TW299485B - - Google Patents

Download PDF

Info

Publication number
TW299485B
TW299485B TW084105930A TW84105930A TW299485B TW 299485 B TW299485 B TW 299485B TW 084105930 A TW084105930 A TW 084105930A TW 84105930 A TW84105930 A TW 84105930A TW 299485 B TW299485 B TW 299485B
Authority
TW
Taiwan
Prior art keywords
wafer
basket
side wall
round
crystal
Prior art date
Application number
TW084105930A
Other languages
English (en)
Chinese (zh)
Original Assignee
Shinetsu Handotai Co Ltd
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Co Ltd, Shinetsu Polymer Co filed Critical Shinetsu Handotai Co Ltd
Application granted granted Critical
Publication of TW299485B publication Critical patent/TW299485B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW084105930A 1994-06-17 1995-06-10 TW299485B (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15822894A JP2791971B2 (ja) 1994-06-17 1994-06-17 ウェーハ収納容器におけるウェーハバスケット

Publications (1)

Publication Number Publication Date
TW299485B true TW299485B (ko) 1997-03-01

Family

ID=15667084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105930A TW299485B (ko) 1994-06-17 1995-06-10

Country Status (6)

Country Link
JP (1) JP2791971B2 (ko)
KR (1) KR100332719B1 (ko)
DE (1) DE19521575C2 (ko)
FR (1) FR2725185B1 (ko)
GB (1) GB2290414B (ko)
TW (1) TW299485B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW296361B (ko) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
GB2350604A (en) * 1999-06-03 2000-12-06 Horizon Biscuit Company Ltd Th Container
DE10046942A1 (de) * 2000-09-21 2002-04-25 Infineon Technologies Ag Verfahren zum Transport von Wafern
DE10104313C1 (de) * 2001-01-22 2002-08-08 Hunke & Jochheim Aufbewahrungsbehälter für Kassetten
TW511649U (en) * 2001-09-12 2002-11-21 Ind Tech Res Inst Wafer retainer
TWI239931B (en) 2003-05-19 2005-09-21 Miraial Co Ltd Lid unit for thin plate supporting container and thin plate supporting container
DE10337570A1 (de) * 2003-08-14 2005-03-17 Infineon Technologies Ag Transportvorrichtung
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
CN102339777B (zh) * 2010-07-15 2013-09-11 家登精密工业股份有限公司 晶圆盒的晶圆限制件
DE102010040918B4 (de) * 2010-09-16 2013-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Behälter zum Stapeln und Transportieren von Scheiben aus brüchigem Material
JP5679042B2 (ja) 2011-02-28 2015-03-04 株式会社タンガロイ ガイドパッド、切削工具本体および切削工具
JP5652540B2 (ja) 2011-02-28 2015-01-14 株式会社タンガロイ ガイドパッド、切削工具本体および切削工具
KR101658631B1 (ko) 2014-04-03 2016-09-22 형제기계공업 주식회사 격벽을 이용한 제설장치
CN106784145B (zh) * 2016-12-23 2018-03-06 中赣新能源股份有限公司 一种硅片插片方法
CN116936432B (zh) * 2023-09-14 2024-01-02 常州银河世纪微电子股份有限公司 一种晶圆收纳盒、使用该收纳盒的取放装置及取放方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648126A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Auxiliary carrier for replacing wafers
JPS60160539U (ja) * 1984-04-02 1985-10-25 ソニー株式会社 半導体ウエハ等収納容器
US4687097A (en) * 1984-12-11 1987-08-18 Empak, Inc. Wafer processing cassette
US4724963A (en) * 1985-02-20 1988-02-16 Empak, Inc. Wafer processing cassette
US4684021A (en) * 1986-06-23 1987-08-04 Fluoroware, Inc. Bottom loading wafer carrier box
JPH0284319U (ko) * 1988-12-20 1990-06-29
US5154301A (en) * 1991-09-12 1992-10-13 Fluoroware, Inc. Wafer carrier
ATE147045T1 (de) * 1992-07-08 1997-01-15 Daifuku Kk Behälter für scheibenähnliche gegenstände

Also Published As

Publication number Publication date
JP2791971B2 (ja) 1998-08-27
GB2290414A (en) 1995-12-20
FR2725185B1 (fr) 1997-10-17
KR960002468A (ko) 1996-01-26
GB2290414B (en) 1998-07-29
JPH088332A (ja) 1996-01-12
DE19521575A1 (de) 1995-12-21
FR2725185A1 (fr) 1996-04-05
GB9512022D0 (en) 1995-08-09
KR100332719B1 (ko) 2002-10-31
DE19521575C2 (de) 2002-04-18

Similar Documents

Publication Publication Date Title
TW299485B (ko)
KR200476703Y1 (ko) 포장상자
US8317150B2 (en) Truncated pyramid shaped shipping base
CN100408450C (zh) 包括具有锁定结构的支撑柱的包装组件
US4520925A (en) Package
JPS5965425A (ja) シリコンウエフア−用パツケ−ジ
CA1090228A (en) Microfiche trays
KR101447451B1 (ko) 웨이퍼 보관 용기
JP2007505798A (ja) 低コストウェファボックスの改良
EP0576325A1 (fr) Plateau gerbable en carton ou matière analogue, plus particulièrement destiné au transport de gros fromages circulaires et flan pour sa réalisation
US20060278638A1 (en) Pallet for conveying goods
CN209321477U (zh) 一种拼接包装箱
CN210989927U (zh) 一种收纳盒
JP3441615B2 (ja) ウエーハ接触防止装置
JP3904108B2 (ja) 梱包材
CN112340218A (zh) 一种防尘阻隔瓦楞纸箱
JP2006325976A (ja) 収容箱
JPH0646848Y2 (ja) ブラウン管パネルの収容体
CN217397155U (zh) 一种包装结构
JPH0231374Y2 (ko)
KR20130003369U (ko) 액자용 포장 박스
TWI240553B (en) Scan window assembly with an open boundary
JPS6119099Y2 (ko)
JP4103351B2 (ja) 包装箱
JPH0460347B2 (ko)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees