TW301771B - - Google Patents
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- Publication number
- TW301771B TW301771B TW085100691A TW85100691A TW301771B TW 301771 B TW301771 B TW 301771B TW 085100691 A TW085100691 A TW 085100691A TW 85100691 A TW85100691 A TW 85100691A TW 301771 B TW301771 B TW 301771B
- Authority
- TW
- Taiwan
- Prior art keywords
- package
- convex
- sample
- special
- please
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 23
- 238000005498 polishing Methods 0.000 claims description 19
- 239000013078 crystal Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 230000002079 cooperative effect Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 28
- 239000010408 film Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 239000012459 cleaning agent Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000012050 conventional carrier Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000013256 coordination polymer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 101001057161 Xenopus laevis MDS1 and EVI1 complex locus protein EVI1-A Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38742495A | 1995-02-10 | 1995-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW301771B true TW301771B (enExample) | 1997-04-01 |
Family
ID=23529807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085100691A TW301771B (enExample) | 1995-02-10 | 1996-01-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5766058A (enExample) |
| EP (1) | EP0808231B1 (enExample) |
| DE (1) | DE69610821T2 (enExample) |
| TW (1) | TW301771B (enExample) |
| WO (1) | WO1996024467A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10235552A (ja) * | 1997-02-24 | 1998-09-08 | Ebara Corp | ポリッシング装置 |
| US6074288A (en) * | 1997-10-30 | 2000-06-13 | Lsi Logic Corporation | Modified carrier films to produce more uniformly polished substrate surfaces |
| US5961375A (en) * | 1997-10-30 | 1999-10-05 | Lsi Logic Corporation | Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces |
| US6142857A (en) * | 1998-01-06 | 2000-11-07 | Speedfam-Ipec Corporation | Wafer polishing with improved backing arrangement |
| US6113466A (en) * | 1999-01-29 | 2000-09-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for controlling polishing profile in chemical mechanical polishing |
| US6309277B1 (en) * | 1999-03-03 | 2001-10-30 | Advanced Micro Devices, Inc. | System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning |
| US6217418B1 (en) | 1999-04-14 | 2001-04-17 | Advanced Micro Devices, Inc. | Polishing pad and method for polishing porous materials |
| US6722963B1 (en) | 1999-08-03 | 2004-04-20 | Micron Technology, Inc. | Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| US6467120B1 (en) | 1999-09-08 | 2002-10-22 | International Business Machines Corporation | Wafer cleaning brush profile modification |
| JP3342686B2 (ja) * | 1999-12-28 | 2002-11-11 | 信越半導体株式会社 | ウェーハ研磨方法及びウェーハ研磨装置 |
| US6786809B1 (en) * | 2001-03-30 | 2004-09-07 | Cypress Semiconductor Corp. | Wafer carrier, wafer carrier components, and CMP system for polishing a semiconductor topography |
| US6761619B1 (en) | 2001-07-10 | 2004-07-13 | Cypress Semiconductor Corp. | Method and system for spatial uniform polishing |
| DE10214272B4 (de) * | 2002-03-28 | 2004-09-02 | Forschungszentrum Jülich GmbH | Halterung für einen Wafer |
| KR102792557B1 (ko) * | 2020-07-15 | 2025-04-08 | 삼성전자주식회사 | 발광 소자, 발광 소자의 제조 방법, 및 발광 소자를 포함하는 디스플레이 장치 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3841031A (en) * | 1970-10-21 | 1974-10-15 | Monsanto Co | Process for polishing thin elements |
| US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
| US3911562A (en) * | 1974-01-14 | 1975-10-14 | Signetics Corp | Method of chemical polishing of planar silicon structures having filled grooves therein |
| US4009539A (en) * | 1975-06-16 | 1977-03-01 | Spitfire Tool & Machine Co., Inc. | Lapping machine with vacuum workholder |
| US4193226A (en) * | 1977-09-21 | 1980-03-18 | Kayex Corporation | Polishing apparatus |
| US4508161A (en) * | 1982-05-25 | 1985-04-02 | Varian Associates, Inc. | Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer |
| US4944836A (en) * | 1985-10-28 | 1990-07-31 | International Business Machines Corporation | Chem-mech polishing method for producing coplanar metal/insulator films on a substrate |
| US4724222A (en) * | 1986-04-28 | 1988-02-09 | American Telephone And Telegraph Company, At&T Bell Laboratories | Wafer chuck comprising a curved reference surface |
| JPS63232953A (ja) * | 1987-03-19 | 1988-09-28 | Canon Inc | 研磨工具 |
| US4811522A (en) * | 1987-03-23 | 1989-03-14 | Gill Jr Gerald L | Counterbalanced polishing apparatus |
| US5291692A (en) * | 1989-09-14 | 1994-03-08 | Olympus Optical Company Limited | Polishing work holder |
| US5234867A (en) * | 1992-05-27 | 1993-08-10 | Micron Technology, Inc. | Method for planarizing semiconductor wafers with a non-circular polishing pad |
| US5036630A (en) * | 1990-04-13 | 1991-08-06 | International Business Machines Corporation | Radial uniformity control of semiconductor wafer polishing |
| US5131968A (en) * | 1990-07-31 | 1992-07-21 | Motorola, Inc. | Gradient chuck method for wafer bonding employing a convex pressure |
| DE4108786C2 (de) * | 1991-03-18 | 1995-01-05 | Hydromatik Gmbh | Leichtkolben für hydrostatische Axial- und Radialkolbenmaschinen |
| US5069002A (en) * | 1991-04-17 | 1991-12-03 | Micron Technology, Inc. | Apparatus for endpoint detection during mechanical planarization of semiconductor wafers |
| US5245794A (en) * | 1992-04-09 | 1993-09-21 | Advanced Micro Devices, Inc. | Audio end point detector for chemical-mechanical polishing and method therefor |
| US5476414A (en) * | 1992-09-24 | 1995-12-19 | Ebara Corporation | Polishing apparatus |
| DE69316849T2 (de) * | 1992-11-27 | 1998-09-10 | Ebara Corp., Tokio/Tokyo | Verfahren und Gerät zum Polieren eines Werkstückes |
| US5302233A (en) * | 1993-03-19 | 1994-04-12 | Micron Semiconductor, Inc. | Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP) |
| US5423716A (en) * | 1994-01-05 | 1995-06-13 | Strasbaugh; Alan | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied |
-
1996
- 1996-01-11 DE DE69610821T patent/DE69610821T2/de not_active Expired - Lifetime
- 1996-01-11 EP EP96902099A patent/EP0808231B1/en not_active Expired - Lifetime
- 1996-01-11 WO PCT/US1996/000152 patent/WO1996024467A1/en not_active Ceased
- 1996-01-22 TW TW085100691A patent/TW301771B/zh not_active IP Right Cessation
-
1997
- 1997-01-21 US US08/784,619 patent/US5766058A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0808231A1 (en) | 1997-11-26 |
| DE69610821T2 (de) | 2001-06-07 |
| EP0808231B1 (en) | 2000-11-02 |
| WO1996024467A1 (en) | 1996-08-15 |
| US5766058A (en) | 1998-06-16 |
| DE69610821D1 (de) | 2000-12-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |