五、發明説明（1 ) 發明領域 本發明係關於使用焊料隆塊進行電連接。特別本發明 係關於一種於半導體業界產生焊料隆塊用於電連接之方法 〇 Α7 Β7 發明背景 球栅陣列（BGA)封裝積體電路（1C)裝置於1C裝置生產 過程之重要性漸增。BGA封裝過程中，習知方法使用烊 珠其焊於1C封裝趙之基材塾上。對使用焊硃接合封裝體與 焊接點曾經敘述多種方法。美國專利4,878,611描述焊料 接點組裝技術，其中具有界定尺寸之焊珠再流動而形成具 有所需接點形狀之焊接點》美國專利5,722，160說明經由 於通孔形成焊料隆塊之封裝方法。兩種方法中皆需要於待 接合之至少一表面形成烊球’焊球據描述係藉谭料赍再流 動於對應墊上。 習知使用焊.珠形成焊料隆塊之方法有某些缺點。除了 複雜的拾取及安置技術之投資成本高之外，珠本身的成本 也高》此外大量珠需要習知真空拾取與安放系統妥為發揮 功能，意謂著即使只需要少數封裝體也需消耗大量珠於機 器。結果對於生產多種不同類型封裝體之小容積總成殼體 而言浪費變得極高，由於珠容易污染故變成無法導電而無 法再用。此外’珠本身尺寸小使其難以操控，即使小量的 空氣移動或基材運動也可能影響珠於基材上再度流動前的 準備疋位，結果導致產率不良。所有此等因素皆促成生產 附有焊料隆塊裝置如BGA之成本高 本紙張尺度述用中國國家標準（CNS ) Α4現格（210X297公瘦） . "裝— /|\ C請先^讀背¾之注意事項再填寫本頁} 、τ 經矛‘部中夾樣準Λ只.工消費合作私印>'' -4- 五、發明説明（2) 發明目的 H Θ <目的係提供'種由焊料I*生產焊料隆塊之方 法0 本發明之另—目的係提供-種可於基材上生產複數焊 料隆塊而其具有均勻預定高度之方法。 本發月之又另-目的係以低成本生產焊料隆塊。 發明概述 衣發明提供-種由焊料生產焊料隆塊之方法。根擄 本發明之—態樣，焊料t藉雷射束加熱供再流動。若供應 用於半導Η 18或封裝體，則焊料f較佳顧於各1/〇塾 上之界定容積，所得隆塊具有均勻高度。根據本發明之另 態樣，膏施用及再流動步驟可於相同系統進行因而免除 將基材由一站轉運至另一站之步驟。最佳具體例中提供型 板而輔助施用界定容積及高度之焊料斧。然後雷射束直接 照射至焊料旁’較佳未移動型板。根據本發明之另一態樣 ，一片額外模版放置於上方而保護型板不會暴露於雷射束 。使用此種方法可免除焊料珠及再流動烘箱，及由拾取與 .安置系統轉運基材至烘箱之關聯步驟因而可降低成本。 囷式之簡單說明 第1.4圖為本發明之具想例之示意說明囷； ，第1B圖為當_掩壓器掃株跨越基村—時之縱剖面圖； 苐2圖為本發明之另一具體例之示意說明圖； 第3圖為流程圖顧示根據第1圖所示.之具體例方法各步 驟； 本紙張尺度速用中國國家標準（CNS ) A4规格（210X297公嫠） A7 B7 好"—部中央"準而h-T消費合作私印51 發明説明（3) 第4圖為流程圖顯示根據第2圖—所示之具艘例之方法.各 步驟 發“說明 習知焊料膏施用方法例如表面黏貼法通常涉及使用型 板。例如焊料膏可使用型板施用至基材如印刷電路板表面 。然後1C封裝體置於板上而引線於焊料膏上，整體總成再 流動而接合封裝體於板。 可能型板技術也可用來生產焊料隆塊。焊料膏使用贺 板施用於基材β然後移開型板及基材轉運至再流動供箱。 但前述習知PCB型板方法不適合直接生產焊料隆塊如Β〇Α 封裝體/此種方法無法可靠地生產具有均勻高度之隆塊， 此點為BGA封裝體之重要要求，原因為再流動步驟前去 除型板無可避免地導致若干焊料膏黏著於型板，造成再流 動的焊料膏的實際量的改變。結果隆塊的高度改變，此乃 許多類型封裝趙所無法接受者。另一變化例中，型板於施 用焊料膏後留在基材上，烊料資於型板内部執行烘箱再流 動步驟。但此種技術將導致需要無數型板，原因為由膏施 用步驟之烘箱再流動步騍之裝配線相當長。此外不同封箱 體需要不同型板，進一步造成工具成本升高。 本發明經由提供一種使用雷射技術再流動焊料膏方法 而解決前述問題9技術簡單且具成本效益，可免除習知再 流動方法使用的烘箱《為了由焊料膏形成均勻隆塊陣列， 需施加正確界定容積之焊料膏。此種焊料膏容積需於再流 動完成時可獲得具有均勻高度的焊料隆塊。最佳具體 (請先W讀背兩之注意事項再填寫本頁) 裝-----_--1T-— —------ — ______ HI tn ·V. Description of the Invention (1) Field of the Invention The present invention relates to electrical connection using solder bumps. In particular, the present invention relates to a method for generating solder bumps in the semiconductor industry for electrical connection. 〇 A7 B7 BACKGROUND OF THE INVENTION The importance of ball grid array (BGA) packaged integrated circuit (1C) devices in the production process of 1C devices is increasing. In the BGA packaging process, the conventional method is to use a bead to solder on the base material of the 1C package Zhao. Various methods have been described for bonding packages and solder joints using solder joints. U.S. Patent No. 4,878,611 describes solder joint assembly technology in which beads having a defined size are reflowed to form a solder joint having a desired joint shape. U.S. Patent No. 5,722,160 describes a packaging method for forming solder bumps through vias. In both methods, it is necessary to form a ball on at least one surface to be joined. The solder ball is described to flow through the material and then flow on the corresponding pad. The conventional method of using solder beads to form solder bumps has certain disadvantages. In addition to the high investment cost of complex picking and placement technology, the cost of the beads itself is also high. ”In addition, a large number of beads need to be familiar with the vacuum picking and placement system to function properly. Bead on the machine. As a result, the waste is extremely high for the production of small-volume assembly shells of many different types of packages, and because the beads are easily contaminated, they become non-conductive and cannot be reused. In addition, the small size of the bead itself makes it difficult to handle. Even a small amount of air movement or substrate movement may affect the preparation position of the bead before flowing on the substrate again, resulting in poor yield. All these factors have contributed to the high cost of producing devices with solder bumps such as BGA. The paper size is described in Chinese National Standard (CNS) A4 (210X297 male thin). &Quot; 装 — / | \ CPlease read first Note on the back ¾ Please fill in this page again}, τ Jing spear's sample clip Λ only. Industry and consumer cooperation private seal > '' -4- V. Description of the invention (2) Purpose of the invention H Θ < Purpose To provide a method for producing solder bumps from solder I * Another object of the present invention is to provide a method for producing a plurality of solder bumps on a substrate with a uniform predetermined height. This month has another purpose-to produce solder bumps at low cost. SUMMARY OF THE INVENTION The invention provides a method for producing solder bumps from solder. According to one aspect of the present invention, the solder t is heated by a laser beam for reflow. If supplied for the semiconductor Η 18 or package, the solder f preferably takes into account the defined volume on each 1/0 ，, and the resulting bumps have a uniform height. According to another aspect of the present invention, the cream application and reflow steps can be performed in the same system, thereby eliminating the step of transferring the substrate from one station to another. In the preferred embodiment, a template is provided to assist in the application of a solder axe with a defined volume and height. The laser beam is then directly irradiated next to the solder ', preferably an unmoved template. According to another aspect of the present invention, an extra stencil is placed on top and the protective template is not exposed to the laser beam. Using this method can eliminate solder beads and reflow ovens, and the associated steps of transferring substrates to the oven from the pick and place system, thereby reducing costs. Brief description of the formula Figure 1.4 is a schematic illustration of an imaginary example of the present invention; Figure 1B is a longitudinal sectional view of the time when the squeegee sweeps the plant across the base village; Figure 2 is another view of the present invention Figure 3 is a schematic illustration of a specific example; Figure 3 is a flow chart showing the steps of the specific method shown in Figure 1. The paper standards are quickly used in China National Standard (CNS) A4 specifications (210X297 meters) A7 B7 Good " —Ministry Central " Zhun Er hT Consumer Cooperation Private Printing 51 Invention Description (3) Figure 4 is a flowchart showing the method according to the example shown in Figure 2-each step is issued "explain the conventional solder Paste application methods such as surface bonding generally involve the use of stencils. For example, solder paste can be applied to the surface of a substrate such as a printed circuit board using a stencil. Then the 1C package is placed on the board and the leads are on the solder paste, and the overall assembly is reflowed The packaging body is bonded to the board. Possible template technology can also be used to produce solder bumps. Solder paste is applied to the substrate β using a he plate, and then the template is removed and the substrate is transferred to a reflow container. But the aforementioned conventional PCB type The board method is not suitable for the direct production of solder bumps such as 〇Α Package / This method cannot reliably produce bumps with uniform height. This is an important requirement for BGA packages because the removal of the stencil before the reflow step inevitably causes some solder paste to adhere to the stencil. , Resulting in a change in the actual amount of reflowed solder paste. As a result, the height of the bumps has changed, which is unacceptable for many types of packaging. In another variation, the template remains on the substrate after the solder paste is applied. The material is used to perform the oven reflow step inside the template. However, this technology will lead to the need for numerous templates because the assembly line of the oven reflow step from the paste application step is quite long. In addition, different sealing bodies require different templates. The method further increases the cost of the tool. The present invention solves the aforementioned problem by providing a method for reflowing solder paste using laser technology. 9 The technology is simple and cost-effective, and can eliminate the oven used for the conventional reflow method. Uniform bump array requires the application of solder paste with a properly defined volume. The volume of this solder paste must be uniformly high when reflow is complete. Degree solder bumps. Best specific (please read the precautions of the back two before filling out this page) Installation -----_-- 1T-— —------ — ______ HI tn ·
-6 - 發明説明（4 Α7 Β7 於施用步驟使用型板。雷射頭組合焊料斧施用或印刷步驟 一起成為一個系統，故雷射再流動恰發生於焊料膏施用步 驟後而無需轉運步驟。於焊料膏印刷步驟後，基材保持於 印刷位置而進行雷射再流動。藉此方式對各個雷射頭之各 型封裝體僅需少改型板。 雷射束可由習知雷射頭如欽：含乙_銘_石梅石（Nd : YAG)雷射產生。若使用單頭則再流動可循序由一個型板 孔至另一個型板孔。若使用多頭則再流動可由一排孔前進 至另一排孔。本發明之有用應用包括生產B(3A封裝體及 晶圓上的隆塊。此等應用設計將焊料膏置於基材之1/〇墊 上並形成電連接用隆塊。供本說明之用，基材及其上之塾 包括半導體封裝體之基材如陶瓷，雙馬來醯亞胺三肼（BT) 帶也包括Μ®表面。焊料膏可為任一種附有溶料之谭料 膏，焊料顆粒包括附有基於水或無需清潔熔料之焊料顆粒 (請先w·讀背¾之注意事項再填寫本頁) 袈· -β 輕浐部中央枝^-^Άτ;消於合作7'1印$ι 第1A圖顯示界定容積之燁料膏如何施用於基材之方 法。本具體例申提供附有孔22之型板20。孔位置對應於基 板24上之塾位置，烊料膏待施用於該等整ι。用於半導想基 材’孔位置後對應於基材之I/O塾位置。含焊料膏之擠壓 器26於箭頭27指示方向移動跨越型板頂表面。如第⑺圖 所示，擠壓器較佳設置有銳利滯後緣29其可用來成功的掃 拂或刮除焊料素離開型板上表面。當擠壓器移動跨越型板 時’雷射束28由雷射頭30輸送出用於直接於型板内侧再流 動烊料骨而許可界於素與墊間形成一層金屬間焊接點而形-6-Description of the invention (4 Α7 Β7 uses a template in the application step. The laser head combines the solder axe application or printing steps together into a system, so laser reflow occurs just after the solder paste application step without the need for a transfer step. After the solder paste printing step, the substrate is held at the printing position for laser reflow. In this way, only a small number of modification plates are required for each type of package of each laser head. The laser beam can be obtained by the conventional laser head such as Qin : Contains B_ming_Shi Meishi (Nd: YAG) laser. If a single head is used, the reflow can be sequentially from one template hole to another. If multiple heads are used, the reflow can be advanced by a row of holes. To another row of holes. Useful applications of the present invention include the production of bumps on B (3A packages and wafers. These applications are designed to place solder paste on a 1/0 pad of a substrate and form bumps for electrical connection. For the purpose of this description, substrates and substrates including semiconductor packages such as ceramics, bismaleimide trihydrazide (BT) tapes also include M® surfaces. Solder paste can be any type with solvent Material paste, solder particles include water-based or no need Solder particles of clean flux (please read the precautions of ¾ before filling in this page) 袈 · -β The central branch of the light part ^-^ Άτ; eliminate the cooperation 7'1 Print $ ι Figure 1A shows the definition The method of how to apply the volume paste to the substrate. This example provides a template 20 with holes 22. The hole position corresponds to the position on the substrate 24, and the paste is to be applied to the whole substrate. Correspond to the I / O 塾 position of the substrate after the semi-conductor thinks the hole position of the substrate. The extruder 26 containing the solder paste moves across the top surface of the mold in the direction indicated by arrow 27. As shown in the second figure, squeeze The device is preferably provided with a sharp lagging edge 29 which can be used to successfully sweep or scrape solder away from the surface of the template. When the extruder moves across the template, the 'laser beam 28 is delivered by the laser head 30 for Reflow the concrete bone directly on the inside of the template to allow the boundary to form a layer of intermetallic welding point between the element and the pad.
• I ---- I n· 1^1 · -7- A7 ------------ B7_ 五、發明説明（5 ) :一· 成隆塊，較佳無需先去除型板。然後部分球形隆塊使其冷 卻隨後移開型板《如此可防止經界定容積之焊料膏於再流 動前受干擾而消除焊料斧沾黏於型板問題。 型板良好材料為不銹鋼或任何其他可忍受再流動製程 之熱且於再流動過程不容易沾黏焊料膏之材料例如氧化鉻 塗層。如此許可於再流動後容易離開型板，原因為不銹鋼 及氧化鉻等金屬不容易與焊料膏間形成金屬間鍵結故。型 板厚度較佳比習用於典型表面黏貼技術（s Μ τ)之型板更厚 ，原因為SMT使用之膏容積僅輔助裝置焊接於板而並不代 表形成隆塊。本發明之型板厚度係與再流動後期望之隆塊 尺寸成比例，可由業界人士無需經過不必要的實驗決定。 例如用於0.2微米直徑之隆塊可使用〇2_〇3毫米型板以 0.2-0.25毫米為較佳範圍。焊料膏含有水基熔料或無需清 潔熔料。若使用水基熔料則於再流動步驟後可使用習知洗 滌步驟。 第2圖顯示本發明之另一具體例。本具體例類似第1圖 但增加附有對應於型板孔之鑽孔34的模版32。板版之用進 係防止型板表面接觸雷射束，原因為其上方可能存在有殘 餘焊科素。如此防止殘餘焊料膏之再流動之型板表面，可 延長型板壽命。第3及4圖顯示此二具體例之較佳步驟。 於再流動過程使用型板也具有防止隆塊間架橋的優點 ，特別當墊間之間距小時尤為如此。藉由型板的存在可防 止熔化旁流動離開墊，可於型板孔形成大體球形隆塊。 雖然特別參照第1 -4圖說明本發明，但顯然易知其他 {請先«'讀背¾.之注意事項再填寫本頁 蚵浐部中央极準而爲工消於合作妇印^• I ---- I n · 1 ^ 1 · -7- A7 ------------ B7_ V. Description of the invention (5): 1. Chenglong block, preferably without first removing the type board. Then part of the spherical bumps are allowed to cool and then the template is removed. This prevents the defined volume of solder paste from being disturbed before reflow and eliminates the problem of sticking the solder axe to the template. A good material for the template is stainless steel or any other material that can withstand the heat of the reflow process and does not easily adhere to the solder paste during the reflow process, such as a chromium oxide coating. This allows the mold to easily leave after reflow, because the metal such as stainless steel and chromium oxide is not easy to form an intermetallic bond with the solder paste. The thickness of the pattern plate is preferably thicker than that used in the typical surface bonding technology (s τ), because the paste volume used by SMT only assists the welding of the device to the plate and does not represent the formation of bumps. The thickness of the stencil of the present invention is proportional to the expected size of the bump after reflow, and can be determined by those skilled in the art without undue experimentation. For example, for 0.2 micron diameter bumps, a 02-〇3 mm template can be used, with a preferred range of 0.2-0.25 mm. The solder paste contains water-based flux or no cleaning flux is required. If a water-based melt is used, a conventional washing step can be used after the reflow step. Fig. 2 shows another specific example of the present invention. This specific example is similar to FIG. 1 except that a stencil 32 is added with a drilled hole 34 corresponding to the pattern hole. The use of the plate is to prevent the surface of the template from contacting the laser beam, because there may be residual welding science above it. This prevents the reflow of the residual solder paste from the surface of the template, which can extend the life of the template. Figures 3 and 4 show the preferred steps for these two specific examples. The use of a template for the reflow process also has the advantage of preventing bridging between the bumps, especially when the distance between the cushions is small. The presence of the pattern prevents the melt from flowing away from the pad and forms a generally spherical bump in the pattern hole. Although the present invention will be described with particular reference to FIGS. 1-4, it is obvious that other {please read the notes of «'reading ¾.» Before filling out this page.
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.1 I —1 I 五、 387830 A7 B7 發明説明（ 技術也可用於沈積具有界定容積或高度之焊料膏於基材墊 上。例如先進注射技術可用於變成無型板方法。此種情況 下一塊焊料素直接注射於基材墊上，進行雷射再流動而無 需型板。於本發明之教示範圍多種其他變化皆屬可行。 元件標號對照 20…型板 28.··雷射束 2 2...孔 29··.銳利滯後緣 24...基材 30...雷射頭 26...擠壓器 32...模版 27...箭頭 34…鑽孔 (請先M讀背面注f項再4寫本頁) i 11 經^部中央极车^妇工消贽合作相印繁 本紙張尺度述用中國國家標準（CNS ) A4規格（210X297公釐）.1 I —1 I V. 387830 A7 B7 Description of the Invention (Technology can also be used to deposit solder paste with a defined volume or height on a substrate pad. For example, advanced injection technology can be used to form a patternless board. In this case a piece of solder The element is directly injected on the substrate pad, and the laser is reflowed without the need for a template. Many other changes are possible in the teaching scope of the present invention. The component number is compared with the 20… type plate 28. ·· laser beam 2 2 ... Hole 29 ... sharp lagging edge 24 ... substrate 30 ... laser head 26 ... squeezer 32 ... stencil 27 ... arrow 34 ... drilling (please read M note on the back side first f Xiang Zai 4 writes this page) i 11 The Ministry of Economy and Technology, China Central Electric Vehicles, Women's Workers, and Cooperative Printing and Printing of Traditional Chinese Paper Standards are described in Chinese National Standard (CNS) A4 (210X297 mm)