TW325588B - Vertical wafer boat - Google Patents

Vertical wafer boat

Info

Publication number
TW325588B
TW325588B TW086102121A TW86102121A TW325588B TW 325588 B TW325588 B TW 325588B TW 086102121 A TW086102121 A TW 086102121A TW 86102121 A TW86102121 A TW 86102121A TW 325588 B TW325588 B TW 325588B
Authority
TW
Taiwan
Prior art keywords
end plates
bars
coupled
wafer boat
vertical wafer
Prior art date
Application number
TW086102121A
Other languages
English (en)
Inventor
Taro Uchiyama
Takashi Tsukamoto
Jiro Nishihama
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Application granted granted Critical
Publication of TW325588B publication Critical patent/TW325588B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW086102121A 1996-02-28 1997-02-21 Vertical wafer boat TW325588B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6735796 1996-02-28

Publications (1)

Publication Number Publication Date
TW325588B true TW325588B (en) 1998-01-21

Family

ID=13342691

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086102121A TW325588B (en) 1996-02-28 1997-02-21 Vertical wafer boat

Country Status (5)

Country Link
US (1) US6065615A (zh)
EP (1) EP0793260B1 (zh)
KR (1) KR100361054B1 (zh)
DE (1) DE69712561T2 (zh)
TW (1) TW325588B (zh)

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KR100274934B1 (ko) * 1997-12-29 2001-01-15 윤종용 반도체 웨이퍼 보트
DE19856468C1 (de) * 1998-11-30 2000-06-15 Sico Jena Gmbh Quarzschmelze Verfahren zur Herstellung einer Haltevorrichtung für Halbleiterscheiben
US6196211B1 (en) 1999-04-15 2001-03-06 Integrated Materials, Inc. Support members for wafer processing fixtures
US6225594B1 (en) 1999-04-15 2001-05-01 Integrated Materials, Inc. Method and apparatus for securing components of wafer processing fixtures
EP1171905A1 (en) * 1999-04-15 2002-01-16 Integrated Materials, Inc. Silicon fixtures for wafer processing and method of fabrication
US6205993B1 (en) 1999-04-15 2001-03-27 Integrated Materials, Inc. Method and apparatus for fabricating elongate crystalline members
TWI232891B (en) * 1999-08-02 2005-05-21 Tokyo Electron Ltd SiC material, semiconductor device fabricating system and SiC material forming method
US6455395B1 (en) 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
US6727191B2 (en) * 2001-02-26 2004-04-27 Integrated Materials, Inc. High temperature hydrogen anneal of silicon wafers supported on a silicon fixture
US6571964B2 (en) * 2001-03-28 2003-06-03 International Business Machines Corporation Tray for retaining disks
US6811040B2 (en) * 2001-07-16 2004-11-02 Rohm And Haas Company Wafer holding apparatus
US20040130055A1 (en) * 2001-11-27 2004-07-08 Beaman Joseph J. Method for fabricating siliconized silicon carbide parts
US7628895B2 (en) * 2002-05-09 2009-12-08 Seagate Technology Llc W-patterned tools for transporting/handling pairs of disks
DE10334940B4 (de) * 2003-07-31 2007-08-23 Infineon Technologies Ag Trägereinrichtung
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
US7498062B2 (en) * 2004-05-26 2009-03-03 Wd Media, Inc. Method and apparatus for applying a voltage to a substrate during plating
CN2762903Y (zh) * 2004-12-30 2006-03-08 鸿富锦精密工业（深圳）有限公司 光学元件清洗机构
DE102005013831B4 (de) * 2005-03-24 2008-10-16 Siltronic Ag Siliciumscheibe und Verfahren zur thermischen Behandlung einer Siliciumscheibe
US7828158B2 (en) * 2005-07-14 2010-11-09 Displays Plus, Inc. Merchandise dispensing apparatus providing theft deterrence
US20070084408A1 (en) * 2005-10-13 2007-04-19 Applied Materials, Inc. Batch processing chamber with diffuser plate and injector assembly
US20070084406A1 (en) * 2005-10-13 2007-04-19 Joseph Yudovsky Reaction chamber with opposing pockets for gas injection and exhaust
JP2007329476A (ja) * 2006-06-02 2007-12-20 Rohm & Haas Electronic Materials Llc フィレット半径結合部を有する装置
TWI361469B (en) 2007-03-09 2012-04-01 Rohm & Haas Elect Mat Chemical vapor deposited silicon carbide articles
US20090071918A1 (en) * 2007-09-18 2009-03-19 Panchapakesan Ramanarayanan Vertical semiconductor wafer carrier
JP5658463B2 (ja) * 2009-02-27 2015-01-28 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US8267831B1 (en) 2009-05-19 2012-09-18 Western Digital Technologies, Inc. Method and apparatus for washing, etching, rinsing, and plating substrates
KR101246506B1 (ko) * 2011-08-02 2013-03-25 조국환 웨이퍼 운반용 카세트 제조장치
TWD161688S (zh) * 2012-12-27 2014-07-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
WO2015092038A1 (de) * 2013-12-20 2015-06-25 Centrotherm Photovoltaics Ag Waferboot
JP1537630S (zh) * 2014-11-20 2015-11-09
JP1537629S (zh) * 2014-11-20 2015-11-09
JP1537313S (zh) * 2014-11-20 2015-11-09
JP1537312S (zh) * 2014-11-20 2015-11-09
JP6505001B2 (ja) * 2015-11-18 2019-04-24 東京エレクトロン株式会社 ウエハボート支持台及びこれを用いた熱処理装置
JP1563649S (zh) * 2016-02-12 2016-11-21
CN106282516B (zh) * 2016-08-29 2018-04-24 苏州倍声声学技术有限公司 用于热处理炉中放置u形电枢的装置
US10861727B2 (en) 2018-03-13 2020-12-08 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
JP1658652S (zh) * 2019-08-07 2020-04-27
JP1706322S (zh) * 2021-08-27 2022-01-31
US20240145282A1 (en) * 2022-10-27 2024-05-02 Intel Corporation Wafer support member and method of manufacturing a wafer support member
CN117646195B (zh) * 2024-01-30 2024-04-26 湖南德智新材料有限公司 支撑机构、支撑装置和薄膜制备设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105693B2 (ja) * 1987-03-06 1994-12-21 東芝セラミックス株式会社 ウエ−ハ熱処理用炭化珪素質治具
JP2759000B2 (ja) * 1991-03-22 1998-05-28 三菱レイヨン株式会社 エステラーゼをコードする塩基配列を有するｄｎａ断片
JPH04300262A (ja) * 1991-03-28 1992-10-23 Shin Etsu Chem Co Ltd 炭化珪素質治具
JP3234617B2 (ja) * 1991-12-16 2001-12-04 東京エレクトロン株式会社 熱処理装置用基板支持具
US5458688A (en) * 1993-03-09 1995-10-17 Tokyo Electron Kabushiki Kaisha Heat treatment boat
JP3650423B2 (ja) * 1994-09-30 2005-05-18 東芝セラミックス株式会社 ウエハボート
US5534074A (en) * 1995-05-17 1996-07-09 Heraeus Amersil, Inc. Vertical boat for holding semiconductor wafers
JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
JPH09306980A (ja) * 1996-05-17 1997-11-28 Asahi Glass Co Ltd 縦型ウエハボート
USD409158S (en) 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus

Also Published As

Publication number Publication date
KR970063661A (ko) 1997-09-12
EP0793260B1 (en) 2002-05-15
DE69712561D1 (de) 2002-06-20
US6065615A (en) 2000-05-23
KR100361054B1 (ko) 2003-01-24
EP0793260A1 (en) 1997-09-03
DE69712561T2 (de) 2002-11-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees