TW220028B - Method and apparatus for coating board-shaped articles, especially printed circuit boards - Google Patents
Method and apparatus for coating board-shaped articles, especially printed circuit boardsInfo
- Publication number
- TW220028B TW220028B TW082106305A TW82106305A TW220028B TW 220028 B TW220028 B TW 220028B TW 082106305 A TW082106305 A TW 082106305A TW 82106305 A TW82106305 A TW 82106305A TW 220028 B TW220028 B TW 220028B
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- circuit boards
- coating
- station
- transport means
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH263692 | 1992-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW220028B true TW220028B (en) | 1994-02-01 |
Family
ID=4238219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082106305A TW220028B (en) | 1992-08-24 | 1993-08-06 | Method and apparatus for coating board-shaped articles, especially printed circuit boards |
Country Status (9)
Country | Link |
---|---|
US (1) | US5462599A (zh) |
EP (1) | EP0585204B1 (zh) |
JP (1) | JP3203455B2 (zh) |
KR (1) | KR100275232B1 (zh) |
AT (1) | ATE143565T1 (zh) |
DE (1) | DE59303954D1 (zh) |
ES (1) | ES2092799T3 (zh) |
HK (1) | HK1005204A1 (zh) |
TW (1) | TW220028B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399144B (zh) * | 2007-05-29 | 2013-06-11 | Samsung Electronics Co Ltd | 用以發亮之發光二極體模組 |
CN113636270A (zh) * | 2021-08-04 | 2021-11-12 | 深圳市宏讯实业有限公司 | 一种氛围连续加工设备 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0592745B1 (de) * | 1992-09-28 | 1996-01-24 | Ciba-Geigy Ag | Verfahren und Vorrichtung zur beidseitigen Beschichtung von plattenförmigem Stückgut |
US5628112A (en) * | 1995-03-03 | 1997-05-13 | Ford Motor Company | Circuit board assembly system and method |
EP0885084B1 (en) * | 1995-08-29 | 2001-07-25 | Soltec B.V. | Reflow soldering apparatus with a rotative configuration |
US6258165B1 (en) * | 1996-11-01 | 2001-07-10 | Speedline Technologies, Inc. | Heater in a conveyor system |
TW416261B (en) * | 1997-04-24 | 2000-12-21 | Ciba Sc Holding Ag | Process and apparatus for the treatment of coated printed circuit boards |
DE10151708A1 (de) * | 2001-10-19 | 2003-05-08 | All4 Pcb Switzerland Ltd | Verfahren zum Aufnehmen von horizontal geförderten Platten in einer Puffervorrichtung sowie Puffervorrichtung |
US6760981B2 (en) | 2002-01-18 | 2004-07-13 | Speedline Technologies, Inc. | Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation |
US20060273138A1 (en) * | 2005-06-07 | 2006-12-07 | Samsung Electronics Co., Ltd. | Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board |
CN101979153B (zh) * | 2010-10-11 | 2012-10-03 | 李荣根 | 全自动水平式pcb板双面涂布机 |
KR101030268B1 (ko) | 2010-11-12 | 2011-04-21 | (주)유창 | 광촉매 코팅장치 및 이를 이용한 광촉매 코팅방법 |
CN106696475B (zh) * | 2015-11-13 | 2019-06-18 | 富泰华工业(深圳)有限公司 | 打印机及利用打印机打印电路板的方法 |
CN110497701B (zh) * | 2018-05-18 | 2021-01-29 | 富泰华工业(深圳)有限公司 | 立式电路板打印机及其打印方法 |
CN113492076B (zh) * | 2021-09-10 | 2021-11-09 | 南通普力新机械科技有限公司 | 不锈钢板保护剂喷涂设备 |
CN114980542B (zh) * | 2022-05-24 | 2023-11-10 | 东莞市黄江大顺电子有限公司 | 一种新能源汽车印刷电路板制造用设备 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2802339A1 (de) * | 1978-01-20 | 1979-07-26 | Paper Converting Machine Co | Vorrichtung zur zwischenpufferung auf paletten |
CH641708A5 (de) * | 1979-11-02 | 1984-03-15 | Sinter Ltd | Vorrichtung zum aufbringen von lot auf leiterplatten. |
US4559896A (en) * | 1983-09-15 | 1985-12-24 | Ciba Geigy Corporation | Coating apparatus |
EP0224440B1 (de) * | 1985-11-08 | 1989-08-16 | Ciba-Geigy Ag | Transportvorrichtung für Platten |
DE3539959A1 (de) * | 1985-11-11 | 1987-05-21 | Weber Erich Dipl Ing Fh | Verfahren zum transportieren von leiterplatten durch trocknungsanlagen und vorrichtung zur durchfuehrung dieses verfahrens |
DE3602350C2 (de) * | 1986-01-27 | 1994-08-18 | Weber Marianne | Verfahren und Anlage zum beidseitigen Beschichten von Platten mit flüssigem Beschichtungsmaterial |
DE3721404A1 (de) * | 1987-06-29 | 1989-01-12 | Kopperschmidt Mueller & Co | Vorrichtung zur elektrostatischen spruehbeschichtung von plattenfoermigen werkstuecken |
US4926789A (en) * | 1987-10-13 | 1990-05-22 | Ciba-Geigy Corporation | Transport apparatus for boards |
DE3738067A1 (de) * | 1987-11-09 | 1989-05-18 | Wolfgang Anger | Einrichtung zum mehrfachen beschichten von platten |
EP0421931A1 (de) * | 1989-10-06 | 1991-04-10 | Ciba-Geigy Ag | Transportvorrichtung für Platten, insbesondere mit empfindlicher Oberfläche |
DE3937071A1 (de) * | 1989-11-07 | 1991-05-08 | Kopperschmidt Mueller & Co | Vorrichtung und verfahren zum beschichten von plattenfoermigen substraten, wie leiterplatten |
EP0441743A1 (de) * | 1990-02-05 | 1991-08-14 | Ciba-Geigy Ag | Transportvorrichtung für Platten mit empfindlicher Oberfläche, insbesondere für nassbeschichtete Leiterplatten |
US5188669A (en) * | 1991-02-22 | 1993-02-23 | Nordson Corporation | Circuit board coating apparatus with inverting pallet shuttle |
DE4107224C1 (zh) * | 1991-03-07 | 1992-06-04 | Dupont De Nemours Gmbh, 6380 Bad Homburg, De | |
EP0542684B1 (de) * | 1991-11-13 | 1997-04-09 | Ciba-Geigy Ag | Beschichtungsvorrichtung für Platten |
-
1993
- 1993-08-06 TW TW082106305A patent/TW220028B/zh active
- 1993-08-16 ES ES93810577T patent/ES2092799T3/es not_active Expired - Lifetime
- 1993-08-16 EP EP93810577A patent/EP0585204B1/de not_active Expired - Lifetime
- 1993-08-16 AT AT93810577T patent/ATE143565T1/de not_active IP Right Cessation
- 1993-08-16 DE DE59303954T patent/DE59303954D1/de not_active Expired - Fee Related
- 1993-08-19 US US08/109,282 patent/US5462599A/en not_active Expired - Fee Related
- 1993-08-20 KR KR1019930016193A patent/KR100275232B1/ko not_active IP Right Cessation
- 1993-08-24 JP JP23095993A patent/JP3203455B2/ja not_active Expired - Fee Related
-
1998
- 1998-05-19 HK HK98104343A patent/HK1005204A1/xx not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399144B (zh) * | 2007-05-29 | 2013-06-11 | Samsung Electronics Co Ltd | 用以發亮之發光二極體模組 |
CN113636270A (zh) * | 2021-08-04 | 2021-11-12 | 深圳市宏讯实业有限公司 | 一种氛围连续加工设备 |
Also Published As
Publication number | Publication date |
---|---|
KR940005197A (ko) | 1994-03-16 |
EP0585204B1 (de) | 1996-09-25 |
HK1005204A1 (en) | 1998-12-24 |
DE59303954D1 (de) | 1996-10-31 |
EP0585204A1 (de) | 1994-03-02 |
ES2092799T3 (es) | 1996-12-01 |
ATE143565T1 (de) | 1996-10-15 |
US5462599A (en) | 1995-10-31 |
JP3203455B2 (ja) | 2001-08-27 |
JPH06182284A (ja) | 1994-07-05 |
KR100275232B1 (ko) | 2001-01-15 |
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