TW317072B - - Google Patents

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Publication number
TW317072B
TW317072B TW86100034A TW86100034A TW317072B TW 317072 B TW317072 B TW 317072B TW 86100034 A TW86100034 A TW 86100034A TW 86100034 A TW86100034 A TW 86100034A TW 317072 B TW317072 B TW 317072B
Authority
TW
Taiwan
Prior art keywords
sheet
copper
uncontaminated
component
edge
Prior art date
Application number
TW86100034A
Other languages
English (en)
Chinese (zh)
Original Assignee
Johnson & Johnston Ass Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson & Johnston Ass Inc filed Critical Johnson & Johnston Ass Inc
Application granted granted Critical
Publication of TW317072B publication Critical patent/TW317072B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW86100034A 1996-01-09 1997-01-04 TW317072B (ru)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58382396A 1996-01-09 1996-01-09

Publications (1)

Publication Number Publication Date
TW317072B true TW317072B (ru) 1997-10-01

Family

ID=24334718

Family Applications (1)

Application Number Title Priority Date Filing Date
TW86100034A TW317072B (ru) 1996-01-09 1997-01-04

Country Status (3)

Country Link
AU (1) AU1529097A (ru)
TW (1) TW317072B (ru)
WO (1) WO1997025841A1 (ru)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI710295B (zh) * 2020-01-02 2020-11-11 峻立科技股份有限公司 塑膠元件與電路板的結合方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19831461C1 (de) * 1998-07-14 2000-02-24 Dieter Backhaus Verfahren zur partiellen Verbindung von Kupferfolien und Trennblechen (CuAI-Verfahren)
DE19859613C2 (de) 1998-12-23 2001-09-06 Buerkle Gmbh Robert Presspaketaufbau und Verfahren zu dessen Herstellung
ITMI20120194A1 (it) * 2012-02-13 2013-08-14 Cedal Equipment Srl Miglioramenti nella fabbricazione di pile di laminati plastici multistrato per circuiti stampati
JP6460285B1 (ja) * 2017-06-02 2019-01-30 日立金属株式会社 板材および板材の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4875283A (en) * 1986-11-13 1989-10-24 Johnston James A Method for manufacturing printed circuit boards
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5615470A (en) * 1992-05-05 1997-04-01 Cedal S.R.L. Process for producing plastic laminates with metal laminae

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI710295B (zh) * 2020-01-02 2020-11-11 峻立科技股份有限公司 塑膠元件與電路板的結合方法

Also Published As

Publication number Publication date
WO1997025841A1 (en) 1997-07-17
AU1529097A (en) 1997-08-01

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