TW287294B - - Google Patents

Info

Publication number
TW287294B
TW287294B TW084100158A TW84100158A TW287294B TW 287294 B TW287294 B TW 287294B TW 084100158 A TW084100158 A TW 084100158A TW 84100158 A TW84100158 A TW 84100158A TW 287294 B TW287294 B TW 287294B
Authority
TW
Taiwan
Application number
TW084100158A
Other languages
Chinese (zh)
Original Assignee
Shinetsu Chem Ind Co
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chem Ind Co, Tokyo Electron Co Ltd filed Critical Shinetsu Chem Ind Co
Application granted granted Critical
Publication of TW287294B publication Critical patent/TW287294B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Jigs For Machine Tools (AREA)
  • Ceramic Products (AREA)
TW084100158A 1993-12-27 1995-01-10 TW287294B (OSRAM)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33076493 1993-12-27
JP31637494A JPH07307377A (ja) 1993-12-27 1994-12-20 静電チャック付セラミックスヒーター

Publications (1)

Publication Number Publication Date
TW287294B true TW287294B (OSRAM) 1996-10-01

Family

ID=26568634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084100158A TW287294B (OSRAM) 1993-12-27 1995-01-10

Country Status (4)

Country Link
US (1) US5665260A (OSRAM)
JP (1) JPH07307377A (OSRAM)
KR (1) KR950021343A (OSRAM)
TW (1) TW287294B (OSRAM)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3208029B2 (ja) * 1994-11-22 2001-09-10 株式会社巴川製紙所 静電チャック装置およびその作製方法
JPH09213781A (ja) * 1996-02-01 1997-08-15 Tokyo Electron Ltd 載置台構造及びそれを用いた処理装置
EP0803900A3 (en) * 1996-04-26 1999-12-29 Applied Materials, Inc. Surface preparation to enhance the adhesion of a dielectric layer
US6037572A (en) * 1997-02-26 2000-03-14 White Consolidated Industries, Inc. Thin film heating assemblies
US5901030A (en) * 1997-12-02 1999-05-04 Dorsey Gage, Inc. Electrostatic chuck employing thermoelectric cooling
JPH11157953A (ja) 1997-12-02 1999-06-15 Nhk Spring Co Ltd セラミックスと金属との構造体及びそれを用いた静電チャック装置
JPH11260534A (ja) * 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
US5886866A (en) * 1998-07-06 1999-03-23 Applied Materials, Inc. Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
DE60028034T2 (de) 1999-04-06 2006-10-05 Tokyo Electron Ltd. Elektrode und herstellungsmethode für eine elektrode
US6462928B1 (en) 1999-05-07 2002-10-08 Applied Materials, Inc. Electrostatic chuck having improved electrical connector and method
US6490146B2 (en) 1999-05-07 2002-12-03 Applied Materials Inc. Electrostatic chuck bonded to base with a bond layer and method
US6310755B1 (en) * 1999-05-07 2001-10-30 Applied Materials, Inc. Electrostatic chuck having gas cavity and method
JP2001077182A (ja) * 1999-06-09 2001-03-23 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
US6835916B2 (en) 1999-08-09 2004-12-28 Ibiden, Co., Ltd Ceramic heater
JP2001118664A (ja) * 1999-08-09 2001-04-27 Ibiden Co Ltd セラミックヒータ
WO2001011921A1 (en) * 1999-08-09 2001-02-15 Ibiden Co., Ltd. Ceramic heater
WO2001019139A1 (en) * 1999-09-07 2001-03-15 Ibiden Co., Ltd. Ceramic heater
WO2001039551A1 (en) * 1999-11-19 2001-05-31 Ibiden Co., Ltd. Ceramic heater
US6410172B1 (en) 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
JP2001297857A (ja) * 1999-11-24 2001-10-26 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータ
EP1137321A1 (en) * 1999-11-30 2001-09-26 Ibiden Co., Ltd. Ceramic heater
JP4209057B2 (ja) * 1999-12-01 2009-01-14 東京エレクトロン株式会社 セラミックスヒーターならびにそれを用いた基板処理装置および基板処理方法
US6884972B2 (en) 1999-12-09 2005-04-26 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/inspecting apparatus
US6494955B1 (en) 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
JP2001253777A (ja) * 2000-03-13 2001-09-18 Ibiden Co Ltd セラミック基板
US6693789B2 (en) * 2000-04-05 2004-02-17 Sumitomo Osaka Cement Co., Ltd. Susceptor and manufacturing method thereof
WO2001080601A1 (fr) * 2000-04-14 2001-10-25 Ibiden Co., Ltd. Dispositif de chauffage en ceramique
JP2002141257A (ja) * 2000-05-24 2002-05-17 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータ
JP3516392B2 (ja) * 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
EP1229572A1 (en) * 2000-07-04 2002-08-07 Ibiden Co., Ltd. Hot plate for semiconductor manufacture and testing
WO2002007195A1 (fr) * 2000-07-19 2002-01-24 Ibiden Co., Ltd. Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs, son procede de fabrication, et son systeme de fabrication
WO2002007196A1 (fr) * 2000-07-19 2002-01-24 Ibiden Co., Ltd. Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs
US20040035846A1 (en) * 2000-09-13 2004-02-26 Yasuji Hiramatsu Ceramic heater for semiconductor manufacturing and inspecting equipment
DE10196908T1 (de) * 2000-11-16 2003-10-09 Mattson Tech Inc Vorrichtung und Verfahren für das ohmsche Heizen eines thermischen Bearbeitungssystems
EP1345472A1 (en) * 2000-11-24 2003-09-17 Ibiden Co., Ltd. Ceramic heater, and production method for ceramic heater
JP2002170651A (ja) * 2000-11-29 2002-06-14 Ibiden Co Ltd セラミックヒータ
US6554907B2 (en) 2001-01-02 2003-04-29 Applied Materials, Inc. Susceptor with internal support
US6623563B2 (en) * 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
US6538872B1 (en) 2001-11-05 2003-03-25 Applied Materials, Inc. Electrostatic chuck having heater and method
US6730175B2 (en) 2002-01-22 2004-05-04 Applied Materials, Inc. Ceramic substrate support
AU2003235268A1 (en) * 2002-05-16 2003-12-02 Nippon Electric Glass Co., Ltd. Cooking top plate
JP3963788B2 (ja) * 2002-06-20 2007-08-22 信越化学工業株式会社 静電吸着機能を有する加熱装置
JP2004146567A (ja) * 2002-10-24 2004-05-20 Sumitomo Electric Ind Ltd 半導体製造装置用セラミックスヒーター
JP4302428B2 (ja) * 2003-05-09 2009-07-29 信越化学工業株式会社 静電吸着機能を有するウエーハ加熱装置
JP4077430B2 (ja) * 2003-07-31 2008-04-16 佳知 高石 骨密度評価装置および骨密度評価方法
JP4309714B2 (ja) * 2003-08-27 2009-08-05 信越化学工業株式会社 静電吸着機能を有する加熱装置
JP4278046B2 (ja) 2003-11-10 2009-06-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ヒータ機構付き静電チャック
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US20060088692A1 (en) * 2004-10-22 2006-04-27 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/examining device
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
KR100794960B1 (ko) * 2006-06-07 2008-01-16 (주)나노테크 하이브리드형 히터 제조방법
US9275887B2 (en) 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
US7589950B2 (en) * 2006-10-13 2009-09-15 Applied Materials, Inc. Detachable electrostatic chuck having sealing assembly
KR101691044B1 (ko) * 2009-02-04 2016-12-29 맷슨 테크놀로지, 인크. 기판의 표면에 걸친 온도 프로파일을 방사상으로 튜닝하는 정전 척 시스템 및 방법
JP5543123B2 (ja) * 2009-03-30 2014-07-09 大日本スクリーン製造株式会社 熱処理用サセプタおよび熱処理装置
WO2010116809A1 (ja) * 2009-04-07 2010-10-14 Anbe Yoshinobu Ｘ線検査用加熱装置
JP6017781B2 (ja) * 2011-12-07 2016-11-02 新光電気工業株式会社 基板温調固定装置及びその製造方法
CN103428909A (zh) * 2013-07-12 2013-12-04 罗日良 一种发热管成型工艺
CN103369750A (zh) * 2013-08-08 2013-10-23 罗日良 一种发热管成型工艺
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法
JP6587223B1 (ja) * 2018-07-30 2019-10-09 Toto株式会社 静電チャック
WO2020171179A1 (ja) * 2019-02-21 2020-08-27 京セラ株式会社 試料保持具

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900396A (en) * 1987-08-19 1990-02-13 Agency Of Industrial Science And Technology Method of forming modified layer and pattern
EP0504424B1 (en) * 1990-10-05 1999-12-15 Sumitomo Electric Industries, Ltd. Hard material clad with diamond, throwaway chip, and method of making said material and chip
JPH0750736B2 (ja) * 1990-12-25 1995-05-31 日本碍子株式会社 ウエハー加熱装置及びその製造方法
US5166856A (en) * 1991-01-31 1992-11-24 International Business Machines Corporation Electrostatic chuck with diamond coating
US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
JPH04345019A (ja) * 1991-05-22 1992-12-01 Toshiba Ceramics Co Ltd 半導体用処理部材
JP3081279B2 (ja) * 1991-06-03 2000-08-28 電気化学工業株式会社 ホットプレート
JPH0513555A (ja) * 1991-07-01 1993-01-22 Toto Ltd 静電チヤツク及び静電チヤツクに対する電圧印加方法
US5343022A (en) * 1992-09-29 1994-08-30 Advanced Ceramics Corporation Pyrolytic boron nitride heating unit
US5384682A (en) * 1993-03-22 1995-01-24 Toto Ltd. Electrostatic chuck

Also Published As

Publication number Publication date
JPH07307377A (ja) 1995-11-21
US5665260A (en) 1997-09-09
KR950021343A (ko) 1995-07-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees