TW279255B - Method of encapsulating semiconductor - Google Patents

Method of encapsulating semiconductor

Info

Publication number
TW279255B
TW279255B TW084105059A TW84105059A TW279255B TW 279255 B TW279255 B TW 279255B TW 084105059 A TW084105059 A TW 084105059A TW 84105059 A TW84105059 A TW 84105059A TW 279255 B TW279255 B TW 279255B
Authority
TW
Taiwan
Prior art keywords
group
substituted
represent
epoxy resin
encapsulating
Prior art date
Application number
TW084105059A
Other languages
English (en)
Inventor
Akihiro Inagi
Isao Yamamura
Original Assignee
Generall Instr Of Taiwan Ltd
Nippon Hodaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Generall Instr Of Taiwan Ltd, Nippon Hodaku Co Ltd filed Critical Generall Instr Of Taiwan Ltd
Application granted granted Critical
Publication of TW279255B publication Critical patent/TW279255B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW084105059A 1994-09-08 1995-05-20 Method of encapsulating semiconductor TW279255B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6214877A JP2875479B2 (ja) 1994-09-08 1994-09-08 半導体の封止方法

Publications (1)

Publication Number Publication Date
TW279255B true TW279255B (en) 1996-06-21

Family

ID=16663052

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105059A TW279255B (en) 1994-09-08 1995-05-20 Method of encapsulating semiconductor

Country Status (3)

Country Link
US (1) US5610443A (zh)
JP (1) JP2875479B2 (zh)
TW (1) TW279255B (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6261508B1 (en) * 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
DE19756325A1 (de) * 1997-12-18 1999-07-01 Daimler Chrysler Ag Halbleiterscheibe mit integrierten Einzelbauelementen, Verfahren und Vorrichtung zur Herstellung einer Halbleiterscheibe
JP3132449B2 (ja) * 1998-01-09 2001-02-05 日本電気株式会社 樹脂外装型半導体装置の製造方法
JP4417494B2 (ja) * 1999-09-17 2010-02-17 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物および樹脂封止型半導体装置
JP2001196642A (ja) 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd 発光装置
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
JP4560982B2 (ja) * 2000-04-17 2010-10-13 三菱電機株式会社 高圧回転機用絶縁コイルの製造方法
US6709741B1 (en) * 2001-09-07 2004-03-23 Taiflex Scientific Co., Ltd. FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and filler
US6773474B2 (en) 2002-04-19 2004-08-10 3M Innovative Properties Company Coated abrasive article
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
US6974728B2 (en) * 2003-12-08 2005-12-13 Intel Corporation Encapsulant mixture having a polymer bound catalyst
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
JP4688028B2 (ja) * 2005-09-28 2011-05-25 株式会社村田製作所 固体電解コンデンサ及びその製造方法
US20080012124A1 (en) * 2006-05-16 2008-01-17 Stapleton Russell A Curable protectant for electronic assemblies
CN101522793B (zh) * 2006-10-06 2011-12-28 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
ES2341375T3 (es) * 2007-04-03 2010-06-18 Abb Research Ltd Composicion de resina epoxi curable.
WO2013118509A1 (ja) * 2012-02-10 2013-08-15 三井化学株式会社 有機ｅｌ素子用の面封止剤、これを用いた有機ｅｌデバイス、及びその製造方法
JP5783137B2 (ja) * 2012-06-15 2015-09-24 信越化学工業株式会社 スルホニウム塩、高分子化合物、レジスト材料及びパターン形成方法
WO2015174124A1 (ja) 2014-05-15 2015-11-19 株式会社 村田製作所 積層コイル部品、およびその製造方法
JP6320172B2 (ja) * 2014-05-29 2018-05-09 Ｔｏｗａ株式会社 電子部品の樹脂封止方法及び樹脂封止装置
DE102016106031B4 (de) * 2016-04-01 2025-01-16 Dr. Neidlinger Holding Gmbh Heißhärtendes Zweikomponenten-Epoxidharzsystem und dessen Verwendung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4026862A (en) * 1974-02-11 1977-05-31 Westinghouse Electric Corporation Carboxylic acid storage stabilizers for latent catalyst cured epoxy resins
JPH0299953A (ja) * 1988-10-06 1990-04-11 Matsushita Electric Ind Co Ltd パターン形成材料
US5095053A (en) * 1989-03-27 1992-03-10 General Electric Company Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions
JPH04195064A (ja) * 1990-11-28 1992-07-15 Konica Corp 感光体

Also Published As

Publication number Publication date
JP2875479B2 (ja) 1999-03-31
US5610443A (en) 1997-03-11
JPH08213417A (ja) 1996-08-20

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