TW321616B - - Google Patents

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Publication number
TW321616B
TW321616B TW086101262A TW86101262A TW321616B TW 321616 B TW321616 B TW 321616B TW 086101262 A TW086101262 A TW 086101262A TW 86101262 A TW86101262 A TW 86101262A TW 321616 B TW321616 B TW 321616B
Authority
TW
Taiwan
Prior art keywords
flux
welding
item
solder
scope
Prior art date
Application number
TW086101262A
Other languages
English (en)
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW321616B publication Critical patent/TW321616B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

發明範圍 本發明一般地係關於焊接連接，以及，更特別地係關於 —種焊塊裝置、一種電子元件與一種用以形成一焊塊的方法。 發明背景 焊塊經常時附著在電子元件如積體電路或電路板之導電 區或焊接墊片，以供電子元件之表面固定使用。 預形成的焊塊可自動地定位於使用各式各樣已知技術的 預塗助焊劑的焊接墊片上，包括自動拾起與放置方法與網 板印刷方法。焊塊放置後經常是一個软熔操作，其使焊塊 牢牢固定於焊接墊片。 焊塊也可由一種焊劑形成，其包括一種焊接合金與—種 在軟熔操作之前施加在焊接墊片上的助焊劑。當焊劑渡過 軟熔過程後，焊接合金"成球狀”及形成焊塊。 在軟溶過程期間，助焊劑活化與分散，除去焊塊與焊接 整片之表面污染物及確保焊塊堅固地附著在焊接墊片。然 而，在助焊劑活化與分散過程期間，焊塊可能隨著助焊劑 移動而與焊接墊片分離。另外，助焊劑可能被困在焊塊與 焊接墊片之間，結果產生弱的焊塊·至-焊接墊片附著β 經濟部中央標準局貝工消費合作社印製 因此對於焊塊方法與裝置有一個需要，其可加強焊塊在 焊接墊片上的正確定位及增加焊塊與焊接墊片之間的連接 信賴性。 發明摘述 根據本發明之一個觀點，前述的需要係由一個焊塊裝置 所提出，該裝置包括—個充分導電區與一個從充分導電區
321616 Α7 Β7 五、發明説明（ 經濟部中央標準局貝工消費合作社印製 突出的隙鏠。烊接保護區至少部份環繞充分導電區之周園 及隙縫之周固。焊塊係形成於導電區及至少一部份焊接保 護區上。 才據本發月之另一個觀點，一種電子元件包括一個介電 區、—個配置於介電區的充分導電區、-個緊鄰充分導電 區的焊接保護區、一個藉由除去充分導電區與介電區之材 料而形成的隙縫與—個連結導電區的焊塊，其覆蓋至少一 部份焊接保護區與隙縫。 根據本發明之另外—個觀點，—種用以形成—焊塊的方 法包括：提供一個具有一個充分導電區、一個從充分導電區 哭出的隙縫與一個烊接保護區的裝置，烊接保護區至少部 6 %繞導電區與隙縫；放置許多焊劑於裝置上，焊劑包含 一種焊料與一種助焊劑，焊劑充分覆蓋導電區與至少一部 汾焊接保護區；以及加熱焊劑以形成焊塊於導電區與至少 一部份焊接保護區。 從隨後作爲説明所顯示與插述的本發明之較佳具體實施 例之描述，熟諳此技藝者將容易地明白本發明之優點。如 同將被了解的，本發明能夠有其它與不同的具體實施例， 且其知節能夠有各方面的改善。於是，圖案與描述本質上 是當作説明用的，及不當作限制用的。 圏案簡述 -圈1是根據本發明之一個較佳具體實施例的一個電子元件 接合區之平面圖。 屬2是沿著圖^中描寫的接合區之2·2線的橫截面圖。 讀 先 閲 讀 背 之 注
I 養
經 t 央 標 準 Μ 貝 工 消 費 合 作 社 印 五、發明説明（3 :3是圈i與圖2中描寫的電子元件之接合區平面圈，其 描出软熔過程期間形成的焊塊。 圈4是沿著圖3中描寫的接合區之線44的橫截面圈。 圈5是根據本發明之較佳具趙實施例之用以形成一焊 方法之流程圖》 較佳具體實施例詳述 現在轉向圖案，其中相同的數字指示相同的元件，圏！是 一個根據本發明之較佳具體實施例的電子元件之接合區平 面圖《接合區10可附著至電子元件（未顯示出），例如尤其 是積體電路晶片或印刷電路板，或可爲電予元件之主要部 份。許多接合區10可存在於單一電子元件是令人期待的。 .在個實例中’ 31個接合區係配置於一個電子元件上。 如同圖1顯示的，接合區10包括一個焊接保護區12，焊 接保護材料是爲人熟知的及廣泛可取得的：—個導電區14 ，其可爲如由金屬材料如銅所製成的焊接墊片；一個隙縫 1 6與一個包含許多焊劑的焊劑區18 β 隙縫16係從焊接墊片突出，且實質地垂直焊接墊片 隙縫16可爲任何須要的形狀，例如圓形、長方形或橢圓形 ，以及可用任何適合的方法形成，例如使用雷射。烊接保 護區1 2較佳地係環繞焊接墊片！ 4輿隙縫〗6 β烊劑i 8覆蓋 焊接墊片14，部份延仲至焊接保護區12及部份覆蓋隙縫16。 _接合區10可用各式各樣的方式建構。一個適合於接合區 1 0的構造實例係顯示於圈2。如同説明的，焊接整片j 4係 配置於介電區20的較大導電層15之外露區域，其可爲一種 請 先 閲 讀 背 之 注
I 訂 飞 6- 本紙張尺度適用中國國家標準（CNS ) Α4«<格（210X297公釐） B7 五、發明説明（4 ) 基材如陶瓷或其它材料。焊接保護區12可配置於導電層15 上面及可選擇性地除去而形成焊接墊片14。隙縫Η延伸經 過焊接保護區12與導電層15，以便外露基材2〇。經過基材 20的通路孔23可利用接合區1〇反側（未顯示出）上的元件（ 未顯示出）電連接焊接墊片14,典型地是連接至積體電路元 件。 焊劑1 8較佳地係使用普遍熟知的技術網版印刷至接合區 10,例如使用型版（未顯示出）與橡皮刮刀（未顯示出）。可 爲金屬的型版之適合金屬包括不錄鋼 '黃銅或銅，但不限 於此，其具有藉由如鑿孔、蹐孔或蝕刻所形成的小孔。較 佳地，型版上的一個小孔係對應於接合區i 〇上的一個焊接 墊片14位置》令人期待的是多接合區1〇存在時，型版可具 有多對應小孔。更令人期待的是焊劑18可經由型版同時施 加至許多接合區1 0組合，例如許多電子元件形成於單一基 材2 0時。在某個實例中，焊劑i 8係施加至丨4個電子元件， 每個電子元件具有31個接合區1〇。 經濟部中央榡隼局貝工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 爲了將焊劑18配置於接合區1〇上，型版係放置在焊接整 片14上，以及橡皮刮刀迫使焊劑18經過型版到達焊接墊片 1 4。焊劑1 8可印刷成任何須要的形狀，例如長方形或圓柱 狀或其它形狀。如同圈1與2顯示的，焊劑18的形狀是長方 形。 -通常，焊劑18包括至少三種工作成份：一種焊接合金、一 種助焊劑與一種典型地爲適合溶解助焊劑的溶劑的載體。 通常，助焊劑是在低於焊接合金之熔點的溫度下活化。焊 本紙浪尺度適用中國國家標準（CNS > A4規格（210X297公釐）
經濟部中央標準局負工消費合作社印1iL Α7 Β7 五、發明説明（5 ) 劑18之組成必須以可軟焊性與連結完整性需求爲基礎來選 擇》 在適用於本文所描述的接合區10的焊接連接範固中有各 式各樣爲人熟知的適合的烊劑材料。一種適合的焊劑是商 業上可得自位於美國组澤西州（New Jersey) 07304澤西市 (Jersey City)第440號公路600號的阿爾法金屬公司 (Alphametals)之件號RMA390DH4，其包含約90%焊接合金 與約5%助焊劑，其餘爲載體，焊接合金依序包含大約62% 錫、大約3 6 %鉛與大約2 %銀》 如同圖1與2顯示的，焊劑18的體積爲大約〇·78立方毫米 焊劑區1 8之尺寸應以須要的最後焊塊尺寸（在下面更進一 步討論）爲基礎來選擇。較佳的焊劑-對-焊塊體積比是7 : 1 。高焊劑-對-焊塊體積比可降低焊劑1 8之位置對於最後焊 塊位置的小變化的靈敏度，也可幫助確定小的焊劑體積變 動對最後焊塊尺寸有減小的衝擊。 囷3與4是囷1與2描寫的電子元件之接合區圖，其説明軟 熔操作期間由焊劑18所形成的焊塊22。焊塊可在軟熔期間 由焊劑1 8以許多步驟所形成。首先，焊剤1 8係在低於焊劑 18之焊接合金成份之熔點的溫度下加熱一段時間。加熱溫 度與時段係選擇以便充分活化焊劑18之助焊劑成份及提供 足量的時間使助焊劑完成其作用及分散。 .雖然有許多溫度與焊接合金之熔點有關聯，但是約179 至183 C的溫度範固是適合的β同樣地有各種適合的時段 輿助焊劑之活化有關聯。一個較佳的軟熔過程可加以提供 本纸張尺度適用中國國家揉準（CMS ) Α4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)
經濟部中央標準局員工消費合作社印製 A 7 ______ B7 _五、發明説明（6 ) ，以使尤其是包含約9 Ο %焊接合金與约5 %助烊劑的烊劑i 8 在大約150至172aC的溫度範囷内加熱大約2分鐘。 在助焊劑活化過程期間，焊劑i 8之可能殘留困在坪塊2 2 與焊接墊片14之間的助焊劑成份流進隙縫16，部份由於助 焊劑對介電基材20的吸引力，所以增加焊塊22與焊接整片 14之間連接信賴性。另外，隙縫16捕捉流自烊接保護區12 的過剩助焊劑，抑制了焊劑！ 8或焊塊22位移的傾向及輔助 正確的焊塊22對焊接墊片14的位置。 爲了完成軟熔過程，焊劑18可加熱在焊接合金之熔點附 近，例如在大約178至183Ό的溫度範圍内，其使得焊接合 金·’成球狀"，以及在焊接墊片14上形成焊塊22，因此坪接 合金被吸引到導電焊接墊片14 β加熱至一洄較高的溫度也 是須要的。例如達到2 1 8。(：左右，以改善焊接連結的品質 。如同圖4顯示的，焊塊2 2延伸覆蓋至少一部份焊接保護 區1 2及至少一部份隙縫！ 6。 雖然企圈將本文描述的技術應用到大範圍的焊塊尺寸及 間距，但是在一個較佳具體實施例中，焊塊2 2量到〇丨8毫 米直徑’且可在鄰近焊塊（未顯示出）之大約14毫米之内形 成。 因此’可了解到如同圖5所説明的，從方塊開始，用 以形成一焊塊的方法包括一個第一步驟32，其提供一種具 有一個充分導電區、一個實質地垂直充分導電區的隙缝與 —個焊接保護區的裝置’該焊接保護區至少部份環繞導電 區與昧縫》下一個步驟34包括放置許多包含焊接合金與助
ϋ· m I (請先閲讀背面之注意事項再填寫本頁) ^i·.* ^^1· In ·
、?T -9- 本紙狀度適用中國國家橾率（CNS } 321616 A7 經濟部中央標準局負工消費合作社印裝 B7 五、發明説明（7 ) 焊劑的焊劑於装置上，充分覆蓋導電區與—部份焊接保護 區。最後步樣3 6牵涉到加熱焊劑以在導電區與焊接保護區 上形成焊塊。 使用本文描述的裝置與方法，過程缺陷與加工成本降低 。正確的焊塊對焊接墊片的定位是藉由使用介電障縫而得 到’該隙縫在軟炫過程期間吸收過剩的助焊劑與幫助校正 錯棑及強化焊塊與焊接墊片之間的焊接連結完整性而不用 筇貴的工具如自動裝置。 、 顯而易見的’本發明之其它與更進—步的丨 ，叼2氕可加以設 計而不税離附屬申請專利範固及其同等物之精神與範 以及頃了解到不應以任何方法限制本發明, ^ 於上延的特定具 體實施例，而只由下列的申請專利範圍殳其 欠丹 j争物所支配。 -10- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁)

Claims (1)

  1. 包含如下的步 A8 B8 C8 D8 中請專利範圍 l —種用以形成一焊塊的方法，步银如下 提供一種具有—個充分導電區、-缺充分導電區突 出的陳縫與-個焊接保護㈣裝置，料接保護區至少 部份環繞導電區與隙縫； 放置許多焊劑於裝置上，焊劑包含_種焊材與一種助 淳劑，㈣大致覆蓋導電區與至少_部份焊接 以及 加熱焊劑以在導電區與至少—部份焊接保護區上形成 浮塊。 根據申請專利範圍第1項的方法，其另外 驟： 在加熱焊劑以形成焊塊之前’加❸旱劑至攸於焊材之 塔點的溫度，至少-部份助焊劑從焊接保護區流入隙縫。 3.根據申請專利範圍第2項的方法，其中溫度是大約15〇_ 17 2。(：。 《根據中請㈣範園第2項的方法，|中在該溫度下維持 焊劑的時間大於1分鐘。 5·根據申請專利範圍第玉項的方法，其另外包含如下的步 驟： 在加熱焊劑以形成焊塊之前，加熱焊劑至低於焊材之 溶點的溫度，至少-部份助焊劑從充分導電區流入陈缝。 6.根據申請專利範圚第1項的方法，其另外包含如下的步 驟： 附著焊塊於電路板。 -11 本紙張用t S目家鱗（。叫八械格（21^297公釐) -----’---I』裝------訂------ (請先鬩讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作社印«. ABCD 321616 六、申請專利範圍 7. 根據申請專利範圍第1項的方法，其中焊劑體積比焊塊 體積大超過5倍。 8. 根據申請專利範圍第1項的方法，其中焊劑體積形狀係 選自長方形與圓柱形： 9·根據申請專利範圍第丨項的方法，其中焊劑係配置於至 少一部份隙缝。 10.恨據申請專利範圍第}項的方法，其中焊接保護區具 小於1 0毫米的厚度。 ' (請先聞讀背面之注意Ϋ項再填寫本頁) 袈· 訂 經濟部中央揉準局貝工消費合作社印褽 娜 Μ *«/ Ns 6 /(\ 準 標 家 國 國 中 用 一適 釐 -公 7 29
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WO1997040530A1 (en) 1997-10-30
EP0907963A4 (en) 2000-07-12
US5738269A (en) 1998-04-14
EP0907963A1 (en) 1999-04-14
KR100278959B1 (ko) 2001-04-02
KR20000005541A (ko) 2000-01-25
JP2000509203A (ja) 2000-07-18

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