sealing
US6537482B1 (en) * 2000-08-08 2003-03-25 Micron Technology, Inc. Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
US6439869B1 (en) * 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US6770236B2 (en) 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
US6969945B2 (en) * 2001-02-06 2005-11-29 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device, method for manufacturing, and electronic circuit device
TW536768B (en) * 2001-08-03 2003-06-11 Matsushita Electric Ind Co Ltd Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
US7595017B2 (en) * 2002-01-31 2009-09-29 Stmicroelectronics, Inc. Method for using a pre-formed film in a transfer molding process for an integrated circuit
US6855578B2 (en) * 2002-08-16 2005-02-15 Texas Instruments Incorporated Vibration-assisted method for underfilling flip-chip electronic devices
US6989122B1 (en) * 2002-10-17 2006-01-24 National Semiconductor Corporation Techniques for manufacturing flash-free contacts on a semiconductor package
JP4243177B2 (en) * 2003-12-22 2009-03-25 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
JP4373237B2 (en) 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 Semiconductor chip resin sealing molding method and resin sealing molding die
NL1028904C2 (en) * 2005-04-29 2006-10-31 Fico Bv Press with plate-shaped frame parts, and method for operating such a plate press.
US7147447B1 (en) 2005-07-27 2006-12-12 Texas Instruments Incorporated Plastic semiconductor package having improved control of dimensions
JP2007109831A (en) * 2005-10-13 2007-04-26 Towa Corp Resin sealing molding method for electronic component
JP4979288B2 (en) * 2006-07-19 2012-07-18 ソニーケミカル＆インフォメーションデバイス株式会社 Mounting method using thermocompression bonding head
US10074553B2 (en) * 2007-12-03 2018-09-11 STATS ChipPAC Pte. Ltd. Wafer level package integration and method
US9460951B2 (en) * 2007-12-03 2016-10-04 STATS ChipPAC Pte. Ltd. Semiconductor device and method of wafer level package integration
US7829004B2 (en) * 2008-07-15 2010-11-09 Asm Technology Singapore Pte Ltd Transfer molding method and system for electronic devices
WO2010023907A1 (en) * 2008-08-28 2010-03-04 三井化学株式会社 Mold release film for manufacturing semiconductor resin package and semiconductor resin package manufacturing method using same
JP5715747B2 (en) * 2008-09-30 2015-05-13 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー Circuit device and manufacturing method thereof
JP5707316B2 (en) * 2009-03-12 2015-04-30 ナミックス株式会社 Electronic component mounting method
US8427269B1 (en) * 2009-06-29 2013-04-23 VI Chip, Inc. Encapsulation method and apparatus for electronic modules
US8540506B2 (en) 2010-08-16 2013-09-24 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor molding chamber
US20120076888A1 (en) * 2010-09-28 2012-03-29 Cheng Uei Precision Industry Co., Ltd. Mould with the contact prepressing and positioning function
JP5771865B2 (en) * 2011-05-23 2015-09-02 アピックヤマダ株式会社 Mold
US8552567B2 (en) 2011-07-27 2013-10-08 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
US8937309B2 (en) 2011-08-08 2015-01-20 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
SG191479A1 (en) * 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
JP6096081B2 (en) * 2013-08-06 2017-03-15 アピックヤマダ株式会社 Resin sealing mold, resin sealing method, and resin sealing mold cleaning method
KR101544269B1 (en) 2013-09-30 2015-08-12 세메스 주식회사 Wafer level molding apparatus
KR101585322B1 (en) * 2014-03-11 2016-01-13 세메스 주식회사 Apparatus for molding semiconductor devices
NL2013978B1 (en) * 2014-12-15 2016-10-11 Besi Netherlands Bv Device and method for controlled moulding and degating of a carrier with electronic components and moulded product.
US10541223B2 (en) * 2017-05-05 2020-01-21 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
JP6845903B1 (en) * 2019-09-18 2021-03-24 Ｔｏｗａ株式会社 Molding mold, resin molding equipment and manufacturing method of resin molded products
US11621181B2 (en) * 2020-05-05 2023-04-04 Asmpt Singapore Pte. Ltd. Dual-sided molding for encapsulating electronic devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665584A1 (en) * 1994-01-27 1995-08-02 " 3P" Licensing B.V. Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method
EP0713248A2 (en) * 1994-11-17 1996-05-22 Hitachi, Ltd. Molding method and apparatus
EP0730937A1 (en) * 1994-11-21 1996-09-11 Apic Yamada Corporation A resin molding machine with release film
EP0747942A2 (en) * 1995-05-02 1996-12-11 Texas Instruments Incorporated Improvements in or relating to integrated circuits
JPH09312308A (en) * 1996-05-21 1997-12-02 Oki Electric Ind Co Ltd Method and apparatus for manufacturing semiconductor device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
JPS6458617A (en) * 1987-08-18 1989-03-06 Michio Osada Method and apparatus for continuous and automatic formation of resin sealed package
JPH01299008A (en) * 1988-05-27 1989-12-01 Mitsubishi Electric Corp Molding device
US5218234A (en) * 1991-12-23 1993-06-08 Motorola, Inc. Semiconductor device with controlled spread polymeric underfill
US5203076A (en) * 1991-12-23 1993-04-20 Motorola, Inc. Vacuum infiltration of underfill material for flip-chip devices
US5249101A (en) * 1992-07-06 1993-09-28 International Business Machines Corporation Chip carrier with protective coating for circuitized surface
US5674343A (en) * 1994-04-19 1997-10-07 Nitto Denko Corporation Method for manufacturing a semiconductor
JP3241553B2 (en) * 1994-11-21 2001-12-25 アピックヤマダ株式会社 Resin molding device using release film
JP3214789B2 (en) * 1994-11-24 2001-10-02 アピックヤマダ株式会社 Resin molding device and resin molding method
MY114536A (en) * 1994-11-24 2002-11-30 Apic Yamada Corp A resin molding machine and a method of resin molding
JP3246848B2 (en) * 1995-02-22 2002-01-15 アピックヤマダ株式会社 General-purpose gate position resin molding apparatus and resin molding method
JP3516764B2 (en) * 1995-03-08 2004-04-05 アピックヤマダ株式会社 Resin molding device and resin molding method using release film
EP0742586A3 (en) * 1995-05-02 1998-03-11 Texas Instruments Incorporated Improvements in or relating to integrated circuits
US5710071A (en) * 1995-12-04 1998-01-20 Motorola, Inc. Process for underfilling a flip-chip semiconductor device
US5817545A (en) * 1996-01-24 1998-10-06 Cornell Research Foundation, Inc. Pressurized underfill encapsulation of integrated circuits
JPH09201846A (en) * 1996-01-25 1997-08-05 Apic Yamada Kk Method for molding resin using release film apparatus therefor and resin tablet used therein
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP3282988B2 (en) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP3017470B2 (en) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 Resin molding method and resin molding device
US6081997A (en) * 1997-08-14 2000-07-04 Lsi Logic Corporation System and method for packaging an integrated circuit using encapsulant injection
JPH1177733A (en) * 1997-09-01 1999-03-23 Apic Yamada Kk Resin molding method and resin molding device
US6000294A (en) * 1997-11-15 1999-12-14 Eaton Corporation System and method for fluid assisted shifting of mechanical transmissions
JP3017485B2 (en) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 Resin sealing method and resin sealing device for semiconductor device
JP2000176967A (en) * 1998-12-14 2000-06-27 Apic Yamada Corp Resin sealing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665584A1 (en) * 1994-01-27 1995-08-02 " 3P" Licensing B.V. Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method
EP0713248A2 (en) * 1994-11-17 1996-05-22 Hitachi, Ltd. Molding method and apparatus
EP0730937A1 (en) * 1994-11-21 1996-09-11 Apic Yamada Corporation A resin molding machine with release film
EP0747942A2 (en) * 1995-05-02 1996-12-11 Texas Instruments Incorporated Improvements in or relating to integrated circuits
JPH09312308A (en) * 1996-05-21 1997-12-02 Oki Electric Ind Co Ltd Method and apparatus for manufacturing semiconductor device

Also Published As

Publication number Publication date
EP0933808A2 (en) 1999-08-04
EP0933808B1 (en) 2008-11-19
EP0933808A3 (en) 2000-03-22
JPH11274197A (en) 1999-10-08
US6459159B1 (en) 2002-10-01
JP3017485B2 (en) 2000-03-06
TW500656B (en) 2002-09-01
KR100335675B1 (en) 2002-05-08
US6261501B1 (en) 2001-07-17
KR19990068067A (en) 1999-08-25
DE69939915D1 (en) 2009-01-02

Similar Documents

Publication Publication Date Title
SG96180A1 (en) Resin sealing method and apparatus for a semiconductor device
EP0695941A3 (en) Method and apparatus for packaging a chip
AU3197199A (en) A method and apparatus for evaluating software programs for semiconductor circuits
GB2295923B (en) Method and apparatus for manufacturing semiconductor device
HK1036858A1 (en) A method and apparatus for configuring and initializing a memory device and memory channel
EP1044494A4 (en) Method and apparatus for clamping a substrate
SG66400A1 (en) Method and apparatus for initializing a device
SG93833A1 (en) Method for forming a semiconductor device
GB9825189D0 (en) A semiconductor device and a method for fabricating thereof
GB2319532B (en) Method and apparatus for treating a semiconductor wafer
GB9907854D0 (en) Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
SG53055A1 (en) Method and apparatus for manufacturing semiconductor devices
HUP0000975A2 (en) Method and device for induction sealing
HUP9901831A3 (en) Method and apparatus for sealing foil material
GB2333543B (en) Apparatus and methods for sealing a wellbore junction
EP0704890A3 (en) A method of evaluating a mis-type semiconductor device
HK1022664A1 (en) Encapsulating device and method for closing a device for encapsulating electronic components
GB2327534B (en) Method for manufacturing semiconductor device and semiconductor device manufacturing apparatus
GB2313073B (en) A method and an apparatus for manufacturing heatsink devices
GB2312325B (en) A semiconductor device and method for forming the same
GB2348863B (en) A method for manufacturing and packing infusion packages and an apparatus therefor
GB9613672D0 (en) Method and apparatus for manufacturing a semiconductor device
GB2360555B (en) A sealing device and a method of repairing/replacing sealing devices
GB2300300B (en) Semiconductor device and method for its operation
GB2331846B (en) A semiconductor device and method for its manufacture