GB9613672D0 - Method and apparatus for manufacturing a semiconductor device - Google Patents

Method and apparatus for manufacturing a semiconductor device

Info

Publication number
GB9613672D0
GB9613672D0 GBGB9613672.6A GB9613672A GB9613672D0 GB 9613672 D0 GB9613672 D0 GB 9613672D0 GB 9613672 A GB9613672 A GB 9613672A GB 9613672 D0 GB9613672 D0 GB 9613672D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9613672.6A
Other versions
GB2309582A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9613672D0 publication Critical patent/GB9613672D0/en
Publication of GB2309582A publication Critical patent/GB2309582A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02252Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by plasma treatment, e.g. plasma oxidation of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02247Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by nitridation, e.g. nitridation of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/028Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0281Coatings made of semiconductor materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0203Etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/028Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0282Passivation layers or treatments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/16Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
    • H01S5/164Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions comprising semiconductor material with a wider bandgap than the active layer
GB9613672A 1996-01-26 1996-06-28 Method and apparatus for manufacturing a semiconductor device with a nitride layer Withdrawn GB2309582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8012325A JPH09205254A (en) 1996-01-26 1996-01-26 Manufacture of semiconductor device, semiconductor manufacturing device, and method for manufacturing semiconductor laser

Publications (2)

Publication Number Publication Date
GB9613672D0 true GB9613672D0 (en) 1996-08-28
GB2309582A GB2309582A (en) 1997-07-30

Family

ID=11802169

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9613672A Withdrawn GB2309582A (en) 1996-01-26 1996-06-28 Method and apparatus for manufacturing a semiconductor device with a nitride layer

Country Status (3)

Country Link
JP (1) JPH09205254A (en)
DE (1) DE19631132A1 (en)
GB (1) GB2309582A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000016383A1 (en) * 1998-09-11 2000-03-23 Sharp Kabushiki Kaisha Method for forming compound semiconductor layer and compound semiconductor device
JP4191227B2 (en) 2007-02-21 2008-12-03 昭和電工株式会社 Group III nitride semiconductor light emitting device manufacturing method, group III nitride semiconductor light emitting device, and lamp
JP6123414B2 (en) * 2013-03-27 2017-05-10 三菱電機株式会社 Semiconductor element manufacturing method and semiconductor element manufacturing apparatus
JP6265032B2 (en) * 2014-04-28 2018-01-24 住友電気工業株式会社 Semiconductor photo detector

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3886751T2 (en) * 1988-09-12 1994-06-23 Ibm Method for etching mirror facets on III-V semiconductor structures.
US5144634A (en) * 1989-09-07 1992-09-01 International Business Machines Corporation Method for mirror passivation of semiconductor laser diodes
JP2770544B2 (en) * 1990-03-23 1998-07-02 松下電器産業株式会社 Method of manufacturing MIS type semiconductor device
EP0448763A1 (en) * 1990-03-30 1991-10-02 Siemens Aktiengesellschaft Process and apparatus for manufacturing conductive layers or structures for highly integrated circuits
DE69010485T2 (en) * 1990-04-06 1995-01-26 Ibm Method for producing the web structure of a self-aligning semiconductor laser.
US5376223A (en) * 1992-01-09 1994-12-27 Varian Associates, Inc. Plasma etch process
US5354698A (en) * 1993-07-19 1994-10-11 Micron Technology, Inc. Hydrogen reduction method for removing contaminants in a semiconductor ion implantation process

Also Published As

Publication number Publication date
DE19631132A1 (en) 1997-07-31
GB2309582A (en) 1997-07-30
JPH09205254A (en) 1997-08-05

Similar Documents

Publication Publication Date Title
GB2295923B (en) Method and apparatus for manufacturing semiconductor device
EP0701278A3 (en) Semiconductor device and method for manufacturing same
SG97931A1 (en) Method and apparatus for manufacturing a device
SG90063A1 (en) Semiconductor device and manufacturing method thereof
SG74035A1 (en) Semiconductor device and manufacturing method thereof
GB2276764B (en) Apparatus for fabricating semiconductor device and method for fabricating semiconductor device
SG53021A1 (en) Semiconductor device and manufacturing method
GB2297426B (en) Method and device for polishing a wafer
GB2313954B (en) Semiconductor device and method for manufacturing same
EP0847078A4 (en) Method for manufacturing semiconductor device
GB2319532B (en) Method and apparatus for treating a semiconductor wafer
SG53055A1 (en) Method and apparatus for manufacturing semiconductor devices
GB2291536B (en) Method for manufacturing semiconductor device
GB9907854D0 (en) Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
KR970009171B1 (en) Semiconductor device and a method for manufacturing thereof
GB9500996D0 (en) Semiconductor device and method for fabrication thereof
GB2289982B (en) Apparatus and method for manufacturing wafer
GB2314680B (en) Semiconductor device and a fabrication method thereof
GB9509095D0 (en) Semiconductor device and method for fabrication thereof
GB2327534B (en) Method for manufacturing semiconductor device and semiconductor device manufacturing apparatus
GB2313073B (en) A method and an apparatus for manufacturing heatsink devices
GB2312325B (en) A semiconductor device and method for forming the same
GB9613672D0 (en) Method and apparatus for manufacturing a semiconductor device
GB2303564B (en) Semiconductor device manufacturing apparatus and manufacturing method
GB2300300B (en) Semiconductor device and method for its operation

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)