317072 A7 B7 發明説明（ί) 本發明之領域： 本發明總體而言係有關印刷電路板，而尤其指在印刷 電路板製造中所使用的方法以及在這樣的製造製程中所使 用的構件。 本發明之背景： 在其基本型式中，一個電的印刷電路板包括，當作一 構件之Μ' “預浸漬體”而聞名於世的一個樹脂浸濱的環氧 樹脂、網狀交继的玻璃纖維之介電層，導電銅萡薄片被壓 製而舖在此“預浸濱體”的正反兩側，而後，經過一些照 像製程，此銅箔被蝕刻而在預浸潰體層的表面產生導電的 路徑，當被這樣組合時，此薄片其本身可以為一較複雜之 電路板的構件或者.可Μ是一塊板子，就其本身而論。 經濟部中央揉準局員工消費合作杜印装 在製造製程中，组合一蠱這樣的構件，在上面所述之 基本型式的任何一種，或者具有一些合成層，一個叠在另 一·個之上，係很平常的，相鄰板之銅箔表面通常被金靥板 例如像被稱之為隔離板或平面板之光滑的不銹鋼片或鋁片 相互隔離，他們在壓製製程期間（在壓製中牽涉到熱及壓 力）嚙合此銅箔Κ確保銅萡不會被壓傷或是刮傷，此金屬 板也幫肋了藉導電而分散熱量，此组合被稱為一個壓叠層 而此一叠板則被稱為一個簿冊，此整個簿冊被放在壓床中 ，被加熱以及易於加壓，在冷卻與加工處理之後，此其後 被结合之個別板被各自分開，此隔離板被去除並且板子要 遭受進一步的加工處理，此一般的叠層技術被說明於美國 -4 - 本紙張尺度適用中國國家榇準（CNS ) Α4規格（2丨0X297公釐） 317072 A7 B7 五、發明説明U ) 專利第4, 875, 283號案中。 另一個用於製造印刷電路板的程序被揭示在國際性發 行刊物第WO S 3 / 2 2 1 3 9號中，發明者辨識適合於上述之產品 的壓製牽涉個別分離的構件必定非常地複雜，這些壓製因 為隔離板的出現Μ及，進一步地，必須同時以定義明確的 與準確的先後順序之熱及壓力的情形下來生產而導致具有 低產量，'這些壓製必須藉傳導均勻的溫度遍及在叠層中的 各種板子與金靥板來製造，這明顯地因為只有在板子的上 面與下面將會與直接加熱的金屬片接觸的事實而被複雜化 Ο 特別是，熱的傳播從壓製的加熱金靨板到堆叠的簿冊 ，而且，相反地，在冷卻階段所需之冷卻效率，被必須經 過由具有高絕緣數值與已知為熱的非常不良導體之浸濱的 孅維玻璃和塑膠樹脂所組成的預浸濱體構件而被大大地阻 礙，除了使壓製结構複雜化之外，許多隔離板的出現減慢 了板子的装載與卸貨的速度。 國際性發行刊物第㈣9 3 / 2 2 1 3 9號實際地掲示一個用以 製造印刷電路板之不同的製程，但是仍然具有如同在前面 所述之製程中的一些纖維玻璃薄板，係和塑膠材料一起被 浸濱，Κ及在其一面或者兩面上的飼萡。 然而，在此不同的製程中，不是_的薄片被個別地鋪 在預浸潰體的薄板上，而是此銅萡由一捲被解開，係相關 於此叠板子Μ反覆的經過從一側到另一側移動，一個銅箔 本紙張尺度適用中國國家標準（CNS ) Α4規格（2丨Ο X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 、1Τ 經濟部中央橾準局貝工消費合作社印策 經濟部中央標準局貝工消費合作社印製 A7 B7 五、發明説明（j ) 的原始長度係相當於沿此預浸濱體之第一層的較低面側邊 ，從下面開始，此捲軸被致使垂直地移動，在此預浸濱體 的相反側處，此捲稍微地上升並且其方向倒轉1 8 0度而 成一迴路，第二層銅箔被鋪在此預浸漬體上表面之上，一 個被陽極電鍍之鋁的金屬隔離薄Η被鋪在此銅箔之上，此 捲的方向再次被倒轉並且當做另一層銅萡被解開在具有另 一個迴路於末端處之隔離薄片上，此過程被重複直到所需 數目的板子被结合，每一層板具有預浸漬體、兩面均有銅 萡Μ及在相鄰板之間有一隔離薄片。 此詷箔的兩個末端被連接到一適當地提供電力之電力 發電機並且壓力被施加於此簿冊，電力的流動電阻性地加 熱在蠱層中經過每一簿冊之被導電的銅箔並且此簿冊然後 被在預浸潰體中的樹脂黏合，在冷卻之後，該隔離薄板被 去除並且此被環繞的銅箔然後從被進一步加工處理的板子 被裁剪下來。 製造電路板之迴路環繞方法的另一版本在國際性發行 刊物第W 0 9 4 / 0 1 2 6 3中被發現，在先前的製程中，只有飼箔 被以連壤的迴路環繞結合而且具有預浸濱體的分離薄片被 夾在介於迴路環繞之間的銅萡之間，而在W 0 9 4 / 0 1 2 6 3發行 刊物中，不但銅萡由捲狀物來供應，而且玻璃纖維預浸漬 體也以同樣的方式來供應，在结合之前，此預浸漬體被展 開並且被夾在飼箔的内曆與外層之間，被合成的銅萡層與 預浸濱體層然後使用1 8 0迴路環繞技術被當做一個單位 -6- 本紙張尺度適用中國國家標準（CNS ) Α4规格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 317072 A7 B7 五、發明説明（iV ) 而结合入電路板中。 仍為連壤之迴路環繞技術的另一版本被揭示於國際性 發行刊物第W 094/17976號中，其中兩捲的鋦萡被使用，底 板之較低層銅泊被環繞四周1 8 0度而成為具有被浸潰的 玻璃纖雄之環氧樹脂介於其間的下一個相鄰板之較高層， 此底板之較高層铜箔則從第二捲供應並且被環繞1 8〇度 而成為在下一個相鄰簿冊中的較低層，此製程被重複直到 簿冊板被完成’兩層飼萡的每一層藉並聯連接此銅萡的分 離鉛導線被連接到發電機。 在其後之發行刊物中，國際性發行刊物第㈣94/17975 號’簿冊姐合的另一版本被揭示，在此，銅薄板或鐵薄板 在每一塊板的末端處停止，但是，他們藉連接相鄰薄板之 導線而達成電性連縷，只有此導線被迴路環繞。 S胃：& '法2最大的優點在於其不需要必須被加熱的 壓製’它僅需一電力源通過電流經過銅箔，因為铜萡是如 此的薄’產生所需的熱量，此能量的節省導致實際地降低 生產的成本。 經濟部中央標準局員工消費合作社印製 ---------T'k — (請先閱讀背面之注意Ϋ項再填寫本頁) 但是’迴路環繞技術也有缺點，第一個缺點係對用K 施加銅萡到介電體之精密的捲動機械裝置的需求，一件如 此的裝置被列擧於國際性發行刊物第〇 9 4 / 2 3 9 4 8號中，其 中一連串移動的銅萡捲來回地擺動當其解開此銅萡並鋪此 銅萡在每一塊板的末端成1 8 ◦度迴路環繞時，這種裝置 係昂貴而且複雑的，另一型式的结合裝置也被發現被揭示 -7 - 本紙張尺度適用中國國家標準（〇阳）六4«^(210'乂297公釐） 經濟部中央標準局員工消费合作社印褽 A7 _ B7_ 五、發明说明（$ ) 於國際性發行刊物第w 0 S 4 / 2 S 0 S 3號中。 另一個問題則為當銅萡藉在預浸濱體薄板或多層板上 之移動的銅萡捲被鋪平時銅萡的起皺問題，此銅萡捲横過 板子的邊緣會產生皴摺係因為此銅箔捲的移動並不是Μ正 確的角度到達此薄板的邊緣或者此薄板並非適當地對正銅 萡捲的方向。 在藉'上述之個別的结合技術或迴路環繞方法之印刷電 路板的製造中，嗣萡薄Η之清潔的維持或是沒有污染係相 當重要的，不論此印刷電路板是外層為銅箔而內層為預浸 漬體的單一夾合板或者是許多層的合成板，此恆為真。 污染之主要的致因其中之一係樹脂粉塵、纖維玻璃的 纖維、毛髮、蟲以及由先前的製造及預浸漬體的切割與此 預浸漬體的運送和儲存所產生各種不囘型式之外來物質的 出現，在印刷電路板之簿冊的结合中，在藉各種的擦拭技 術來去除此樹脂粉塵中必須極為小心，然而，部分的粉塵 仍然留在銅箔表面係無法避免的，當熱及壓力被施加時， 在層壓製程中樹脂粉塵會熔化而產生或沈積班點在銅箔的 表面上。 儘管這是在上述之一般结合技術中的一個問題，在迴 路環繞技術中因為捲镜機器的複雜性及此銅箔之連續的曝 露在疊層室中密閉的情形下，此問題更為普遍。 對於此個別之结合技術在此藉其完整的說明被併入當 做參考這些問題已經在美國專利第5，1 5 3 , 0 5 0號案中被強 -8 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公嫠） (請先閲讀背面之注意事項再填寫本頁)317072 A7 B7 Description of invention (ί) Field of the invention: The present invention relates generally to printed circuit boards, and in particular refers to methods used in the manufacture of printed circuit boards and components used in such manufacturing processes. Background of the present invention: In its basic form, an electrical printed circuit board includes a resin-impregnated epoxy resin, mesh-like successor known as M '"prepreg" as a component The dielectric layer of glass fiber, the conductive copper foil is pressed and spread on the front and back sides of the "pre-preg", and then, after some photographic processes, this copper foil is etched on the surface of the prepreg layer To produce a conductive path, when combined in this way, the sheet itself can be a component of a more complex circuit board or it can be a board, as far as it is concerned. The Ministry of Economic Affairs Central Bureau of Accreditation and Employee's Consumer Cooperation Du Printing is installed in the manufacturing process, combining a Gu such a member, any of the basic types mentioned above, or having some synthetic layers, one stacked on top of the other It is very common that the copper foil surfaces of adjacent plates are usually isolated from each other by a smooth stainless steel sheet or aluminum sheet such as a so-called isolating plate or flat plate. They are involved in the pressing process (involved in pressing To heat and pressure) Engage this copper foil K to ensure that the copper foil is not crushed or scratched. This metal plate also helps to dissipate heat by conduction. This combination is called a laminated layer and this laminated plate It is called a book. The entire book is placed in a press, heated and easily pressurized. After cooling and processing, the individual boards that are joined afterwards are separated from each other. The isolation board is removed and the board is removed. To be subjected to further processing, this general lamination technique is illustrated in the US-4-This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (2 丨 0X297mm) 317072 A7 B7 V. Description of Invention U ) Patent Case No. 4, 875, 283. Another procedure for the manufacture of printed circuit boards was revealed in the international publication No. WO S 3/2 2 1 3 9. The inventors identified that the suppression of products suitable for the above-mentioned products involves individual separation of the components must be very complicated, These pressings are due to the appearance of isolation plates and, furthermore, they must be produced in a well-defined and accurate sequence of heat and pressure at the same time, resulting in low yields. These pressings must be conducted through a uniform temperature throughout the stack. The various boards in the layer are made with gold-plated boards, which is obviously complicated by the fact that only the upper and lower sides of the board will be in contact with the directly heated metal sheet. In particular, the heat spread from the pressed heated gold From the board to the stacked books, and, conversely, the cooling efficiency required in the cooling stage must be composed of a combination of glass and plastic resin with high insulation values and a very poor conductor known as heat. The pre-impregnated hammer structure is greatly hindered. In addition to complicating the pressing structure, the appearance of many isolation plates has slowed the loading of the board. With the speed of unloading. The international publication No. 9 3/2 2 1 3 9 actually shows a different process for manufacturing printed circuit boards, but it still has some fiber glass sheets, and plastic materials as in the process described above They are soaked together, Κ and the edibles on one or both sides. However, in this different process, it is not the thin sheet that is individually laid on the thin sheet of the prepreg, but the copper lye is unwound from a roll, which is related to the repeated passage of the stacked plate Μ from one side To move to the other side, a copper foil paper standard is applicable to the Chinese National Standard (CNS) Α4 specification (2 丨 Ο X 297mm) (please read the precautions on the back before filling out this page), 1T Central Ministry of Economic Affairs Printed by the Beibei Consumer Cooperative, printed by the Central Standards Bureau of the Ministry of Economic Affairs, printed by A7 B7. 5. The original length of the description (j) is equivalent to the lower side of the first layer of the prepreg. From below, the reel is caused to move vertically. At the opposite side of the prepreg, the reel rises slightly and its direction is reversed 180 degrees to form a loop. The second layer of copper foil is laid here. On the upper surface of the impregnated body, an anodized aluminum metal separator Η was laid on the copper foil, the direction of the roll was reversed again and it was unwound as another layer of copper cladding with another loop at the end Place on the isolated sheet, this process Repeated until the desired number of boards are combined with each prepreg plies, both sides and has a copper Be Μ sheet isolation between adjacent plates. The two ends of the bastard foil are connected to a power generator that properly supplies power and pressure is applied to the book, and the flow of electric power resistively heats the conductive copper foil passing through each book in the Gu layer and this The booklet is then bonded with the resin in the prepreg, and after cooling, the insulation sheet is removed and the surrounding copper foil is then cut from the board which is further processed. Another version of the circuit wrap method for manufacturing circuit boards was found in the international publication No. W 0 9 4/0 1 2 6 3. In the previous process, only the feeding foil was combined with a continuous circuit surround and had The separated sheet of the prepreg is sandwiched between the copper husks between the loops, and in the W 0 9 4/0 1 2 6 3 publication, not only the copper husks are supplied by the roll, but also the glass The fiber prepreg is also supplied in the same way. Before bonding, this prepreg is unfolded and sandwiched between the inner calendar and the outer layer of the feeding foil. The synthesized copper cladding layer and prepreg layer are then used 1 8 0 loop surround technology is regarded as a unit-6- This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (210 X 297 mm) (please read the precautions on the back before filling this page) Order 317072 A7 B7 V. The invention description (iV) is incorporated into the circuit board. Another version of the looping technology, which is still connected to the border, was revealed in the international publication No. W 094/17976, in which two volumes of yam are used, and the lower layer of the bottom plate is surrounded by 180 degrees It becomes the higher layer of the next adjacent board with the impregnated glass fiber male epoxy resin in between, and the higher layer copper foil of this base plate is supplied from the second roll and is wrapped around 180 degrees to become the lower layer For a lower layer in an adjacent book, this process is repeated until the book board is completed. Each layer of the two-layer feeder is connected to the generator by a separate lead wire that connects the copper separator in parallel. In subsequent publications, another edition of the international publication No. (94/17975) 'Books and sisters' was revealed. Here, the copper or iron sheets stop at the end of each board, but they are connected by The wires of adjacent thin plates are electrically connected, and only this wire is surrounded by the loop. S stomach: & 'The biggest advantage of Method 2 is that it does not require pressing which must be heated' It only requires an electric power source to pass current through the copper foil, because the copper is so thin 'to generate the required heat, this energy The savings lead to a practical reduction in production costs. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs --------- T'k — (please read the note Ϋ on the back and then fill out this page) However, the circuit surround technology also has shortcomings, the first shortcoming is There is a demand for a precision winding mechanism that applies copper to the dielectric with K. One such device is listed in the international publication No. 09 4/2 3 9 4 8 and a series of mobile The copper roll oscillates back and forth. When it unravels the copper burr and lays the copper burr at the end of each board in a loop of 18 degrees, this device is expensive and complex. Another type of bonding device is also Found to be revealed -7-This paper scale is applicable to the Chinese National Standard (〇 阳) 六 4 «^ (210′297297mm) The Ministry of Economic Affairs Central Standards Bureau Employee Consumer Cooperative printed A7 _ B7_ V. Description of the invention ($) In the international publication publication No. w 0 S 4/2 S 0 S 3. Another problem is the wrinkling of the copper yam when the copper yam is flattened by the moving copper yam roll on the prepreg sheet or multi-layer board. This copper yam roll across the edge of the board will produce a fold. Because the movement of the copper foil roll is not the correct angle to reach the edge of the thin plate or the thin plate is not properly aligned with the direction of the copper roll. In the manufacture of printed circuit boards by the above-mentioned individual bonding techniques or loop-around methods, it is important to maintain the cleanliness of the thin Η or no pollution, whether the outer layer of the printed circuit board is copper foil The layer is a single sandwich board of prepreg or a composite board of many layers, which is always true. One of the main causes of pollution is resin dust, fiberglass fiber, hair, insects, and various non-returnable foreign substances generated by previous manufacturing and cutting of the prepreg and transportation and storage of the prepreg The emergence of, in the combination of printed circuit board books, must be extremely careful in using various wiping techniques to remove this resin dust, however, some of the dust remains on the surface of the copper foil is unavoidable, when heat and pressure are When applied, the resin dust will melt during the lamination process to produce or deposit spots on the surface of the copper foil. Although this is a problem in the above-mentioned general combination technology, this problem is more common in the case of the loop wrapping technology because of the complexity of the mirror rolling machine and the continuous exposure of this copper foil in the stacking chamber. This individual combination technique is hereby incorporated by reference with its complete description. These issues have been strengthened in the case of US Patent No. 5, 1 5 3, 0 5 0-This paper scale is applicable to the Chinese national standard ( CNS) Α4 specification (210Χ297 public daughter) (Please read the precautions on the back before filling this page)
•IT A7 317072 _B7 五、發明説明（) 調。 (請先閲讀背面之注意事項再填寫本頁) 此美國專利第5 , 1 5 3 , 0 5 0號發明在使用於印刷電路板 和與其性質相同物品的製造中之構件中被具體化，此構件 為由至少一 Η銅箔所組成的~個薄板，當其被組裝入一印 刷電路板時 > 此銅萡係由此電路板的一個功能此組件，也 就是導電的路徑所組成，此薄板的其他組件為一個構成一 完成的印’刷電路板之可丟棄式組件的鋁質基板薄片，每一 個飼萡薄片與鋁薄片的一個表面必須沒有被污染而且在其 交接面處可Κ互相嚙合。 此薄板的構件可Κ由夾合一片構成一可丟棄式組件之 鋁薄片的兩片飼箔薄片所組成，每一個銅箔薄片的內表面 與鋁薄片的兩面皆必須沒有被污染而且在鋁薄片的正反兩 側的交接面上可Μ互相嚙合，在交接面處係一中央區域， 導電的線路將被蝕刻於此中央區域，此區域必須被保持不 被污染。 經濟部中央揉準局貝工消費合作社印製 有强性的黏著劑使薄板之未被污染的表面與中央區域 的外圍结合在一起而使他們的邊緣充分的结合Κ維持此薄 板之邊緣的内部之中央區域的必須未被污染之特性，此銘 基板提供銅萡所需的堅硬並且使其更容易搬運操作。 本發明旨在處理這些迴路環繞技術的問題。 本發明之概要： 本發明存在於使用在製造物品像印刷電路板中之構件 的部分中並且特別指以迴路環繞技術所製造的電路板，其 -9- 本紙张尺度適用中國國家標準（CNS ) Α4規格（210 X 297公釐） 經濟部中央標準局貝工消费合作社印製 A7 _ B7_ 五、發明説明（7 ) 包括，在一個完成的印刷電路板中，一個由構成功能性姐 件之兩片銅箔所組成的薄片 > 被夾在這些薄片之間的是一 片鋁片，當做一隔離板，係構成一可丟棄式組件，每一片 銅萡薄片的一面和此鋁片的兩面均必須未被污染，這些未 被污染的表面在其交接面處被互相嚙合，每一月薄Μ之未 被污染的交接面具有一在此薄片之邊緣Κ内的中央區域， 一個末端'邊緣被留在向鋁隔離薄片兩側之每一邊Κ外延伸 的每一 銅Μ薄片上並且將被结合以建立一經過一叠板子 之連續的電力路徑，黏合物係位在中央區域Μ外的薄板之 間以維持此装置之中央區域必須未被污染之特性，此黏著 劑被施加在被選定的沈積區域中，此區域可以是一個將維 持此中央區域之必須未被污染的特性之被中斷於或未被中 斷於接近薄板的周邊或者其他之相等組態的地帶。 一個製造成此類具有外導電的金屬層與至少一層包含 熱可硬化之樹脂的内介電層之印刷電路板的方法包括組合 一多層介電層之簿冊的步驟及導電的銅箔構件其每一個構 件夾合一層鋁，介電層與構件層Κ 一壓層叠起的方式被組 合一層叠在另一層之上，每一個構件之銅箔的延伸之遙緣 以超'音波焊接技術或以任何使銅萡邊緣產生足夠的金屬接 觸而使其能連键導電的技術來结合在一起，然後每一個構 件之銅萡薄片的逄緣與具有預浸漬體層在其上Μ使每一個 構件分離的構件之遲緣相结合，在鋁薄Μ之交替的邊緣上 做成的連接Μ使導電的路徑成一並聯的電路，此簿冊然後 -1 0 - 本紙張尺度適用中國图家標準（CNS ) Α4規格（210X 297公釐） ---------Q—- (請先閱讀背面之注意事項再填寫本頁) 訂• IT A7 317072 _B7 Fifth, the invention description () transfer. (Please read the precautions on the back before filling in this page) This invention of US Patent No. 5, 1 5 3, 0 5 0 is embodied in components used in the manufacture of printed circuit boards and articles of the same nature as this, The component is a thin plate composed of at least one Η copper foil, when it is assembled into a printed circuit board > this copper yoke is a function of this circuit board, this component, which is composed of a conductive path, this The other components of the sheet are an aluminum substrate sheet that constitutes a disposable printed circuit board disposable component. Each surface of the feed sheet and the aluminum sheet must not be contaminated and can interact with each other at its interface. Mesh. The structure of this sheet can be composed of two feeding foil sheets sandwiching an aluminum sheet forming a disposable component. The inner surface of each copper foil sheet and both sides of the aluminum sheet must not be contaminated and the aluminum sheet The front and back sides of the interface can be meshed with each other. A central area is formed at the interface. The conductive lines will be etched in this central area. This area must be kept free from contamination. The Ministry of Economic Affairs Central Bureau of Precision Industry Beigong Consumer Cooperative printed a strong adhesive to combine the uncontaminated surface of the sheet with the periphery of the central area to fully integrate their edges. K maintains the interior of the edge of the sheet The central area must be uncontaminated. This base plate provides the rigidity required for the copper husk and makes it easier to handle. The present invention aims to deal with the problems of these loop-around techniques. Summary of the present invention: The present invention exists in the parts used in the manufacture of articles like printed circuit boards and especially refers to the circuit boards manufactured by the loop wrapping technology, its -9- This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (210 X 297 mm) A7 _ B7_ printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of invention (7) Including, in a completed printed circuit board, one consists of two functional functional parts A sheet composed of a piece of copper foil > An aluminum sheet is sandwiched between these sheets. As a separator, it constitutes a disposable component. One side of each copper sheet and both sides of this aluminum sheet must be Uncontaminated, these uncontaminated surfaces are intermeshing at their interface, each month a thin M uncontaminated interface mask has a central area within the edge κ of this sheet, and one end 'edge is left On each copper M sheet extending outward on each side of the two sides of the aluminum isolation sheet and will be bonded to establish a continuous electrical path through a stack of boards, the adhesive is located in the central area Between the thin plates outside Μ to maintain the characteristics of the central area of the device must be uncontaminated. The adhesive is applied to the selected deposition area. This area may be a characteristic that will maintain the central area must be uncontaminated It is interrupted or not interrupted in the vicinity of the periphery of the thin plate or other areas of equal configuration. A method of manufacturing such a printed circuit board having an outer conductive metal layer and at least one inner dielectric layer containing a thermosetting resin includes a step of combining a booklet of multiple dielectric layers and a conductive copper foil member Each component is sandwiched with a layer of aluminum, and the dielectric layer and the component layer K are laminated and stacked on top of each other in a laminated manner. The extension of the copper foil of each component is supersonic welding technology or Any technique that brings sufficient metal contact to the edge of the copper husk to enable it to bond and conduct electricity, and then the edge of the copper lamella of each component is separated from the rim with a prepreg layer on it. The late edges of the components are combined, and the connection M made on the alternating edges of the aluminum thin M makes the conductive path into a parallel circuit. This booklet is then -10.-This paper scale is applicable to the China Tujia Standard (CNS) Α4 specification (210X 297mm) --------- Q—- (Please read the precautions on the back before filling in this page)
J 經濟部中央標準局貝工消費合作社印製 Α7 Β7 五、發明説明（f) 易於加壓而且電流流經飼箔薄片足K使整個叠層均勻地加 熱，熔化樹脂並且使此銅箔黏合到預浸濱體或多層板的上 、下兩曆，如果其中之一被使用的話。 當此簿冊損壞時，完成的板子具有一層銅箔在預浸潰 體的上、下兩面上，銅形成來自於被组合在預浸潰體之上 的構件之最上層並且電路板的下表面已成為被組合在預浸 濱體之下'的電路板之上飼箔層。 本發明之上面及其他的特色，係包括所有部分的架構 與組合之不同及新穎的细節，現在將參考伴隨之附圖被更 特別地說明並且在申請專利範圍中被指出，使本發明具體 化之製造印刷電路板的特別構件與方法僅藉由例舉說明來 顯示而並非當做本發明的極限，本發明的原則與特色可Μ 被使用在不同的及許多的實施例中而不會違反本·發明的範 噶。 附圖之簡略說明： 圖1係使用在使本發明的特色具體化之印刷電路板的 製造中之構件的簡要平面圖。 圖2係放大圖1之構件的末端邊緣部分之示意斷面圖 〇 圖3係圖1之構件的擴大示意横斷面圖。 圖4係根據本發明所製造的印刷電路板之擴大示意横 斷面圖。 圖5係根據習知技術迴路環繞的萡片方法所製造之印 -1 1 - 本紙浪尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) .kk.J A7 B7 printed by Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (f) It is easy to pressurize and the current flows through the feeding foil sheet foot K to heat the entire laminate evenly, melt the resin and bond the copper foil to The upper and lower calendars of the prepreg or multi-layer board, if one of them is used. When the book is damaged, the finished board has a layer of copper foil on both the upper and lower sides of the prepreg. The copper is formed from the uppermost layer of the component assembled on the prepreg and the lower surface of the circuit board has Become a foil layer on the circuit board that is assembled under the prepreg. The above and other features of the present invention include the differences and novel details of the architecture and combination of all parts, and will now be described more specifically with reference to the accompanying drawings and pointed out in the scope of the patent application, making the present invention specific The special components and methods for manufacturing printed circuit boards are only shown by way of illustration and not as the limit of the present invention. The principles and features of the present invention can be used in different and many embodiments without violating Fan Karma of this invention. Brief description of the drawings: Fig. 1 is a schematic plan view of components used in the manufacture of a printed circuit board embodying the features of the present invention. Figure 2 is an enlarged schematic cross-sectional view of the end edge portion of the component of Figure 1. Figure 3 is an enlarged schematic cross-sectional view of the component of Figure 1. Fig. 4 is an enlarged schematic cross-sectional view of a printed circuit board manufactured according to the present invention. Figure 5 is a seal made according to the cleat method surrounded by the conventional technical circuit-1 1-This paper wave scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) (please read the precautions on the back before filling this page ) .kk.
*1T A7 B7 經濟部中央標準局貝工消費合作社印製 317072 五、發明説明（q ) 刷電路板的多層结合之擴大示意横斷面圖。 圖6係根據本發明所製造之多層印刷電路板的擴大示 意横斷面圖。 本發明之詳细說明： 一個用Μ製造印刷電路板的構件3 〇將可在圖1與圖 2中看到’係在製造印刷電路板中藉電力加熱飼箔而使叠 層被加熱之技術的特殊用法以有別於一被加熱之壓製的用 法’其包括一商業等级鋁的基板Α (圖2 )，鋁之滿意的 厚度已經被發現從大約G . Q 1 〇 英吋到0 . (Π 5英吋，雖然鋁 的厚度有賴其最終的用法可以從大約〇 . q 〇 1英时到Q . 1 2 5 英吋’位於其上表面的係一片銅箔，具有這樣厚度的鋁， 此銅箔會是1/2盎斯的銅，這意謂每一平方英呎的銅萡 有重1/2盎斯的銅，當銅被均勻的分布，其厚度將大約 為0.0DG7英吋，一般而言，這對在目前的印刷電路板來說 係工業標準。 . 雖然鋁係目前用於基板之較佳的材料，其他的金屬， 例如不綉鋼或是鎳合金，也可以被使用。 鋦的外表面C 〇，顯示於圖2中如上表面，係先被氧 化並且常常具有灰的顔色，視所使用的氧化過程而定，然 而其他的顔色視其過程也有可能產生，完成之後Μ使其更 容易與預浸潰體黏著於其在印刷電路板製造過程中將被结 合之處，興的內表面.C i必須未被污染，意謂在表面上沒 有任何具有足夠大小或是自然的污染物以致於妨礙飼的最 -12- 本紙张尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)* 1T A7 B7 Printed by Beigong Consumer Cooperative of Central Bureau of Standards, Ministry of Economic Affairs 317072 V. Description of invention (q) Expanded schematic cross-sectional view of the multi-layer combination of brush circuit boards. Fig. 6 is an enlarged schematic cross-sectional view of a multilayer printed circuit board manufactured according to the present invention. Detailed description of the present invention: A member for manufacturing a printed circuit board using Μ will be seen in FIGS. 1 and 2 ”is a technology for heating the laminate by heating the feeding foil in the manufacturing of the printed circuit board by electricity The special usage is different from the one used for heating and pressing. It includes a commercial grade aluminum substrate A (Figure 2). The satisfactory thickness of aluminum has been found to be from about G. Q 10 inches to 0. ( Π 5 inches, although the thickness of aluminum depends on its final usage can be from about 〇. Q 〇1 inch to Q. 1 2 5 inches' on its upper surface is a piece of copper foil, with such a thickness of aluminum, this The copper foil will be 1/2 ounces of copper, which means that every square foot of yoke has 1/2 ounces of copper. When the copper is evenly distributed, its thickness will be about 0.0DG7 inches. Generally speaking, this is an industry standard for current printed circuit boards. Although aluminum is currently the preferred material for substrates, other metals such as stainless steel or nickel alloys can also be used. The outer surface C 〇, shown in Figure 2 above, is first oxidized and often has gray The color depends on the oxidation process used, but other colors may also be produced depending on the process. After completion, M makes it easier to adhere to the prepreg at the point where it will be combined during the printed circuit board manufacturing process , Xing's inner surface. C i must be uncontaminated, meaning that there are no contaminants of sufficient size or natural on the surface that would hinder feeding. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297mm) (Please read the notes on the back before filling this page)
A7 B7 五、發明説明（ 經濟部中央榡準局貝工消費合作杜印製 終功能 之印刷 刻以產 A的表 在 化的外 薄片A 如 處而飼 的延伸 3 0的 是，如 仍 面朝上 剝開摺 的標準 2 4英 X 7 2 2 4分 ’本發 構 英吋到 板為一 ，像是 電路板 生所需 面Α ί 鋁薄片 在完成的 中的這個 之電路導 也必須未被污染 電路板中之導電路徑，在一個完成 表面構成一功能 體組態 性組件並且將被蝕 嚙合表面C i之鋁薄Η 之底面上為一第 表面C 〇以及 之'另一 將於圖 萡C的 被指定 兩個邊 在圖1 參考圖 之飼箔 回，現 尺寸為 吋2 ， 英吋2 開的銅 明的原 件3 〇 大約0 . 片在例 底面亦必 1與圖2 上、下兩 為3 3與 緣上而且 中看到之 1與圖2 層的被氧 今被使用 12X1 然而被使 ，飼箱薄 箔薄片， 則將應用 包括一層 0 1 5英时 擧說明的 必須未 須未被 中看到 面的邊 3 5， 在此實 構件3 ，可以 化之表 在製造 2英吋 用之銅 Η 3 6 其他介 較小及 係被例 之商業 例子中 -13 二片銅萡C ，也具有一被氧 被污染的 污染 ，鋁基板 緣則超過 這些延伸 施例中係 0的上端 同時看到此叠片構件3 面C 〇並 内表面C i ，此錫 A終止 邊緣3 存在於 相對的 及下端 於、邊緣3 1 1 ’此邊緣 每—個構件 邊緣5也就 且在一 印刷電路板的一 2而另一 萡薄片的 X 4 8可 於其間的 較大的兩 ‘說明如 等級鋁A 為1 / 2 個轉# 個飼雜 為1 » 尺寸貝[J 尺寸可Μ 3 Κ分成四>： 尺寸也 種尺寸 厚度從 的基板 盎斯銅 常 本紙張 (CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁}A7 B7 V. Description of the invention (final function of the Ministry of Economic Affairs, Central Bureau of Preservation and Printing, the final function of the printing and engraving is to produce the surface of the outer sheet A that is produced, and the feed is extended as much as 30. The standard 2 4 inch X 7 2 2 4 points that are peeled up upwards is the same as the size of the board to the board, such as the required surface of the circuit board. The aluminum foil must also be completed in this circuit guide. The conductive path in the uncontaminated circuit board forms a functional body configuration component on a completed surface and the bottom surface of the aluminum thin film H to be etched to engage the surface C i is a first surface C and another The two sides of Fig. C are designated on the feeding foil of the reference picture in Fig. 1, and the current size is 2 inches and 2 inches. The original copper Ming 3 is about 0. The piece must also be on the bottom surface of the example. , The next two are 3 3 and the top and the layers 1 and 2 in the picture are used 12X1. However, the thin foil of the feeding box will be applied including a layer 0 1 5 It is not necessary to see the edge of the face 3 5 in the real component 3, which can be expressed For the production of 2 inches of copper Η 3 6 in other commercial examples that are relatively small and are examples of -13 two pieces of copper cladding C, also has a pollution of being contaminated by oxygen, the edge of the aluminum substrate exceeds those in these extended examples At the same time, the upper end of the system 0 sees the laminated member 3 side C 〇 and the inner surface C i, the tin A termination edge 3 exists at the opposite and the lower end, the edge 3 1 1 ′ this edge every member edge 5 And one 2 on one printed circuit board and the other X 4 8 on the other side of the sheet can be in between the larger two 'instructions such as grade aluminum A is 1/2 turn # feed miscellaneous is 1 »size shell [J size The Μ 3 Κ can be divided into four >: substrates of different sizes and thicknesses from the ounce copper regular paper (CNS) A4 specification (210X 297mm) (please read the precautions on the back before filling this page)
A7 B7 五、發明説明（li ) 就是，厚度大約為〇 . G 7英吋’本發明的原則將應用具有 其他厚度的銅及鋁到構件上’被剝開摺回的轉角處個別地 顯示此飼及鋁之必須未被污染的內表面。 彈性的黏著劑像橡膠黏接劑被供應到鋁與铜的內表面 之被選擇的沈積區域，在本例中，其延伸到此構件3 0的 邊緣四周接近或在此薄片的邊緣處並且將銅與鋁之未被污 染的表面C i與A i在其邊緣處结合在一起，一個由 Uni royal公司所銷售之名稱為Royal Adhesive的產品並且 具有DC-1162QA與B的成份已經被發現為滿意的產品，因 為交接面之接觸面必須是未被汚染的，所以黏著劑維持介 於中央區域C z的表面在構件之處理期間與在製造電路板 的製程期間之間交接面之必須的未被污染的特性，此中央 區域在交接面處未被结合，彈性的黏著劑4 ◦被沈積的莨 際位置可K被中斷或不被中斷衹要此彈性的黏著劑4 0充 分地使銅與鋁结合Μ維持中央區域C z之必須未被污染的 特性。 經濟部中央標準局貝工消费合作社印製 此彈性的黏著劑4 0位在由虛線4 2和構件3 0的邊 緣所定義之黏著劑應用區域中，此區域視最終產品需求及 被使用之鋁和銅薄片的尺寸兩者可以是從大約〇 . 1英吋到 1 _ 0英时，已經被發現之滿意的黏著帶，被中斷或未被中 斷，寬度從大約Q ·[) 6英吋到大約Q . Q 9英吋，雖然此黏著帶 視被層叠之薄片的尺寸寬度可以為從大約Q . Q 1英吋到〇 . 5 英吋而且厚度從大約〇 . Q 〇 1 英吋到〇 . G Q 5 英时，一個從 -1 4 - 本紙張尺度逍用中國國家榇準（CNS ) Α4規格（210Χ297公釐） 經濟部中央標準局員工消费合作社印装 A7 B7 五、發明説明（θ ) 〇 . 0 01英时到0 . (3 G 2英时已經被發現是滿意的厚度。 一個藉習知技術連續迴路環繞製程來組合一薄冊電路 板的方法被例舉說明於圖5中，銅萡，MCi表示，來自 一被曝露於封閉狀況之叠層室的第一捲銅箔（未被顯示） 被鋪在底層壓層板或拋光板5 0的上表，面上，一個KC2 表示的第二飼萡係來自一第二捲飼箔（也未被顯示）被鋪 在第一飼箱層C :的上面，一個充當一絕緣體之第一被陽 極電鍍的鋁隔離板！5 2被放在與銅萡Ci 、C2之疊加層 接觸，當第一捲銅箔到達點5 3，大約在鋁隔離板5 2之 右手邊緣處的位置時，此第一捲飼箔被升高並且被移動到 左側*如顯示於圖5中，當此第一捲銅箔到達大約點5 4 處，一片預浸漬賵或多層板5 6被鋪在目前由右至左延伸 横跨鋁陽離板5 2之上表面的銅箔上。 然而圖5顯示_萡以及不同的隔離板和預浸濱體薄片 被垂直地隔開，此係為了易於例擧說明污染物能夠延伸到 飼IS的外側表面。 因此，第二捲銅萡被升高到一點，大約在圖5中！5 8 的位置處，並且然後在預浸漬體薄片5 6的上表面之上行 進到左側，第二片结合並且最終被電性牢靠的連接到第一 片在點6 0處。 此迴路環繞製造被重複直到所需之數目的板材已經被 鋪一片在藉銅萡而被交錯的另一片上直到此具有隔離板 6 2在兩片飼萡之末端的上面於6 4位置處之簿冊被完成 -1 δ- 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁) h今A7 B7 Fifth, the description of the invention (li) is that the thickness is about 0. G 7 inches 'The principles of the present invention will apply copper and aluminum with other thicknesses to the member' are peeled off and turned back to show this individually The internal surface of the feed and aluminum must be uncontaminated. Elastic adhesives like rubber adhesives are supplied to the selected deposition areas of the inner surfaces of aluminum and copper. In this example, they extend around the edge of the member 30 near or at the edge of the sheet and will The uncontaminated surfaces of copper and aluminum, C i and A i, are combined at their edges. A product sold by Uni royal company named Royal Adhesive and having ingredients DC-1162QA and B has been found to be satisfactory Products, because the contact surface of the interface must be uncontaminated, the adhesive maintains the surface between the central region C z during the processing of the component and the process of manufacturing the circuit board. The nature of the pollution, this central area is not bonded at the interface, the elastic adhesive 4 ◦ The deposited position can be interrupted or uninterrupted as long as the elastic adhesive 4 0 fully makes copper and aluminum In combination with M, the characteristic that the central area C z must be uncontaminated is maintained. Printed by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, this flexible adhesive 40 is located in the adhesive application area defined by the dotted line 42 and the edge of the component 30. This area depends on the final product demand and the aluminum used. And the size of the copper foil can be from about 0.1 inches to 1 _ 0 inches, the adhesive tape has been found to be satisfactory, interrupted or uninterrupted, the width from about Q · [) 6 inches to about Q. Q 9 inches, although the width of the laminated sheet may be from about Q. Q 1 inch to 0.5 inches and the thickness from about 〇. Q 〇1 inches to 〇. GQ 5 inches, one from -1 4-this paper standard is easy to use China National Standard (CNS) Α4 specification (210Χ297 mm) A7 B7 printed by the employee consumer cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of invention (θ) 〇. 0 01 British hour to 0. (3 G 2 British hour has been found to be a satisfactory thickness. A method of combining a thin book circuit board by a continuous loop process of conventional technology is illustrated in Figure 5, copper hu , MCi said that from a stacked room exposed to a closed condition The first roll of copper foil (not shown) is laid on the upper surface of the bottom laminate or polishing plate 50. A second feeder indicated by KC2 comes from a second roll of feeding foil (also not shown) ) It is laid on top of the first feeding box layer C: a first anodized aluminum isolation plate that acts as an insulator! 5 2 is placed in contact with the superimposed layer of copper cis Ci and C2 when the first roll of copper When the foil reaches point 53, approximately at the right-hand edge of the aluminum separator plate 52, this first roll of feeding foil is raised and moved to the left side * As shown in Figure 5, when this first roll of copper foil Reaching approximately point 5 4, a piece of pre-impregnated gnarled or multi-layer board 5 6 is laid on the copper foil that currently extends from right to left across the upper surface of the aluminum anode plate 5 2. However, Figure 5 shows _ 萡 and different The isolation plate and the prepreg sheet are vertically separated. This is for ease of illustration to show that the contaminants can extend to the outside surface of the feeding IS. Therefore, the second roll of copper burr is raised to a point, approximately in Figure 5 ！ At the position of 5 8, and then travel over the upper surface of the prepreg sheet 5 6 to the left, the second piece is combined and Finally, it is electrically connected firmly to the first piece at point 60. This loop around the manufacturing is repeated until the required number of plates have been laid on another piece that is interleaved by copper cladding until there is an isolation plate 6 2 The book at the position of 6 4 is completed on the top of the ends of two pieces of yam. -1 δ- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back first Please fill out this page again) h Jin
,1T 317072 A7 五、發明説明（0 ) (請先閲讀背面之注意事項再填寫本頁) ，末端在介於上層拋光板6 6與隔離板6 2之間被擠壓， 電被施加並且電流沿著銅萡薄片平行地流動而藉從飼的電 阻所產生的熱來加熱此簿冊。 上述之迴路環繞製程的一個主要之優點在於節省電力 ，當铜箔被使用當做整個簿冊板的電阻加熱器時比當一叠 層被外在的加熱時有違少於電力之總瓦數被使用。 另一'優點係在簿冊之熱量分布為均勻的，上述之迴路 環繞製程比從一叠層經由厚導電板衹在簿冊的上面及下面 傳熱之舊技術更加接近一等溫熱量狀態，被來回交織经過 整個叠層的銅係具有均勻的厚度及寬度此項事實致使從簿 .冊的上面與下面均勻地產生熱量，均勻的加熱導致樹脂之 均句流動。 經濟部中央標準局貝工消费合作社印製 在缺點方面，對廼路環繞方法的一個主要的問題在於 此I置缸邊_緣_均被敞開並且銅和鋁均在一潛在之多灰塵的 環境中被加工處理，也就是，位於銅之表面上的預浸憒體 粉塵、泥土、昆蟁Μ及其他污染物在下層銅中造成短路與 其他缺點而導致在蝕刻線路中的不良瑕疵，另一問題為前 述之起皺現象。 然而，另一個主要的缺點係在加工處理中銅夾合預浸 漬體，在銅被结合到預浸濱體之後，將被蝕刻以形成電路 板之導電線路的銅仍然在外側表面上並且從未被保護Κ防 止灰塵及其性質相同之物的影鏨。 一簿冊板根據本發明來組合的方式將特別參考圖6來 -1 6 - 本紙張尺度遘用中國國家標準（CNS ) Α4规格（210X 297公釐） 經濟部中央標準局貝工消費合作杜印製 A 7 B7 五、發明説明（A ) 做說明，製造者Μ延伸經過在兩側邊上之鋁的邊緣3 2之 銅萡的邊緣部分33及35來供應構件30 (·1與圖2 )，此邊緣的延伸可以被構件製造者來接合或者構件可K 被製造者運送而並沒有接合此逢緣的延伸，此邊緣的延伸 可K被接合，舉例來說，K超音波焊接，或以與其相等之 方式，接合銅之内面成具有良好之電的傳導性，此接合製 程可以用點焊、壓焊、冷焊或是任何其他相等的方法，只 要它能夠使延伸物3 3及3 5產生足夠的電性接觸而允許 電的連镰流動，最好，構件3 0將由構件製造者來供應而 ,且沒有被電性地連接之邊緣的延伸3 3及3 5 ，在此例子 中，將由電路板製造者或由膠合機在接合站執行這樣的接 合。 如同在圖3中所見，構件3 0包括銅箔的上表面和下 表面以及鋁的內層，顯示銅箔的延伸物3 3與3 5在它們 的邊緣處被接合，然而，圖3祗是例擧說·明銅萡及鋁的相 對位置係將可被了解的。 應該被強調的是，此構件之銅箔的内“加工”表面 C i將變成完成的印刷電路板之外表面並且當銅萡表面 C 〇被接合到預浸漬體時，此“加工”表面C i被蝕刻Μ 產生導電的線盎。 因此，在整個電路板製造的過程期間此“加工”表面 被保護著，因為它們朝內面向鋁薄片之必須未被污染的表 面並且黏著劑維持其交接面之必須未被污染的特性，而且 -1 7 - 本紙張尺度逍用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閲讀背面之注意"項再填寫本頁) ，1Τ A7 SI 70 72 五、發明説明（6) 因此可防止灰塵與其他汚染物的進入。 此结合製程將參考圖6來說明，此壓製包括一底層拋 龙板7 4支撐一被例舉說明當做一特太被陽極電鍍之鋁 扳7 6的第一絕緣體，雖然圖6中顯示從拋光板74處被 隔開，預浸漬體實際上係直接被放在拋光板7 4上。 一個上述之構件7 5包括一被夾合在介於兩個具有邊 緣延伸3 3及3 5的銅箔之間的内層鋁板，此構件7 5被 放置在被陽極電鍍之鋁隔離板7 6的上面，一個専電的鉛 7 7連接延伸物3 3及3 5而與拋光板74電性接觸，換 言之’在圖6之左手邊顯示的延伸物33及35可Κ被直 接連接到導電的拋光板7 4或是被任何合適的導電鉛，而 此導電的鉛不一定需要被鋪在被暘極電鍍之鋁隔離板7 6 的下面。 一個係為了本發明相等的目的之第二片預浸濱體或多 層板7 3被鋪在第一構件7 5之銅萡的上表面8 0上，一 個通常Κ 8 2表示之第二構件3 0被放置在預浸濱體薄板 73上，第一構件75之延伸物33與35及第二構件 8 2然後Μ如同由在圖6的左.手邊之箭頭8 3所表示的焊 接被連接在一起，但是，此焊接製程可能會被延緩直到所 有的構件被組合之後。 構件3 0的结合製程，被預浸漬體或多層板所隔開， 可Κ繼績到在壓製的範圍之内的任何所需之高度，一個被 陽極電鍍之絕緣的隔離鋁板91從拋光板88隔開最上層 -1 8- 本紙张尺度逋用中國國家橾隼（CNS ) Α4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁) *1Τ 經濟部中央標隼局貝工消費合作杜印製 秦 秦 經濟部中央標準局貝工消費合作杜印裝 A7 _ B7 五、發明説明（4) 的構件8 5，有了如在8 7處被電性連接到上層拋光板 8 8M及在簿冊中所有其他的構件之最後的構件8 5 ，電 被施加並且電流經過每一個構件3 0之銅萡C的上層及下 層平行地流動，因此，此簿冊遍及其高度被均匀地加熱， 在此製程期間，飼箔的表面必須維持未被污染。 然而，從此一壓製到另一壓製，壓製的情形各自不同 而且電路'板之真實的組態也相當地不一樣，所以壓力與電 流的需求就有變化，已經被發現滿意的壓力從5 0 P S I到 2 G 0 P S I 、電流從2 G 0安培到1 2 G 0安培，在電壓為2 5伏特 到5 ϋ伏特的時候。 當簿冊板已經被冷卻及硬化處理時，個別的電路板從 叠層中被分開，每一片電路板具有一片銅箔C被接合到一 片預浸潰體的兩側而且其外表面必須未被污染。 雖然它們在圖5中被顯示係被隔開的，在簿冊中，圖 4之電路板的上層薄片9 0為被組合在其上的構件之銅萡 的下層薄片並且銅萡之下層薄片9 2為被組合在其下的構 件3 0之上層薄片，在原來的構件中之鋁隔離薄片被丟棄 而且在電路板之隨後的加工處理中可K隨後地被使用當做 鑽孔入口及鑽孔備用的材料或者可K被重複使用。 -19- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） --------f — (請先閲讀背面之注意事項再填寫本頁), 1T 317072 A7 V. Description of invention (0) (please read the precautions on the back before filling in this page), the end is squeezed between the upper polishing plate 6 6 and the isolation plate 6 2, electricity is applied and current Flowing parallel along the lamellae, the book is heated by the heat generated from the feeding resistance. One of the main advantages of the loop-around process described above is that it saves electricity. When copper foil is used as a resistance heater for the entire booklet, it is less than the total wattage of electricity used when the stack is heated externally. . Another advantage is that the heat distribution in the book is uniform. The above-mentioned looping process is closer to an isothermal heat state than the old technology of transferring heat only from above and below the book through a stack of thick conductive plates. The fact that the copper system interlaced back and forth through the entire stack has a uniform thickness and width results in uniform heat generation from the top and bottom of the book, and uniform heating causes the resin to flow uniformly. Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. In terms of shortcomings, one of the main problems with the Nairo surround method is that the cylinder edge_edge_ is open and both copper and aluminum are in a potentially dusty environment. It is processed, that is, prepreg dust, mud, Kunming M and other contaminants on the surface of the copper cause short circuits and other shortcomings in the underlying copper and lead to undesirable defects in the etched circuit, another The problem is the aforementioned wrinkling phenomenon. However, another major disadvantage is that the copper sandwiches the prepreg during processing. After the copper is bonded to the prepreg, the copper that will be etched to form the conductive traces of the circuit board is still on the outside surface and never It is protected from dust and the shadow of things of the same nature. The method of combining a book board according to the present invention will be particularly referred to Figure 6 to 16. The paper size is based on the Chinese National Standard (CNS) Α4 specification (210X 297mm). The Ministry of Economic Affairs Central Standards Bureau Beigong Consumer Cooperation Du Printing System A 7 B7 V. Description of the invention (A) As an illustration, the manufacturer M extends through the edge portions 33 and 35 of the copper rims of the aluminum edge 32 on both sides to supply the member 30 (· 1 and FIG. 2) The extension of this edge can be joined by the component manufacturer or the component can be transported by the manufacturer without engaging the extension of this edge, the extension of this edge can be joined by K, for example, K ultrasonic welding, or In the same way, the inner surface of the joined copper has good electrical conductivity. The joining process can be spot welding, pressure welding, cold welding or any other equivalent method, as long as it can make the extensions 3 3 and 3 5 To produce sufficient electrical contact to allow the flow of electricity, preferably, the component 30 will be supplied by the component manufacturer, and the extensions 3 3 and 3 5 of the edges that are not electrically connected, in this example, Will be made by the circuit board manufacturer or by the gluing machine Joining station performing such engagement. As seen in FIG. 3, the member 30 includes the upper and lower surfaces of the copper foil and the inner layer of aluminum, showing that the copper foil extensions 3 3 and 35 are joined at their edges, however, FIG. 3 is only For example, the relative position of Mingtong and aluminum will be understood. It should be emphasized that the inner “processed” surface C i of the copper foil of this component will become the outer surface of the finished printed circuit board and this “processed” surface C when the copper surface C 〇 is bonded to the prepreg i is etched Μ produces conductive lines. Therefore, this "processed" surface is protected during the entire circuit board manufacturing process because they face inwardly the surface of the aluminum foil that must be uncontaminated and the adhesive maintains the characteristics of its interface that must be uncontaminated, and- 1 7-This paper uses the Chinese National Standard (CNS) Α4 specification (210Χ297mm) (please read the “Notes on the back” section and fill in this page), 1Τ A7 SI 70 72 5. Description of the invention (6) Therefore Can prevent the entry of dust and other pollutants. This combination process will be described with reference to FIG. 6, which includes a bottom throwing plate 74 supporting a first insulator illustrated as an aluminum plate 76 that is anodized, although FIG. 6 shows the polishing The plate 74 is separated, and the prepreg is actually placed directly on the polishing plate 74. An above-mentioned component 75 includes an inner aluminum plate sandwiched between two copper foils with edge extensions 3 3 and 35. This component 75 is placed on an anodized aluminum isolation plate 76 Above, an electrical lead 7 7 connects the extensions 3 3 and 35 to make electrical contact with the polishing plate 74, in other words, the extensions 33 and 35 shown on the left hand side of FIG. 6 can be directly connected to the conductive polishing The plate 74 may be any suitable conductive lead, and this conductive lead does not necessarily need to be laid under the aluminum isolation plate 7 6 plated with the electrode. A second prepreg or multi-layer board 73 which is for the same purpose of the present invention is laid on the upper surface 80 of the copper cladding of the first member 75, and a second member 3 generally represented by K 8 2 0 is placed on the prepreg sheet 73, the extensions 33 and 35 of the first member 75 and the second member 8 2 then M is welded as indicated by the arrow 8 3 on the left side of FIG. 6 Together, however, this welding process may be delayed until all components are assembled. The bonding process of component 30 is separated by a prepreg or multi-layer board, which can be achieved to any desired height within the range of pressing. An insulated aluminum plate 91 that is anodized and insulated from polishing plate 88 Separate the top layer-1 8- This paper scale uses the Chinese National Falcon (CNS) Α4 specification (210X 297mm) (please read the precautions on the back before filling this page) * 1ΤMinistry of Economic Affairs Central Standard Falcon Bureau Industrial and consumer cooperation Du printing Qin Qin Qin Qin Central Economic Bureau Central Standards Bureau Beigong consumer cooperation Du printing installation A7 _ B7 5. Invention description (4) of the component 8 5, with such as at 8 7 is electrically connected to the upper polishing plate 8 8M and the last component 8 5 of all other components in the book, electricity is applied and current flows in parallel through the upper and lower layers of the copper cladding C of each component 30, therefore, the book is uniformly distributed throughout its height Heating, during this process, the surface of the feeding foil must remain uncontaminated. However, from one pressing to another pressing, the pressing situation is different and the actual configuration of the circuit board is also quite different, so the pressure and current requirements have changed, and it has been found that the satisfactory pressure is from 50 PSI To 2 G 0 PSI, current from 2 G 0 amps to 1 2 G 0 amps, when the voltage is 25 volts to 5 ϋ volts. When the book board has been cooled and hardened, the individual circuit boards are separated from the stack, each circuit board has a piece of copper foil C bonded to both sides of a prepreg and its outer surface must not be contaminated . Although they are shown separated in FIG. 5, in the book, the upper sheet 90 of the circuit board of FIG. 4 is the lower sheet of the copper cladding of the component assembled thereon and the lower sheet of the copper cladding 9 2 In order to be laminated on the upper layer of the lower member 30, the aluminum separator sheet in the original member is discarded and can be subsequently used as a drilling entrance and drilling reserve in the subsequent processing of the circuit board Material or K can be reused. -19- This paper scale is applicable to China National Standard (CNS) Α4 specification (210X 297mm) -------- f — (Please read the precautions on the back before filling this page)
,1T, 1T