JP5058957B2 - 太陽電池モジュールの製造方法 - Google Patents
太陽電池モジュールの製造方法 Download PDFInfo
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- JP5058957B2 JP5058957B2 JP2008315751A JP2008315751A JP5058957B2 JP 5058957 B2 JP5058957 B2 JP 5058957B2 JP 2008315751 A JP2008315751 A JP 2008315751A JP 2008315751 A JP2008315751 A JP 2008315751A JP 5058957 B2 JP5058957 B2 JP 5058957B2
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- Prior art keywords
- solar cell
- sheet
- wire
- cell module
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 49
- 229920005989 resin Polymers 0.000 claims description 146
- 239000011347 resin Substances 0.000 claims description 146
- 239000000758 substrate Substances 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 44
- 238000007789 sealing Methods 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 102
- 239000005038 ethylene vinyl acetate Substances 0.000 description 102
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 102
- 238000004382 potting Methods 0.000 description 78
- 229920000139 polyethylene terephthalate Polymers 0.000 description 34
- 239000005020 polyethylene terephthalate Substances 0.000 description 34
- 238000010248 power generation Methods 0.000 description 18
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 230000003014 reinforcing effect Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- -1 Polybutylene terephthalate Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Description
2 太陽電池素子
3 基板
4、40 EVAシート(第1のシート)
4´エチレン酢酸ビニル
5 ポッティング樹脂(高粘度樹脂)
6 PETシート(第2のシート)
22 太陽電池素子の表面
100、150、160
太陽電池モジュール
Claims (3)
- 太陽電池素子が、ワイヤにより、基板に接続された太陽電池モジュールの製造方法であって、
上記ワイヤを高粘度樹脂で封止することにより、上記太陽電池素子における上記基板と反対側の表面を露出させ、
上記ワイヤを封止している高粘度樹脂と、上記太陽電池素子とを、上記高粘度樹脂および上記太陽電池素子に被覆した透明接着剤からなる第1のシートによりラミネート封止し、
上記第1のシートに、透明かつ所定の耐熱性を有する第2のシートを被覆し、
上記第2のシートを、上記基板に熱圧着することを特徴とする太陽電池モジュールの製造方法。 - 太陽電池素子が、ワイヤにより、基板に接続された太陽電池モジュールの製造方法であって、
上記太陽電池素子に、上記基板から見た上記ワイヤの丈よりも、寸法が大きくなるような厚みを有しており、かつ、該ワイヤに被覆すべき部分が取り除かれている第1のシートであって、透明接着剤からなる第1のシートを被覆し、
上記第1のシートに、透明かつ所定の耐熱性を有する第2のシートを被覆することを特徴とする太陽電池モジュールの製造方法。 - 上記第2のシートを、上記基板に熱圧着することを特徴とする請求項2に記載の太陽電池モジュールの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008315751A JP5058957B2 (ja) | 2008-12-11 | 2008-12-11 | 太陽電池モジュールの製造方法 |
US12/635,031 US20100147377A1 (en) | 2008-12-11 | 2009-12-10 | Solar cell module and method for producing the same |
CN200910254193A CN101752437A (zh) | 2008-12-11 | 2009-12-10 | 太阳能电池模块及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008315751A JP5058957B2 (ja) | 2008-12-11 | 2008-12-11 | 太陽電池モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010141109A JP2010141109A (ja) | 2010-06-24 |
JP5058957B2 true JP5058957B2 (ja) | 2012-10-24 |
Family
ID=42239101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008315751A Expired - Fee Related JP5058957B2 (ja) | 2008-12-11 | 2008-12-11 | 太陽電池モジュールの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100147377A1 (ja) |
JP (1) | JP5058957B2 (ja) |
CN (1) | CN101752437A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006109484A1 (ja) * | 2005-03-31 | 2006-10-19 | Honda Motor Co., Ltd. | 自動二輪車用車体フレーム |
WO2006109482A1 (ja) * | 2005-03-31 | 2006-10-19 | Honda Motor Co., Ltd. | 自動二輪車用車体フレーム |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102834965B (zh) * | 2010-10-06 | 2015-03-18 | 株式会社藤仓 | 染料敏化太阳能电池 |
KR20120037261A (ko) * | 2010-10-11 | 2012-04-19 | 삼성전자주식회사 | 태양 전지 모듈 및 그 제조 방법 |
JP5669246B1 (ja) * | 2014-05-12 | 2015-02-12 | レーザーテック株式会社 | リチウムイオン電池の観察方法並びに試験用のリチウムイオン電池及びその製造方法 |
JP2019179907A (ja) * | 2018-03-30 | 2019-10-17 | Tdk株式会社 | コイルユニット、ワイヤレス送電装置、ワイヤレス受電装置及びワイヤレス電力伝送システム |
CN114582998A (zh) * | 2022-02-25 | 2022-06-03 | 晶澳(扬州)新能源有限公司 | 封装材料膜及其制造方法、太阳能电池组件及其制造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5328751B2 (ja) * | 1974-11-27 | 1978-08-16 | ||
JPS5333592A (en) * | 1976-09-09 | 1978-03-29 | Seiko Epson Corp | Solar battery |
JPS60216587A (ja) * | 1984-04-12 | 1985-10-30 | Kawasaki Steel Corp | 太陽電池用基板 |
US4574160A (en) * | 1984-09-28 | 1986-03-04 | The Standard Oil Company | Flexible, rollable photovoltaic cell module |
US5296043A (en) * | 1990-02-16 | 1994-03-22 | Canon Kabushiki Kaisha | Multi-cells integrated solar cell module and process for producing the same |
JP3067435B2 (ja) * | 1992-12-24 | 2000-07-17 | キヤノン株式会社 | 画像読取用光電変換装置及び該装置を有する画像処理装置 |
US5942330A (en) * | 1994-05-19 | 1999-08-24 | Bostik, Incorporated | Adhesive compositions and methods and articles of manufacture comprising same |
JPH08186137A (ja) * | 1995-01-05 | 1996-07-16 | Matsushita Electric Ind Co Ltd | 半導体チップの樹脂封止方法 |
JPH10261741A (ja) * | 1997-03-19 | 1998-09-29 | Oki Electric Ind Co Ltd | 半導体装置及び半導体装置の製造方法 |
US5962810A (en) * | 1997-09-09 | 1999-10-05 | Amkor Technology, Inc. | Integrated circuit package employing a transparent encapsulant |
JPH11317475A (ja) * | 1998-02-27 | 1999-11-16 | Canon Inc | 半導体用封止材樹脂および半導体素子 |
JP2003198897A (ja) * | 2001-12-27 | 2003-07-11 | Seiko Epson Corp | 光モジュール、回路基板及び電子機器 |
JP2004288898A (ja) * | 2003-03-24 | 2004-10-14 | Canon Inc | 太陽電池モジュールの製造方法 |
US20080223429A1 (en) * | 2004-08-09 | 2008-09-18 | The Australian National University | Solar Cell (Sliver) Sub-Module Formation |
JP2006128289A (ja) * | 2004-10-27 | 2006-05-18 | Sharp Corp | 接着樹脂フィルムおよび半導体モジュールの製造方法 |
JP2006156873A (ja) * | 2004-12-01 | 2006-06-15 | Sharp Corp | 樹脂フィルムおよびそれを用いた半導体モジュールの製造方法 |
JP2007227260A (ja) * | 2006-02-24 | 2007-09-06 | Kyocera Corp | 光電変換装置及び光発電装置 |
US20090032972A1 (en) * | 2007-03-30 | 2009-02-05 | Kabushiki Kaisha Toshiba | Semiconductor device |
-
2008
- 2008-12-11 JP JP2008315751A patent/JP5058957B2/ja not_active Expired - Fee Related
-
2009
- 2009-12-10 US US12/635,031 patent/US20100147377A1/en not_active Abandoned
- 2009-12-10 CN CN200910254193A patent/CN101752437A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006109484A1 (ja) * | 2005-03-31 | 2006-10-19 | Honda Motor Co., Ltd. | 自動二輪車用車体フレーム |
WO2006109482A1 (ja) * | 2005-03-31 | 2006-10-19 | Honda Motor Co., Ltd. | 自動二輪車用車体フレーム |
Also Published As
Publication number | Publication date |
---|---|
US20100147377A1 (en) | 2010-06-17 |
CN101752437A (zh) | 2010-06-23 |
JP2010141109A (ja) | 2010-06-24 |
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