TW316968B - - Google Patents
Download PDFInfo
- Publication number
- TW316968B TW316968B TW085116167A TW85116167A TW316968B TW 316968 B TW316968 B TW 316968B TW 085116167 A TW085116167 A TW 085116167A TW 85116167 A TW85116167 A TW 85116167A TW 316968 B TW316968 B TW 316968B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printed circuit
- line
- board
- power supply
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 241000723353 Chrysanthemum Species 0.000 claims 1
- 235000005633 Chrysanthemum balsamita Nutrition 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 230000000875 corresponding effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0262—Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7342757A JPH09180430A (ja) | 1995-12-28 | 1995-12-28 | メモリカード |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW316968B true TW316968B (en:Method) | 1997-10-01 |
Family
ID=18356265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085116167A TW316968B (en:Method) | 1995-12-28 | 1996-12-27 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5745426A (en:Method) |
| JP (1) | JPH09180430A (en:Method) |
| KR (2) | KR970051126A (en:Method) |
| TW (1) | TW316968B (en:Method) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3718008B2 (ja) * | 1996-02-26 | 2005-11-16 | 株式会社日立製作所 | メモリモジュールおよびその製造方法 |
| US6028781A (en) * | 1996-12-19 | 2000-02-22 | Texas Instruments Incorporated | Selectable integrated circuit assembly and method of operation |
| DE19724053A1 (de) * | 1997-06-07 | 1998-12-10 | Biotronik Mess & Therapieg | Elektronische Speichervorrichtung, insbesondere zur Anwendung bei implantierbaren medizinischen Geräten |
| US6108228A (en) * | 1997-12-02 | 2000-08-22 | Micron Technology, Inc. | Quad in-line memory module |
| US6062480A (en) * | 1998-07-20 | 2000-05-16 | Vlsi Technologies, Inc. | Hot docking system and methods for detecting and managing hot docking of bus cards |
| US6172895B1 (en) * | 1999-12-14 | 2001-01-09 | High Connector Density, Inc. | High capacity memory module with built-in-high-speed bus terminations |
| JP2001210921A (ja) * | 2000-01-28 | 2001-08-03 | Mitsumi Electric Co Ltd | プリント基板 |
| US6449166B1 (en) * | 2000-08-24 | 2002-09-10 | High Connection Density, Inc. | High capacity memory module with higher density and improved manufacturability |
| US6940153B2 (en) * | 2003-02-05 | 2005-09-06 | Hewlett-Packard Development Company, L.P. | Magnetic shielding for magnetic random access memory card |
| CN100405880C (zh) * | 2004-12-24 | 2008-07-23 | 鸿富锦精密工业（深圳）有限公司 | 引脚连接结构及其脚位定义的修改方法 |
| KR101177555B1 (ko) * | 2006-02-01 | 2012-08-27 | 삼성전자주식회사 | 메모리 카드, 메모리 카드의 데이터 구동 방법, 그리고메모리 카드 시스템 |
| DE102006018874A1 (de) * | 2006-04-24 | 2007-10-25 | Infineon Technologies Ag | Schaltungsanordnung zur Koppelung einer Spannungsversorgung an ein Halbleiterbauelement, Verfahren zur Herstellung der Schaltungsanordnung sowie Datenverarbeitungsgerät umfassend die Schaltungsanordnung |
| KR20100041515A (ko) * | 2008-10-14 | 2010-04-22 | 삼성전자주식회사 | 제거 가능한 보조 검사단자를 갖는 솔리드 스테이트 드라이브의 검사방법 |
| US8856417B2 (en) | 2012-10-09 | 2014-10-07 | International Business Machines Corporation | Memory module connector with auxiliary power cable |
| US8753138B2 (en) | 2012-10-09 | 2014-06-17 | International Business Machines Corporation | Memory module connector with auxiliary power |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3082323B2 (ja) * | 1991-07-30 | 2000-08-28 | ソニー株式会社 | メモリモジュール |
| JPH05233901A (ja) * | 1992-02-18 | 1993-09-10 | Mitsubishi Electric Corp | Ｉｃカード、ｉｃカード搭載用メモリｉｃ及びｉｃカードのメモリ容量の確認方法 |
| US5469399A (en) * | 1993-03-16 | 1995-11-21 | Kabushiki Kaisha Toshiba | Semiconductor memory, memory card, and method of driving power supply for EEPROM |
| US5272664A (en) * | 1993-04-21 | 1993-12-21 | Silicon Graphics, Inc. | High memory capacity DRAM SIMM |
-
1995
- 1995-12-28 JP JP7342757A patent/JPH09180430A/ja not_active Withdrawn
-
1996
- 1996-12-24 US US08/773,332 patent/US5745426A/en not_active Expired - Lifetime
- 1996-12-26 KR KR1019960072354A patent/KR970051126A/ko active Granted
- 1996-12-26 KR KR1019960072354A patent/KR100232553B1/ko not_active Expired - Lifetime
- 1996-12-27 TW TW085116167A patent/TW316968B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09180430A (ja) | 1997-07-11 |
| US5745426A (en) | 1998-04-28 |
| KR100232553B1 (ko) | 1999-12-01 |
| KR970051126A (ko) | 1997-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |