TW238423B - - Google Patents

Info

Publication number
TW238423B
TW238423B TW081105051A TW81105051A TW238423B TW 238423 B TW238423 B TW 238423B TW 081105051 A TW081105051 A TW 081105051A TW 81105051 A TW81105051 A TW 81105051A TW 238423 B TW238423 B TW 238423B
Authority
TW
Taiwan
Application number
TW081105051A
Other languages
Chinese (zh)
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Application granted granted Critical
Publication of TW238423B publication Critical patent/TW238423B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Die Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW081105051A 1991-07-01 1992-06-26 TW238423B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/724,080 US5162613A (en) 1991-07-01 1991-07-01 Integrated circuit interconnection technique

Publications (1)

Publication Number Publication Date
TW238423B true TW238423B (https=) 1995-01-11

Family

ID=24908902

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081105051A TW238423B (https=) 1991-07-01 1992-06-26

Country Status (6)

Country Link
US (1) US5162613A (https=)
EP (1) EP0521672B1 (https=)
JP (1) JP2695578B2 (https=)
KR (1) KR960008512B1 (https=)
DE (1) DE69209169T2 (https=)
TW (1) TW238423B (https=)

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JP3225062B2 (ja) * 1991-08-05 2001-11-05 ローム株式会社 熱硬化性樹脂シート及びそれを用いた半導体素子の実装方法
US5459500A (en) * 1992-03-25 1995-10-17 Scitex Digital Printing, Inc. Charge plate connectors and method of making
DE4327560A1 (de) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung
US5432679A (en) * 1994-05-31 1995-07-11 The Whitaker Corporation Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane
US5697148A (en) * 1995-08-22 1997-12-16 Motorola, Inc. Flip underfill injection technique
US6580369B1 (en) 1995-10-11 2003-06-17 Motorola, Inc. Electronic tag assembly and method therefor
US5647123A (en) * 1995-10-16 1997-07-15 Motorola, Inc. Method for improving distribution of underfill between a flip chip die and a circuit board
US5783867A (en) * 1995-11-06 1998-07-21 Ford Motor Company Repairable flip-chip undercoating assembly and method and material for same
GB2307598B (en) * 1995-11-24 2000-02-23 Varintelligent Combined printed circuit board and integrated circuit driver
US5807767A (en) * 1996-01-02 1998-09-15 Micron Technology, Inc. Technique for attaching die to leads
US6460245B1 (en) * 1996-03-07 2002-10-08 Tessera, Inc. Method of fabricating semiconductor chip assemblies
EP1194030B1 (en) * 1997-10-02 2005-08-03 Matsushita Electric Industrial Co., Ltd. Method for mounting semiconductor element to circuit board, and semiconductor device
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
US6510606B2 (en) * 1998-06-15 2003-01-28 Lockheed Martin Corporation Multichip module
US6293804B2 (en) * 1999-02-08 2001-09-25 Ericsson Inc. Self-aligning LCD connector assembly
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
JP2000286526A (ja) * 1999-03-30 2000-10-13 Murata Mfg Co Ltd 表面実装構造及びその表面実装構造に用いられる表面実装型電子部品
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
KR100569119B1 (ko) * 2000-04-14 2006-04-10 주식회사 만도 차량용 파워스티어링 유압시험용 연결지그
JP4048076B2 (ja) * 2001-07-10 2008-02-13 株式会社日本触媒 ミカエル型付加物の分解方法
FI119215B (fi) * 2002-01-31 2008-08-29 Imbera Electronics Oy Menetelmä komponentin upottamiseksi alustaan ja elektroniikkamoduuli
US8455994B2 (en) * 2002-01-31 2013-06-04 Imbera Electronics Oy Electronic module with feed through conductor between wiring patterns
WO2004006389A1 (ja) * 2002-07-05 2004-01-15 J.S.T. Mfg. Co., Ltd. コネクタ、このコネクタの製造方法、およびこのコネクタを用いた配線板構造
US6906598B2 (en) 2002-12-31 2005-06-14 Mcnc Three dimensional multimode and optical coupling devices
JP3755824B2 (ja) * 2003-03-04 2006-03-15 株式会社らいふ 複数電極接着用の電子部品とその実装方法
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US8068346B2 (en) 2004-05-04 2011-11-29 Hamilton Sundstrand Corporation Circuit board with high density power semiconductors
JP2014082448A (ja) * 2012-09-28 2014-05-08 Sumitomo Bakelite Co Ltd 導電接続シート、端子間の接続方法、接続部の形成方法、半導体装置および電子機器
US10104772B2 (en) * 2014-08-19 2018-10-16 International Business Machines Incorporated Metallized particle interconnect with solder components
KR20160109071A (ko) * 2015-03-09 2016-09-21 현대자동차주식회사 회로기판을 갖는 전동식 펌프
US11626336B2 (en) * 2019-10-01 2023-04-11 Qualcomm Incorporated Package comprising a solder resist layer configured as a seating plane for a device

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US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
JPS5656174U (https=) * 1979-10-04 1981-05-15
JPS5787146A (en) * 1980-11-19 1982-05-31 Fujitsu Ltd Electrical connecting structure for indication electrode and integrated circuit element
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
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JPS60200114A (ja) * 1984-03-26 1985-10-09 Hitachi Ltd 液体金属中構造物映像化装置
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US4588456A (en) * 1984-10-04 1986-05-13 Amp Incorporated Method of making adhesive electrical interconnecting means
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US4729809A (en) * 1985-03-14 1988-03-08 Amp Incorporated Anisotropically conductive adhesive composition
US4659872A (en) * 1985-04-30 1987-04-21 Amp Incorporated Flexible flat multiconductor cable
US4818607A (en) * 1985-08-01 1989-04-04 Northrop Corporation Small hollow particles with conductive coating
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Also Published As

Publication number Publication date
KR930003795A (ko) 1993-02-24
JPH0766286A (ja) 1995-03-10
KR960008512B1 (en) 1996-06-26
EP0521672B1 (en) 1996-03-20
US5162613A (en) 1992-11-10
DE69209169T2 (de) 1996-07-25
JP2695578B2 (ja) 1997-12-24
DE69209169D1 (de) 1996-04-25
EP0521672A1 (en) 1993-01-07

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Legal Events

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MK4A Expiration of patent term of an invention patent