AU1529097A - Component for and method of making copper clad substrates - Google Patents

Component for and method of making copper clad substrates

Info

Publication number
AU1529097A
AU1529097A AU15290/97A AU1529097A AU1529097A AU 1529097 A AU1529097 A AU 1529097A AU 15290/97 A AU15290/97 A AU 15290/97A AU 1529097 A AU1529097 A AU 1529097A AU 1529097 A AU1529097 A AU 1529097A
Authority
AU
Australia
Prior art keywords
component
copper clad
making copper
clad substrates
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU15290/97A
Inventor
Albert H. Burgun
James A. Johnston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson and Johnston Associates Inc
Original Assignee
Johnson and Johnston Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson and Johnston Associates Inc filed Critical Johnson and Johnston Associates Inc
Publication of AU1529097A publication Critical patent/AU1529097A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
AU15290/97A 1996-01-09 1997-01-06 Component for and method of making copper clad substrates Abandoned AU1529097A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US58382396A 1996-01-09 1996-01-09
US583823 1996-01-09
PCT/US1997/000216 WO1997025841A1 (en) 1996-01-09 1997-01-06 Component for and method of making copper clad substrates

Publications (1)

Publication Number Publication Date
AU1529097A true AU1529097A (en) 1997-08-01

Family

ID=24334718

Family Applications (1)

Application Number Title Priority Date Filing Date
AU15290/97A Abandoned AU1529097A (en) 1996-01-09 1997-01-06 Component for and method of making copper clad substrates

Country Status (3)

Country Link
AU (1) AU1529097A (en)
TW (1) TW317072B (en)
WO (1) WO1997025841A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19831461C1 (en) * 1998-07-14 2000-02-24 Dieter Backhaus Process for the partial connection of copper foils and separating sheets (CuAI process)
DE19859613C2 (en) * 1998-12-23 2001-09-06 Buerkle Gmbh Robert Press pack construction and process for its production
ITMI20120194A1 (en) * 2012-02-13 2013-08-14 Cedal Equipment Srl IMPROVEMENTS IN THE MANUFACTURE OF BATTERIES OF MULTILAYER PLASTIC LAMINATES FOR PRINTED CIRCUITS
WO2018220891A1 (en) * 2017-06-02 2018-12-06 日立金属株式会社 Plate material and method for producing plate material
TWI710295B (en) * 2020-01-02 2020-11-11 峻立科技股份有限公司 Combination method of plastic component and circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4875283A (en) * 1986-11-13 1989-10-24 Johnston James A Method for manufacturing printed circuit boards
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
ATE143860T1 (en) * 1992-05-05 1996-10-15 Cedal Srl METHOD FOR PRODUCING PLASTIC LAMINATES WITH METAL LAYERS, PARTICULARLY FOR PRINTED CIRCUITS

Also Published As

Publication number Publication date
TW317072B (en) 1997-10-01
WO1997025841A1 (en) 1997-07-17

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