GB1235413A - Epoxy resin encapsulant compositions for semiconductors - Google Patents

Epoxy resin encapsulant compositions for semiconductors

Info

Publication number
GB1235413A
GB1235413A GB0985/69A GB198569A GB1235413A GB 1235413 A GB1235413 A GB 1235413A GB 0985/69 A GB0985/69 A GB 0985/69A GB 198569 A GB198569 A GB 198569A GB 1235413 A GB1235413 A GB 1235413A
Authority
GB
United Kingdom
Prior art keywords
composition
silane
alkyl
epoxy resin
amine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB0985/69A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexter Corp
Original Assignee
Dexter Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexter Corp filed Critical Dexter Corp
Publication of GB1235413A publication Critical patent/GB1235413A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

1,235,413 Epoxy resin composition DEXTER CORP. 13 Jan., 1969 [26 Jan., 1968], No. 1985/69. Heading C3B. [Also in Division H1] A composition useful in the encapsulation of semi-conductors comprises, an uncured epoxy resin, an amine, anhydride or phenolic novolak curing agent and from 0À05-5% by weight, based on the total composition, of an alkylpolyalkoxy silane having an amine or epoxy substituent in the alkyl group; the alkyl and alkoxy groups each contain 1 to 6 carbon atoms. The silane may have the formula in which R<SP>1</SP> is C 1-3 alkyl, R<SP>2</SP> is C 1-3 alkyl or OR<SP>1</SP> and R<SP>3</SP> is a C 2-4 alkyl having an amine or epoxy substituent. Examples are # -(3,4 - epoxycyclohexyl)ethyltrimethoxysilane; y - glycidoxypropyltrimethoxysilane; γ-aminopropyltriethoxysilane and N - (# - aminoethyl) - γ- aminoisobutylmethyldimethoxysilane. The composition may also contain up to 70% by wt. of an inorganic filler, e.g. silica. The silane may be pre-coated on the filler prior to mixing with the epoxy resin. The composition may be a powder which may be fluidized and applied to a heated semi-conductor body. The silane may be pre-blended with the fluidized resin component. The composition may also be liquid and be prepared by bringing together, immediately prior to use, two liquid components in which the resin component (optionally containing filler pre-coated with silane) are kept apart from the curing agents.
GB0985/69A 1968-01-26 1969-01-13 Epoxy resin encapsulant compositions for semiconductors Expired GB1235413A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70072668A 1968-01-26 1968-01-26

Publications (1)

Publication Number Publication Date
GB1235413A true GB1235413A (en) 1971-06-16

Family

ID=24814628

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0985/69A Expired GB1235413A (en) 1968-01-26 1969-01-13 Epoxy resin encapsulant compositions for semiconductors

Country Status (3)

Country Link
FR (1) FR2000839A1 (en)
GB (1) GB1235413A (en)
NL (1) NL6901148A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2176073A1 (en) * 1972-03-15 1973-10-26 Hitachi Ltd Epoxy resin compsn - contg cycloaliphatic amine/silicon - amine hardener - for high voltage insulation
EP1519389A1 (en) * 2003-09-18 2005-03-30 Rohm And Haas Company Electrically insulative powder coatings and compositions and methods for making them

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900600A (en) * 1973-06-29 1975-08-19 Ibm Paraxylylene-silane dielectric films
JPS5710575B2 (en) * 1973-12-12 1982-02-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2176073A1 (en) * 1972-03-15 1973-10-26 Hitachi Ltd Epoxy resin compsn - contg cycloaliphatic amine/silicon - amine hardener - for high voltage insulation
EP1519389A1 (en) * 2003-09-18 2005-03-30 Rohm And Haas Company Electrically insulative powder coatings and compositions and methods for making them

Also Published As

Publication number Publication date
DE1903098A1 (en) 1970-06-11
NL6901148A (en) 1969-07-29
FR2000839A1 (en) 1969-09-12
DE1903098B2 (en) 1971-04-22

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