TW202547954A - 黏著帶 - Google Patents

黏著帶

Info

Publication number
TW202547954A
TW202547954A TW114107433A TW114107433A TW202547954A TW 202547954 A TW202547954 A TW 202547954A TW 114107433 A TW114107433 A TW 114107433A TW 114107433 A TW114107433 A TW 114107433A TW 202547954 A TW202547954 A TW 202547954A
Authority
TW
Taiwan
Prior art keywords
resin
adhesive tape
substrate
adhesive layer
mass
Prior art date
Application number
TW114107433A
Other languages
English (en)
Chinese (zh)
Inventor
山下功一郎
池永雅範
Original Assignee
日商住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202547954A publication Critical patent/TW202547954A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW114107433A 2024-03-01 2025-02-27 黏著帶 TW202547954A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024031471 2024-03-01
JP2024-031471 2024-03-01

Publications (1)

Publication Number Publication Date
TW202547954A true TW202547954A (zh) 2025-12-16

Family

ID=96920905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114107433A TW202547954A (zh) 2024-03-01 2025-02-27 黏著帶

Country Status (3)

Country Link
JP (1) JPWO2025183021A1 (https=)
TW (1) TW202547954A (https=)
WO (1) WO2025183021A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5528861B2 (ja) * 2009-04-15 2014-06-25 株式会社イーテック 紫外線硬化型粘着剤組成物
JP6210827B2 (ja) * 2013-10-04 2017-10-11 リンテック株式会社 半導体加工用シート
EP3546540A4 (en) * 2016-11-25 2020-10-14 Mitsui Chemicals Tohcello, Inc. ADHESIVE LAMINATE FILM AND ELECTRONIC DEVICE PRODUCTION PROCESS
JP7025138B2 (ja) * 2017-06-15 2022-02-24 三井化学東セロ株式会社 粘着性積層フィルムおよび電子装置の製造方法
KR102757722B1 (ko) * 2020-05-22 2025-01-21 미쓰이 가가쿠 토세로 가부시키가이샤 점착성 적층 필름 및 전자 장치의 제조 방법
KR20230155529A (ko) * 2021-04-20 2023-11-10 미쓰이 가가쿠 토세로 가부시키가이샤 점착성 수지 필름 및 전자 장치의 제조 방법
TW202330849A (zh) * 2021-10-21 2023-08-01 日商積水化學工業股份有限公司 黏著帶

Also Published As

Publication number Publication date
WO2025183021A1 (ja) 2025-09-04
JPWO2025183021A1 (https=) 2025-09-04

Similar Documents

Publication Publication Date Title
TWI595067B (zh) Surface protection sheet
KR102725960B1 (ko) 반도체 장치의 제조 방법
TWI637439B (zh) Protective film forming film
JP7381448B2 (ja) 粘着テープおよび半導体装置の製造方法
CN104272437B (zh) 半导体加工用粘合胶带
KR20220025261A (ko) 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법
TWI740500B (zh) 膜狀接著劑複合片及半導體裝置的製造方法
KR102687395B1 (ko) 점착 테이프 및 반도체 장치의 제조 방법
TWI566282B (zh) Cut the adhesive sheet
TW201806041A (zh) 黏晶膜、切晶黏晶膜及半導體裝置之製造方法
TW201819569A (zh) 半導體加工用黏著片
TWI814968B (zh) 暫時固定用樹脂組成物、暫時固定用樹脂膜及暫時固定用片、以及半導體裝置的製造方法
TW201204799A (en) Adhesive film used for die-cutting, and production method for cut sheets
CN110785469B (zh) 切割管芯接合膜
TW202302794A (zh) 半導體加工用保護片材及半導體裝置的製造方法
TW202547954A (zh) 黏著帶
TWI895481B (zh) 工件加工用片
TWI921320B (zh) 黏著帶
TWI912537B (zh) 保護膜形成膜、保護膜形成用複合片、具保護膜之工件的製造方法、以及具保護膜之工件加工物的製造方法
TWI915493B (zh) 支撐片、樹脂膜形成用複合片、套件、以及具樹脂膜之晶片的製造方法
TWI917543B (zh) 保護膜形成膜、保護膜形成用複合片、具保護膜之工件加工物的製造方法、以及具保護膜之工件的製造方法
TWI907625B (zh) 工件加工用片
TW202303742A (zh) 半導體加工用保護片及半導體裝置的製造方法
JP2025133341A (ja) 粘着テープ
TW202302792A (zh) 半導體加工用保護片及半導體裝置的製造方法