TW218394B - - Google Patents

Info

Publication number
TW218394B
TW218394B TW080107576A TW80107576A TW218394B TW 218394 B TW218394 B TW 218394B TW 080107576 A TW080107576 A TW 080107576A TW 80107576 A TW80107576 A TW 80107576A TW 218394 B TW218394 B TW 218394B
Authority
TW
Taiwan
Application number
TW080107576A
Other languages
Chinese (zh)
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Application granted granted Critical
Publication of TW218394B publication Critical patent/TW218394B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Non-Insulated Conductors (AREA)
TW080107576A 1990-10-05 1991-09-25 TW218394B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2268147A JPH07123179B2 (ja) 1990-10-05 1990-10-05 異方導電接着剤による回路基板の接続構造

Publications (1)

Publication Number Publication Date
TW218394B true TW218394B (enExample) 1994-01-01

Family

ID=17454550

Family Applications (1)

Application Number Title Priority Date Filing Date
TW080107576A TW218394B (enExample) 1990-10-05 1991-09-25

Country Status (5)

Country Link
US (1) US5183969A (enExample)
JP (1) JPH07123179B2 (enExample)
DE (1) DE4132726A1 (enExample)
GB (1) GB2248450B (enExample)
TW (1) TW218394B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103666359A (zh) * 2012-08-29 2014-03-26 仁宝电脑工业股份有限公司 黏着材料及具有热阻隔能力基板结构制作方法

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3051569B2 (ja) * 1992-05-29 2000-06-12 新光電気工業株式会社 多層リードフレーム
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
DE4316607A1 (de) * 1993-05-18 1994-11-24 Wilhelm Endlich Metallisierte Kunststoff-Faserabschnitte als Füllstoff in Kleb-, Dicht-, Beschichtungs- und Schmierstoffen
DE4327560A1 (de) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung
DE4335524A1 (de) * 1993-10-19 1995-04-20 Blaupunkt Werke Gmbh Anordnung zur Befestigung einer flexiblen Folie an einer Leiterplatte
US5734201A (en) * 1993-11-09 1998-03-31 Motorola, Inc. Low profile semiconductor device with like-sized chip and mounting substrate
US5637176A (en) * 1994-06-16 1997-06-10 Fry's Metals, Inc. Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials
US5531942A (en) * 1994-06-16 1996-07-02 Fry's Metals, Inc. Method of making electroconductive adhesive particles for Z-axis application
JPH08102218A (ja) * 1994-09-30 1996-04-16 Nec Corp 異方性導電フィルム
EP0715489A3 (en) * 1994-11-30 1997-02-19 Ncr Int Inc Assembly of printed circuit boards
US5767623A (en) * 1995-09-11 1998-06-16 Planar Systems, Inc. Interconnection between an active matrix electroluminescent display and an electrical cable
US5712469A (en) * 1995-10-06 1998-01-27 Ford Global Technologies, Inc. Method of curing inaccessible thermoset adhesive joints using radio frequency dielectric heating
JPH10261849A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd フレキシブルプリント基板および接続プリント基板構造
EP1890324A3 (en) 1997-03-31 2008-06-11 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7604868B2 (en) * 1997-03-31 2009-10-20 Hitachi Chemical Company, Ltd. Electronic circuit including circuit-connecting material
WO1998044593A1 (de) * 1997-04-02 1998-10-08 Siemens Aktiengesellschaft Elektrische verbindung eines schaltungsträgers mit einem leiterbahnträger
JP3678547B2 (ja) * 1997-07-24 2005-08-03 ソニーケミカル株式会社 多層異方導電性接着剤およびその製造方法
DE19751953A1 (de) 1997-11-24 1999-05-27 Henkel Kgaa Funktionelle Farbstoffe als Indikator in aerob härtenden Zusammensetzungen
US6300566B1 (en) 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
US6226862B1 (en) 1998-04-30 2001-05-08 Sheldahl, Inc. Method for manufacturing printed circuit board assembly
KR100572216B1 (ko) * 1998-12-31 2006-09-13 삼성전자주식회사 이방성도전필름
DE60031436T2 (de) 1999-08-25 2007-08-30 Hitachi Chemical Co., Ltd. Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur
US6866741B2 (en) * 2001-01-08 2005-03-15 Fujitsu Limited Method for joining large substrates
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
DE10238884A1 (de) * 2002-08-24 2004-03-04 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
US20040112528A1 (en) * 2002-12-17 2004-06-17 Xerox Corporation Bonding flexible film circuit and electronic circuit board
WO2004093508A1 (ja) * 2003-04-18 2004-10-28 Ibiden Co., Ltd. フレックスリジッド配線板
US20050126706A1 (en) * 2003-12-10 2005-06-16 Bunch Richard D. Non-corrosive low temperature liquid resist adhesive
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP4630719B2 (ja) * 2005-04-14 2011-02-09 キヤノン株式会社 インクジェット記録ヘッド
JP4650456B2 (ja) * 2006-08-25 2011-03-16 日立化成工業株式会社 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
JP2008108890A (ja) * 2006-10-25 2008-05-08 Three M Innovative Properties Co 回路基板の接続方法及び接続構造体
JP5003113B2 (ja) * 2006-11-16 2012-08-15 三菱電機株式会社 フレキシブル配線基板の接続構造
TWI342063B (en) * 2007-06-08 2011-05-11 Ind Tech Res Inst A bonding structure of flexible films and bonding method therefor
JP4463297B2 (ja) 2007-08-07 2010-05-19 三洋電機株式会社 太陽電池モジュール
JP5029372B2 (ja) * 2007-09-14 2012-09-19 日立化成工業株式会社 異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法
JP2010129960A (ja) 2008-12-01 2010-06-10 Sony Chemical & Information Device Corp 接続フィルム、並びに、接合体及びその製造方法
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
JP6279828B2 (ja) * 2012-07-09 2018-02-14 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
GB2504957A (en) 2012-08-14 2014-02-19 Henkel Ag & Co Kgaa Curable compositions comprising composite particles
KR20140085023A (ko) * 2012-12-27 2014-07-07 삼성전기주식회사 인쇄 회로 기판 및 그 제조 방법
JP6508677B2 (ja) * 2015-03-20 2019-05-08 デクセリアルズ株式会社 異方性導電接続方法及び異方性導電接続構造体
CN113840474A (zh) * 2021-09-27 2021-12-24 信利半导体有限公司 一种fpc与tft的绑定方法及显示模组
CN114206020B (zh) * 2021-12-10 2024-03-22 苏州华星光电技术有限公司 一种邦定装置以及邦定方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3677974A (en) * 1970-09-18 1972-07-18 Us Army Multi-purpose conductive adhesive
GB1519766A (en) * 1974-09-06 1978-08-02 Raychem Sa Nv Heat recoverable connector
JPS51114439A (en) * 1975-04-02 1976-10-08 Seiko Epson Corp An adhesive having anisotropic electroconductivity
JPS596006B2 (ja) * 1975-11-13 1984-02-08 セイコーエプソン株式会社 ドウデンイホウセイノセツチヤクホウシキ
US4210704A (en) * 1978-08-04 1980-07-01 Bell Telephone Laboratories, Incorporated Electrical devices employing a conductive epoxy resin formulation as a bonding medium
CA1141528A (en) * 1978-08-04 1983-02-22 Western Electric Company, Incorporated Conductive adhesive system including a conductivity enhancer
US4564563A (en) * 1983-09-30 1986-01-14 Electro Materials Corp. Of America Solderable conductor
GB8403823D0 (en) * 1984-02-14 1984-03-21 Raychem Ltd Adhesive composition
US4654965A (en) * 1984-07-16 1987-04-07 Ricoh Company, Ltd. Method of manufacturing liquid crystal display unit
US4595606A (en) * 1984-07-18 1986-06-17 Rohm And Haas Company Solderable conductive compositions having high adhesive strength
US4595604A (en) * 1984-07-18 1986-06-17 Rohm And Haas Company Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates
JPH0623349B2 (ja) * 1986-01-30 1994-03-30 富士高分子工業株式会社 異方導電性接着剤
US4780371A (en) * 1986-02-24 1988-10-25 International Business Machines Corporation Electrically conductive composition and use thereof
JPS6389584A (ja) * 1986-10-02 1988-04-20 Shin Etsu Polymer Co Ltd 異方導電性接着膜
JPS6386783A (ja) * 1987-07-10 1988-04-18 Shin Etsu Polymer Co Ltd 異方導電熱接着性フィルム
JPS6436978A (en) * 1987-07-31 1989-02-07 Mazda Motor Fuel injector for engine
JP2610900B2 (ja) * 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
GB8811669D0 (en) * 1988-05-17 1988-06-22 Alcan Int Ltd Colour-changeable adhesive
JPH0613688B2 (ja) * 1988-05-18 1994-02-23 アスモ株式会社 バランス修正用接着材
JPH0236289A (ja) * 1988-07-27 1990-02-06 Hitachi Chem Co Ltd 一液型接着剤
JPH0231175U (enExample) * 1988-08-19 1990-02-27
JPH0291360U (enExample) * 1988-12-29 1990-07-19
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JPH0738502B2 (ja) * 1989-10-17 1995-04-26 シャープ株式会社 回路基板の接続方法
GB2239244B (en) * 1989-11-14 1994-06-01 David Durand Moisture resistant electrically conductive cements and methods for making and using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103666359A (zh) * 2012-08-29 2014-03-26 仁宝电脑工业股份有限公司 黏着材料及具有热阻隔能力基板结构制作方法

Also Published As

Publication number Publication date
JPH04145180A (ja) 1992-05-19
GB9120743D0 (en) 1991-11-13
DE4132726A1 (de) 1992-04-09
JPH07123179B2 (ja) 1995-12-25
US5183969A (en) 1993-02-02
GB2248450A (en) 1992-04-08
GB2248450B (en) 1994-03-09

Similar Documents

Publication Publication Date Title
DE4191952T1 (enExample)
EP0440166A3 (enExample)
DE4193093T (enExample)
DE4191754T (enExample)
CH679357GA3 (enExample)
DE4191140T (enExample)
DE4190940T (enExample)
DE4191062T (enExample)
DE4192711T1 (enExample)
DE4192244T (enExample)
DE4191618T (enExample)
DE4192436T (enExample)
DE4191921T (enExample)
DE4191962T1 (enExample)
DE4192257T (enExample)
DE4191484T (enExample)
DK0441644T3 (enExample)
DE4190942T1 (enExample)
DE4191260T (enExample)
DE4092446T (enExample)
DE4191827T (enExample)
ECSM90492U (enExample)
ECSM90507U (enExample)
ECSM90502U (enExample)
ECSM90455U (enExample)