TW242680B - - Google Patents

Info

Publication number
TW242680B
TW242680B TW082110859A TW82110859A TW242680B TW 242680 B TW242680 B TW 242680B TW 082110859 A TW082110859 A TW 082110859A TW 82110859 A TW82110859 A TW 82110859A TW 242680 B TW242680 B TW 242680B
Authority
TW
Taiwan
Application number
TW082110859A
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of TW242680B publication Critical patent/TW242680B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
    • H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
    • H04N1/0315—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors using photodetectors and illumination means mounted on separate supports or substrates or mounted in different planes
    • H04N1/0316—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors using photodetectors and illumination means mounted on separate supports or substrates or mounted in different planes illuminating the scanned image elements through the plane of the photodetector, e.g. back-light illumination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
    • H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
    • H04N1/0313—Direct contact pick-up heads, i.e. heads having no array of elements to project the scanned image elements onto the photodectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Facsimile Heads (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW082110859A 1992-12-24 1993-12-21 TW242680B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4357275A JP3067435B2 (ja) 1992-12-24 1992-12-24 画像読取用光電変換装置及び該装置を有する画像処理装置

Publications (1)

Publication Number Publication Date
TW242680B true TW242680B (zh) 1995-03-11

Family

ID=18453286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082110859A TW242680B (zh) 1992-12-24 1993-12-21

Country Status (6)

Country Link
US (1) US5475211A (zh)
EP (1) EP0603903B1 (zh)
JP (1) JP3067435B2 (zh)
KR (1) KR970011762B1 (zh)
DE (1) DE69332073T2 (zh)
TW (1) TW242680B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3957803B2 (ja) * 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
JP3397992B2 (ja) * 1996-11-12 2003-04-21 京セラミタ株式会社 画像形成装置
US6154294A (en) * 1998-07-16 2000-11-28 Silitek Corporation Apparatus for scanning documents such as photographs using a contact image sensor
US6794725B2 (en) * 1999-12-21 2004-09-21 Xerox Corporation Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources
JP4916101B2 (ja) * 2004-09-01 2012-04-11 キヤノン株式会社 光電変換装置、固体撮像装置及び固体撮像システム
JP2006073736A (ja) * 2004-09-01 2006-03-16 Canon Inc 光電変換装置、固体撮像装置及び固体撮像システム
JP4971586B2 (ja) * 2004-09-01 2012-07-11 キヤノン株式会社 固体撮像装置
JP5089017B2 (ja) * 2004-09-01 2012-12-05 キヤノン株式会社 固体撮像装置及び固体撮像システム
JP4677258B2 (ja) 2005-03-18 2011-04-27 キヤノン株式会社 固体撮像装置及びカメラ
JP4459099B2 (ja) 2005-03-18 2010-04-28 キヤノン株式会社 固体撮像装置及びカメラ
JP4794877B2 (ja) * 2005-03-18 2011-10-19 キヤノン株式会社 固体撮像装置及びカメラ
JP4459098B2 (ja) * 2005-03-18 2010-04-28 キヤノン株式会社 固体撮像装置及びカメラ
JP5274166B2 (ja) * 2008-09-10 2013-08-28 キヤノン株式会社 光電変換装置及び撮像システム
JP5058957B2 (ja) * 2008-12-11 2012-10-24 シャープ株式会社 太陽電池モジュールの製造方法
JP5478905B2 (ja) * 2009-01-30 2014-04-23 キヤノン株式会社 固体撮像装置
JP5780711B2 (ja) 2010-04-06 2015-09-16 キヤノン株式会社 固体撮像装置
EP2436711A1 (de) * 2010-10-01 2012-04-04 Resopal Gmbh Biokompositplatte
JP6108884B2 (ja) 2013-03-08 2017-04-05 キヤノン株式会社 光電変換装置及び撮像システム
JP2014175553A (ja) 2013-03-11 2014-09-22 Canon Inc 固体撮像装置およびカメラ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1127227A (en) * 1977-10-03 1982-07-06 Ichiro Endo Liquid jet recording process and apparatus therefor
JPS5882580A (ja) * 1981-11-11 1983-05-18 Moririka:Kk 光導電素子
JPS58194564A (ja) * 1982-05-11 1983-11-12 Canon Inc インクジェット装置
JPS60219524A (ja) * 1984-04-16 1985-11-02 Canon Inc フオトセンサ
JPS62293766A (ja) * 1986-06-13 1987-12-21 Tokyo Electric Co Ltd 光電変換装置
JPS63133667A (ja) * 1986-11-26 1988-06-06 Ricoh Co Ltd 密着形光電変換装置
US5162644A (en) * 1988-03-14 1992-11-10 Hitachi, Ltd. Contact type image sensor having photoelectric conversion elements to reduce signal variation caused by luminous intensity variation of light source
US5065006A (en) * 1988-10-14 1991-11-12 Matsushita Electric Industrial Co., Inc. Image sensors with simplified chip mounting
US5101285A (en) * 1989-07-24 1992-03-31 Canon Kabushiki Kaisha Photoelectric conversion device having an improved illuminating system and information processing apparatus mounting the device
US5196691A (en) * 1989-11-21 1993-03-23 Canon Kabushiki Kaisha Photoelectric converting device having original conveyance guide and an image processing apparatus incorporating the device
JPH03207158A (ja) * 1990-01-09 1991-09-10 Ricoh Co Ltd 完全密着型ラインセンサ
TW219990B (zh) * 1990-10-11 1994-02-01 Canon Kk
JP2991507B2 (ja) * 1991-01-19 1999-12-20 キヤノン株式会社 インクジェット記録ヘッドカートリッジ、および、それが用いられるインクジェット記録装置
US5321249A (en) * 1991-10-31 1994-06-14 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method of manufacturing the same

Also Published As

Publication number Publication date
EP0603903A1 (en) 1994-06-29
KR970011762B1 (ko) 1997-07-15
DE69332073T2 (de) 2003-02-27
JPH06197194A (ja) 1994-07-15
KR940016859A (ko) 1994-07-25
EP0603903B1 (en) 2002-07-03
US5475211A (en) 1995-12-12
DE69332073D1 (de) 2002-08-08
JP3067435B2 (ja) 2000-07-17

Similar Documents

Publication Publication Date Title
DK0634000T3 (zh)
DK0613608T3 (zh)
DK69194A (zh)
DK0603481T3 (zh)
DK0630289T3 (zh)
DK62692D0 (zh)
DK109593A (zh)
DK0596750T3 (zh)
DK148492D0 (zh)
DK0648175T3 (zh)
DK113692D0 (zh)
TW215962B (zh)
DK131792D0 (zh)
FR2688524B1 (zh)
FR2686806B1 (zh)
AU631518B2 (zh)
AU632452B2 (zh)
IN174109B (zh)
DK117092D0 (zh)
IN176580B (zh)
DK145992D0 (zh)
IN184929B (zh)
DK71192D0 (zh)
AU1281292A (zh)
AU1737992A (zh)