TW312807B - - Google Patents

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Publication number
TW312807B
TW312807B TW085104724A TW85104724A TW312807B TW 312807 B TW312807 B TW 312807B TW 085104724 A TW085104724 A TW 085104724A TW 85104724 A TW85104724 A TW 85104724A TW 312807 B TW312807 B TW 312807B
Authority
TW
Taiwan
Prior art keywords
cleaning
particles
hydrogen peroxide
ammonia
substrate
Prior art date
Application number
TW085104724A
Other languages
English (en)
Chinese (zh)
Original Assignee
Daikin Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Ind Ltd filed Critical Daikin Ind Ltd
Application granted granted Critical
Publication of TW312807B publication Critical patent/TW312807B/zh

Links

Classifications

    • H10P70/15—
    • H10P52/00—

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • ing And Chemical Polishing (AREA)
TW085104724A 1995-01-13 1996-04-20 TW312807B (show.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7003883A JPH08195369A (ja) 1995-01-13 1995-01-13 基板の洗浄方法

Publications (1)

Publication Number Publication Date
TW312807B true TW312807B (show.php) 1997-08-11

Family

ID=11569590

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085104724A TW312807B (show.php) 1995-01-13 1996-04-20

Country Status (6)

Country Link
EP (1) EP0805484A4 (show.php)
JP (1) JPH08195369A (show.php)
KR (1) KR100471704B1 (show.php)
CN (1) CN1168194A (show.php)
TW (1) TW312807B (show.php)
WO (1) WO1996021942A1 (show.php)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096703C (zh) * 1995-11-15 2002-12-18 大金工业株式会社 晶片处理液及其制造方法
US6165956A (en) * 1997-10-21 2000-12-26 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6479443B1 (en) 1997-10-21 2002-11-12 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
US6593282B1 (en) 1997-10-21 2003-07-15 Lam Research Corporation Cleaning solutions for semiconductor substrates after polishing of copper film
US6303551B1 (en) 1997-10-21 2001-10-16 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
EP0982765B1 (en) * 1998-08-28 2004-04-28 Mitsubishi Materials Silicon Corporation Cleaning method of semiconductor substrate
JP3003684B1 (ja) 1998-09-07 2000-01-31 日本電気株式会社 基板洗浄方法および基板洗浄液
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6358847B1 (en) 1999-03-31 2002-03-19 Lam Research Corporation Method for enabling conventional wire bonding to copper-based bond pad features
JP3624809B2 (ja) * 2000-02-29 2005-03-02 昭和電工株式会社 洗浄剤組成物、洗浄方法及びその用途
JP2003083869A (ja) * 2001-09-10 2003-03-19 Japan Water Research Center クリプトスポリジウムパルバム疑似蛍光トレーサおよびその調製法
TWI276682B (en) 2001-11-16 2007-03-21 Mitsubishi Chem Corp Substrate surface cleaning liquid mediums and cleaning method
JP4074814B2 (ja) * 2002-01-30 2008-04-16 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
EP1536291A4 (en) * 2002-08-22 2008-08-06 Daikin Ind Ltd Removing solution
CN100353466C (zh) * 2004-06-21 2007-12-05 苏州双林电脑器件有限公司 聚焦电位器基片的清洗方法
CN100428419C (zh) * 2004-12-08 2008-10-22 中国电子科技集团公司第四十六研究所 一种砷化镓晶片清洗方法
JP4613744B2 (ja) * 2005-08-10 2011-01-19 株式会社Sumco シリコンウェーハの洗浄方法
US7479460B2 (en) 2005-08-23 2009-01-20 Asm America, Inc. Silicon surface preparation
DE102007030957A1 (de) 2007-07-04 2009-01-08 Siltronic Ag Verfahren zum Reinigen einer Halbleiterscheibe mit einer Reinigungslösung
JP2010192673A (ja) * 2009-02-18 2010-09-02 Tokyo Electron Ltd 基板洗浄方法、基板洗浄装置、制御プログラム及びコンピュータ読取可能な記憶媒体
TWI494984B (zh) * 2010-07-21 2015-08-01 United Microelectronics Corp 半導體製程
JP2013053500A (ja) * 2011-08-31 2013-03-21 Serving Co Ltd フローリング等木質建材のリニューアル工法
CN102368468B (zh) * 2011-10-17 2013-09-25 浙江贝盛光伏股份有限公司 一种硅片预清洗工艺
JP2014057039A (ja) * 2012-08-10 2014-03-27 Fujifilm Corp 半導体基板製品の製造方法及びエッチング液
CN103894362A (zh) * 2014-01-10 2014-07-02 浙江晶科能源有限公司 一种镀膜返工片的清洗方法
JP6154860B2 (ja) * 2015-07-17 2017-06-28 野村マイクロ・サイエンス株式会社 洗浄用水素水の製造方法及び製造装置
CN110591832A (zh) * 2019-09-26 2019-12-20 嘉兴瑞智光能科技有限公司 一种高效环保无污染硅片清洗剂及其制备方法
CN113130301B (zh) * 2021-04-15 2023-09-22 通威太阳能（安徽）有限公司 一种解决单晶perc电池片碱抛el气流印的方法
CN115709204A (zh) * 2022-09-21 2023-02-24 有研国晶辉新材料有限公司 氮化硼坩埚的清洗方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353083A (ja) * 1989-07-20 1991-03-07 Morita Kagaku Kogyo Kk 半導体素子の金属汚染を防止する方法
DE4002327A1 (de) * 1990-01-26 1991-08-01 Wacker Chemitronic Verfahren zur nasschemischen behandlung von halbleiteroberflaechen und loesung zu seiner durchfuehrung
JPH0521412A (ja) * 1991-07-10 1993-01-29 Fujitsu Ltd 半導体基板の処理方法
JP3217116B2 (ja) * 1992-03-06 2001-10-09 日産化学工業株式会社 低表面張力洗浄用組成物
TW263531B (show.php) * 1992-03-11 1995-11-21 Mitsubishi Gas Chemical Co
JPH0641770A (ja) * 1992-07-27 1994-02-15 Daikin Ind Ltd シリコンウエハ表面の処理方法
JPH06177101A (ja) * 1992-12-03 1994-06-24 Mitsubishi Materials Corp 改良されたシリコンウェーハ洗浄液
JP3449492B2 (ja) * 1993-02-10 2003-09-22 三菱住友シリコン株式会社 ウェーハエッチングの前処理方法
WO1994027314A1 (en) * 1993-05-13 1994-11-24 Interuniversitair Microelektronica Centrum Method for semiconductor processing using mixtures of hf and carboxylic acid
JPH07216392A (ja) * 1994-01-26 1995-08-15 Daikin Ind Ltd 洗浄剤及び洗浄方法

Also Published As

Publication number Publication date
WO1996021942A1 (en) 1996-07-18
EP0805484A1 (en) 1997-11-05
KR100471704B1 (ko) 2005-04-14
EP0805484A4 (en) 1998-04-01
JPH08195369A (ja) 1996-07-30
CN1168194A (zh) 1997-12-17
KR19980701376A (ko) 1998-05-15

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