TW290664B - - Google Patents
Info
- Publication number
- TW290664B TW290664B TW085101185A TW85101185A TW290664B TW 290664 B TW290664 B TW 290664B TW 085101185 A TW085101185 A TW 085101185A TW 85101185 A TW85101185 A TW 85101185A TW 290664 B TW290664 B TW 290664B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7036238A JP3017038B2 (ja) | 1995-01-31 | 1995-01-31 | 半導体集積回路の設計方式 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW290664B true TW290664B (zh) | 1996-11-11 |
Family
ID=12464205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085101185A TW290664B (zh) | 1995-01-31 | 1996-01-31 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3017038B2 (zh) |
| KR (1) | KR960030400A (zh) |
| DE (1) | DE19603327A1 (zh) |
| TW (1) | TW290664B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI396998B (zh) * | 2005-08-05 | 2013-05-21 | Ibm | 用於控制在cad系統之編輯螢幕上顯示的系統、方法及程式產品 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100335492B1 (ko) * | 1999-10-26 | 2002-05-04 | 윤종용 | 간편한 모델 파라미터 집합 추출 방법과 이를 이용한 집적회로의 통계적 시뮬레이션 방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0287278A (ja) * | 1988-09-26 | 1990-03-28 | Hitachi Ltd | 大規模集積回路の遅延時間導出方式 |
| JP2630078B2 (ja) * | 1991-01-28 | 1997-07-16 | 日本電気株式会社 | 半導体集積回路のレイアウト設計方法 |
| JPH05121550A (ja) * | 1991-10-25 | 1993-05-18 | Kawasaki Steel Corp | 半導体集積回路 |
| JPH05135129A (ja) * | 1991-11-12 | 1993-06-01 | Nec Corp | シミユレーシヨン装置 |
| JPH05175334A (ja) * | 1991-12-21 | 1993-07-13 | Kawasaki Steel Corp | 半導体集積回路及びそのレイアウト方法 |
| JPH05299505A (ja) * | 1992-04-21 | 1993-11-12 | Mitsubishi Electric Corp | モジュール自動生成装置および半導体集積回路 |
| JPH06140507A (ja) * | 1992-10-23 | 1994-05-20 | Fujitsu Ltd | チップサイズ評価方法 |
-
1995
- 1995-01-31 JP JP7036238A patent/JP3017038B2/ja not_active Expired - Lifetime
-
1996
- 1996-01-30 DE DE19603327A patent/DE19603327A1/de not_active Withdrawn
- 1996-01-31 KR KR1019960002356A patent/KR960030400A/ko not_active Application Discontinuation
- 1996-01-31 TW TW085101185A patent/TW290664B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI396998B (zh) * | 2005-08-05 | 2013-05-21 | Ibm | 用於控制在cad系統之編輯螢幕上顯示的系統、方法及程式產品 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19603327A1 (de) | 1996-08-08 |
| JPH08213467A (ja) | 1996-08-20 |
| JP3017038B2 (ja) | 2000-03-06 |
| KR960030400A (ko) | 1996-08-17 |