SG90709A1 - Method of producing solder bumps on substrate - Google Patents

Method of producing solder bumps on substrate

Info

Publication number
SG90709A1
SG90709A1 SG9803427A SG1998003427A SG90709A1 SG 90709 A1 SG90709 A1 SG 90709A1 SG 9803427 A SG9803427 A SG 9803427A SG 1998003427 A SG1998003427 A SG 1998003427A SG 90709 A1 SG90709 A1 SG 90709A1
Authority
SG
Singapore
Prior art keywords
substrate
solder bumps
producing solder
producing
bumps
Prior art date
Application number
SG9803427A
Inventor
Chew Hwee Seng Jimmy
Tay Hock Lau
Yun Sheng Cai
Soon Chye Lian
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG9803427A priority Critical patent/SG90709A1/en
Priority to TW087114947A priority patent/TW387830B/en
Publication of SG90709A1 publication Critical patent/SG90709A1/en

Links

SG9803427A 1998-09-04 1998-09-04 Method of producing solder bumps on substrate SG90709A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG9803427A SG90709A1 (en) 1998-09-04 1998-09-04 Method of producing solder bumps on substrate
TW087114947A TW387830B (en) 1998-09-04 1998-09-08 Method of producing solder bumps on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9803427A SG90709A1 (en) 1998-09-04 1998-09-04 Method of producing solder bumps on substrate

Publications (1)

Publication Number Publication Date
SG90709A1 true SG90709A1 (en) 2002-08-20

Family

ID=20430086

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9803427A SG90709A1 (en) 1998-09-04 1998-09-04 Method of producing solder bumps on substrate

Country Status (2)

Country Link
SG (1) SG90709A1 (en)
TW (1) TW387830B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1327501C (en) * 2004-07-22 2007-07-18 上海交通大学 Selective laser back flow preparing method for flip-chip convex point

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997040530A1 (en) * 1996-04-19 1997-10-30 Motorola Inc. Solder bump apparatus, electronic component and method for forming a solder bump
US5873512A (en) * 1995-12-22 1999-02-23 International Business Machines Corporation Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
US5921462A (en) * 1997-02-21 1999-07-13 Gordon; Thomas A. Ball grid array ball placement method and apparatus
EP0964608A2 (en) * 1998-06-12 1999-12-15 Ford Motor Company Method for laser soldering

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5873512A (en) * 1995-12-22 1999-02-23 International Business Machines Corporation Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
WO1997040530A1 (en) * 1996-04-19 1997-10-30 Motorola Inc. Solder bump apparatus, electronic component and method for forming a solder bump
US5921462A (en) * 1997-02-21 1999-07-13 Gordon; Thomas A. Ball grid array ball placement method and apparatus
EP0964608A2 (en) * 1998-06-12 1999-12-15 Ford Motor Company Method for laser soldering

Also Published As

Publication number Publication date
TW387830B (en) 2000-04-21

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