TW329048B - Semiconductor - Google Patents

Semiconductor

Info

Publication number
TW329048B
TW329048B TW086101070A TW86101070A TW329048B TW 329048 B TW329048 B TW 329048B TW 086101070 A TW086101070 A TW 086101070A TW 86101070 A TW86101070 A TW 86101070A TW 329048 B TW329048 B TW 329048B
Authority
TW
Taiwan
Prior art keywords
silicon
silicon layer
circuitry
face
data
Prior art date
Application number
TW086101070A
Other languages
English (en)
Inventor
Rollender Matthew
Hirt Ray
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of TW329048B publication Critical patent/TW329048B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/24—Memory cell safety or protection circuits, e.g. arrangements for preventing inadvertent reading or writing; Status cells; Test cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Storage Device Security (AREA)
TW086101070A 1995-12-20 1997-01-30 Semiconductor TW329048B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/575,295 US5824571A (en) 1995-12-20 1995-12-20 Multi-layered contacting for securing integrated circuits

Publications (1)

Publication Number Publication Date
TW329048B true TW329048B (en) 1998-04-01

Family

ID=24299720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086101070A TW329048B (en) 1995-12-20 1997-01-30 Semiconductor

Country Status (9)

Country Link
US (1) US5824571A (zh)
KR (1) KR100307895B1 (zh)
CN (1) CN1134825C (zh)
AU (1) AU1416997A (zh)
DE (1) DE19681689C2 (zh)
GB (1) GB2323212B (zh)
HK (1) HK1016341A1 (zh)
TW (1) TW329048B (zh)
WO (1) WO1997022990A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010083778A (ko) * 1998-12-30 2001-09-01 추후제출 버티컬 집적 회로 장치
US6414884B1 (en) * 2000-02-04 2002-07-02 Lucent Technologies Inc. Method and apparatus for securing electronic circuits
GB0112674D0 (en) * 2001-05-24 2001-07-18 Avx Ltd Manufacture of solid state electronic components
DE10131014C1 (de) * 2001-06-27 2002-09-05 Infineon Technologies Ag Gegen Analyse geschütztes Halbleiterbauelement und zugehöriges Herstellungsverfahren
DE10205208A1 (de) * 2002-02-08 2003-09-18 Conti Temic Microelectronic Schaltungsanordnung mit einer mit einem programmierbaren Speicherelement bestückten Leiterplatte
DE10238835A1 (de) * 2002-08-23 2004-03-11 Infineon Technologies Ag Halbleiterchip, Chipanordnung mit zumindest zwei Halbleiterchips und Verfahren zur Überprüfung der Ausrichtung zumindest zweier übereinander liegender Halbleiterchips in einer Chipanordnung
DE102004014435A1 (de) * 2004-03-24 2005-11-17 Siemens Ag Anordnung mit einem integrierten Schaltkreis
GB0410975D0 (en) 2004-05-17 2004-06-16 Nds Ltd Chip shielding system and method
US8074082B2 (en) * 2004-10-08 2011-12-06 Aprolase Development Co., Llc Anti-tamper module
DE102005005622B4 (de) * 2005-02-08 2008-08-21 Infineon Technologies Ag Sicherheits-Chipstapel und ein Verfahren zum Herstellen eines Sicherheits-Chipstapels
EP1840964A1 (en) * 2006-03-31 2007-10-03 Irvine Sensors Corp. Semiconductor device with protected access
EP2009693A1 (fr) * 2007-06-29 2008-12-31 Axalto S.A. Procédé de fabrication d'un système électronique sécurisé, dispositif de sécurisation de circuit intégré et système électronique correspondants
GB201311834D0 (en) * 2013-07-02 2013-08-14 Qinetiq Ltd Electronic hardware assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725671A (en) * 1970-11-02 1973-04-03 Us Navy Pyrotechnic eradication of microcircuits
JPS6130059A (ja) * 1984-07-20 1986-02-12 Nec Corp 半導体装置の製造方法
JPS63237144A (ja) * 1987-03-25 1988-10-03 Sega Enterp:Kk 模倣防止機能付半導体装置
US4956749A (en) * 1987-11-20 1990-09-11 Hewlett-Packard Company Interconnect structure for integrated circuits
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
US5072331A (en) * 1991-04-26 1991-12-10 Hughes Aircraft Company Secure circuit structure
FR2716280B1 (fr) * 1994-02-11 1996-04-12 Solaic Sa Procédé de protection des composants de cartes à mémoire contre des utilisations frauduleuses.
DE19511775C1 (de) * 1995-03-30 1996-10-17 Siemens Ag Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile

Also Published As

Publication number Publication date
KR20000064497A (ko) 2000-11-06
HK1016341A1 (en) 1999-10-29
DE19681689C2 (de) 2001-05-10
KR100307895B1 (ko) 2001-11-15
WO1997022990A1 (en) 1997-06-26
GB2323212B (en) 2000-12-13
GB2323212A (en) 1998-09-16
DE19681689T1 (de) 1998-11-05
US5824571A (en) 1998-10-20
GB9811429D0 (en) 1998-07-22
AU1416997A (en) 1997-07-14
CN1134825C (zh) 2004-01-14
CN1209217A (zh) 1999-02-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees