TW280056B - - Google Patents

Info

Publication number
TW280056B
TW280056B TW084113821A TW84113821A TW280056B TW 280056 B TW280056 B TW 280056B TW 084113821 A TW084113821 A TW 084113821A TW 84113821 A TW84113821 A TW 84113821A TW 280056 B TW280056 B TW 280056B
Authority
TW
Taiwan
Application number
TW084113821A
Other languages
Chinese (zh)
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW280056B publication Critical patent/TW280056B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW084113821A 1994-12-27 1995-12-23 TW280056B (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6324893A JP2912174B2 (ja) 1994-12-27 1994-12-27 ライブラリ群及びそれを用いた半導体集積回路

Publications (1)

Publication Number Publication Date
TW280056B true TW280056B (pl) 1996-07-01

Family

ID=18170808

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084113821A TW280056B (pl) 1994-12-27 1995-12-23

Country Status (4)

Country Link
US (1) US5663662A (pl)
EP (1) EP0720233A3 (pl)
JP (1) JP2912174B2 (pl)
TW (1) TW280056B (pl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8120707B2 (en) 2006-04-20 2012-02-21 Sandisk Il Ltd. UFD-accomodating multimedia system

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JP4014708B2 (ja) * 1997-08-21 2007-11-28 株式会社ルネサステクノロジ 半導体集積回路装置の設計方法
TW392307B (en) * 1998-01-13 2000-06-01 Mitsubishi Electric Corp A method of the manufacture and the setup of the semiconductor apparatus
JP3157775B2 (ja) * 1998-04-14 2001-04-16 日本電気アイシーマイコンシステム株式会社 半導体集積回路装置及びその回路設計方法
US6275973B1 (en) * 1998-10-30 2001-08-14 Lsi Logic Corporation Integrated circuit design with delayed cell selection
JP3372918B2 (ja) 1999-12-21 2003-02-04 日本電気株式会社 設計支援システム及びセル配置方法
US6591407B1 (en) * 2000-03-01 2003-07-08 Sequence Design, Inc. Method and apparatus for interconnect-driven optimization of integrated circuit design
JP2002299466A (ja) * 2001-03-30 2002-10-11 Hitachi Ltd 半導体集積回路装置およびその製造方法
US7082104B2 (en) * 2001-05-18 2006-07-25 Intel Corporation Network device switch
JP3745257B2 (ja) 2001-08-17 2006-02-15 キヤノン販売株式会社 半導体装置及びその製造方法
US6435657B1 (en) 2001-08-20 2002-08-20 Eastman Kodak Company Method for multicolorant printing of digital images using reduced colorant amounts
US7093224B2 (en) 2001-08-28 2006-08-15 Intel Corporation Model-based logic design
US6721925B2 (en) * 2001-08-29 2004-04-13 Intel Corporation Employing intelligent logical models to enable concise logic representations for clarity of design description and for rapid design capture
US6859913B2 (en) * 2001-08-29 2005-02-22 Intel Corporation Representing a simulation model using a hardware configuration database
US7073156B2 (en) * 2001-08-29 2006-07-04 Intel Corporation Gate estimation process and method
US7107201B2 (en) 2001-08-29 2006-09-12 Intel Corporation Simulating a logic design
US6983427B2 (en) * 2001-08-29 2006-01-03 Intel Corporation Generating a logic design
US20030046054A1 (en) * 2001-08-29 2003-03-06 Wheeler William R. Providing modeling instrumentation with an application programming interface to a GUI application
US20030046051A1 (en) * 2001-08-29 2003-03-06 Wheeler William R. Unified design parameter dependency management method and apparatus
US7130784B2 (en) * 2001-08-29 2006-10-31 Intel Corporation Logic simulation
US7197724B2 (en) * 2002-01-17 2007-03-27 Intel Corporation Modeling a logic design
US20030145311A1 (en) * 2002-01-25 2003-07-31 Wheeler William R. Generating simulation code
JP2004006514A (ja) 2002-05-31 2004-01-08 Oki Electric Ind Co Ltd ゲートアレイ半導体装置の基本セル，ゲートアレイ半導体装置，および，ゲートアレイ半導体装置のレイアウト方法
US7039882B2 (en) * 2002-06-17 2006-05-02 Amar Pal Singh Rana Technology dependent transformations for Silicon-On-Insulator in digital design synthesis
JP3964295B2 (ja) 2002-09-18 2007-08-22 松下電器産業株式会社 集積回路設計における電源経路構造
US6841810B1 (en) * 2003-08-08 2005-01-11 Semiconductor Components Industries, L.L.C. Cell structure for bipolar integrated circuits and method
JP4683833B2 (ja) 2003-10-31 2011-05-18 株式会社半導体エネルギー研究所 機能回路及びその設計方法
US7084476B2 (en) * 2004-02-26 2006-08-01 International Business Machines Corp. Integrated circuit logic with self compensating block delays
US7114134B2 (en) * 2004-05-27 2006-09-26 Veri Silicon Holdings, Co. Ltd Automatic circuit design method with a cell library providing transistor size information
US7426710B2 (en) * 2004-05-27 2008-09-16 Verisilicon Holdings, Co. Ltd. Standard cell library having cell drive strengths selected according to delay
US20050278659A1 (en) * 2004-05-27 2005-12-15 Xiaonan Zhang Cell library providing transistor size information for automatic circuit design
US7254802B2 (en) * 2004-05-27 2007-08-07 Verisilicon Holdings, Co. Ltd. Standard cell library having cell drive strengths selected according to delay
US7185294B2 (en) * 2004-09-23 2007-02-27 Verisilicon Holdings, Co Ltd Standard cell library having globally scalable transistor channel length
JP4536559B2 (ja) * 2005-03-17 2010-09-01 富士通セミコンダクター株式会社 半導体集積回路のレイアウト方法、およびセル枠共通化プログラム。
JP2006285572A (ja) * 2005-03-31 2006-10-19 Toshiba Corp 半導体集積回路のレイアウト方法
JP4845177B2 (ja) * 2005-07-15 2011-12-28 ラピスセミコンダクタ株式会社 半導体装置
US9369824B2 (en) * 2014-03-24 2016-06-14 R2Z Innovations, Inc. System for communicating with computing devices in an alternating electric field environment
US10276581B1 (en) 2017-10-31 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit chip and manufacturing method thereof

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JPS6017932A (ja) * 1983-07-09 1985-01-29 Fujitsu Ltd ゲ−ト・アレイ
JPS6057643A (ja) * 1983-07-12 1985-04-03 Seiko Epson Corp 半導体装置の製造方法
JPS60141760A (ja) * 1983-12-29 1985-07-26 Adeka Argus Chem Co Ltd 高分子材料組成物
US4651109A (en) * 1984-06-12 1987-03-17 Murata Manufacturing Co., Ltd. Piezoelectric resonance component having an improved group delay time characteristic
JPS6343345A (ja) * 1986-08-08 1988-02-24 Matsushita Electric Ind Co Ltd 集積回路
JPH0650761B2 (ja) * 1986-08-12 1994-06-29 富士通株式会社 半導体装置
JPS6346748A (ja) * 1986-08-15 1988-02-27 Nec Corp 論理回路
US5289021A (en) * 1990-05-15 1994-02-22 Siarc Basic cell architecture for mask programmable gate array with 3 or more size transistors
JPH04343522A (ja) * 1991-05-21 1992-11-30 Mitsubishi Denki Eng Kk Ｌｓｉの入出力バッファ回路形成方法
JPH05315448A (ja) * 1992-04-27 1993-11-26 Nec Corp 集積回路装置およびそのレイアウト方法
JP3468304B2 (ja) * 1993-03-16 2003-11-17 大日本印刷株式会社 Ｌｓｉ設計用ｃａｄのデータライブラリ生成装置
JP2990998B2 (ja) * 1993-05-14 1999-12-13 日本電気株式会社 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8120707B2 (en) 2006-04-20 2012-02-21 Sandisk Il Ltd. UFD-accomodating multimedia system

Also Published As

Publication number Publication date
US5663662A (en) 1997-09-02
EP0720233A2 (en) 1996-07-03
EP0720233A3 (en) 2001-06-13
JPH08181216A (ja) 1996-07-12
JP2912174B2 (ja) 1999-06-28

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