Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J133/04—Homopolymers or copolymers of esters
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J7/38—Pressure-sensitive adhesives [PSA]

Definitions

• the present invention relates to an adhesive tape used to temporarily fix substrates.
• adhesive tape (dicing tape) is used to temporarily fix semiconductor substrates.
• Patent Document 1 discloses a semiconductor processing sheet (adhesive tape) that includes a substrate and an adhesive layer laminated on the substrate. This semiconductor processing sheet is used so that the adhesive layer adheres closely to the TSV wafer or TSV chip. This allows the TSV wafer, etc. to be temporarily fixed.
• a semiconductor processing sheet adheres closely to the TSV wafer or TSV chip. This allows the TSV wafer, etc. to be temporarily fixed.
• This adhesive layer is composed of an adhesive formed from an adhesive composition containing a (meth)acrylic acid ester copolymer (A) with energy ray-curable groups introduced into the side chains.
• This (meth)acrylic acid ester copolymer (A) is obtained by reacting an acrylic copolymer (AP) obtained by copolymerizing methyl (meth)acrylate (A1) and a functional group-containing monomer (A2) having a reactive functional group with a curable group-containing compound (A3) having a substituent reactive with the functional group of the functional group-containing monomer (A2) and an energy ray-curable carbon-carbon double bond.
• Patent Document 1 also discloses that parameters P1 and P2 related to component AP each satisfy specific conditions.
• Parameter P1 is the mass ratio of the structure derived from component A1 in component AP, and when this parameter satisfies specific conditions, an adhesive layer that is resistant to polar solvents is obtained.
• Parameter P2 is the product of the mass ratio of the structure derived from component A1 in component AP and the gel fraction of the adhesive, and when this parameter satisfies specific conditions, an adhesive layer that has the ability to embed minute protrusions is obtained.
• the semiconductor processing sheet described in Patent Document 1 has the following problems.
• the outer periphery of the adhesive layer of a semiconductor processing sheet is fixed with a ring frame, and then the backside of a semiconductor substrate, such as a TSV wafer, is attached to the adhesive layer.
• the front side of the semiconductor substrate may be covered with protective tape.
• the protective tape is peeled off before proceeding to the next process.
• the adhesive from the protective tape remains on the surface of the semiconductor substrate, the semiconductor substrate is cleaned with a cleaning solution. This cleaning solution not only removes the remaining adhesive from the protective tape, but also acts on the semiconductor processing sheet attached to the backside of the semiconductor substrate.
• the object of the present invention is to provide an adhesive tape that has good resistance to cleaning solutions and that maintains good releasability when irradiated with energy rays even after contact with the cleaning solution.
• An adhesive tape used to temporarily fix a substrate comprising a base material and an adhesive layer laminated on one surface of the base material,
• the adhesive layer is a double bond-introduced acrylic resin having an unsaturated double bond in a side chain; a curable resin that is cured by irradiation with energy rays;
• the curable resin has a polymerizable carbon-carbon double bond that can be three-dimensionally crosslinked by irradiation with energy rays,
• curable resin contains at least one of an ester of (meth)acrylic acid and a polyhydric alcohol, a urethane acrylate, and an epoxy acrylate.
• the present invention provides an adhesive tape that has good resistance to cleaning solutions and maintains good releasability after energy beam irradiation.
• FIG. 1 is a vertical cross-sectional view showing an example of a semiconductor device manufactured using an adhesive tape according to an embodiment.
• FIG. 2 is a vertical cross-sectional view illustrating a method for manufacturing a semiconductor device using the adhesive tape according to the embodiment.
• FIG. 3 is a vertical cross-sectional view illustrating a method for manufacturing a semiconductor device using the adhesive tape according to the embodiment.
• FIG. 4 is a vertical cross-sectional view showing the pressure-sensitive adhesive tape according to the embodiment.
• Figure 1 is a vertical cross-sectional view showing an example of a semiconductor device manufactured using an adhesive tape according to an embodiment.
• the upper side in Figure 1 will be referred to as “top” and the lower side will be referred to as "bottom.”
• the dimensional ratios in the left-right direction and thickness direction may differ from the actual ratios.
• the semiconductor device 10 shown in FIG. 1 includes a semiconductor chip 20 (semiconductor element), an interposer 30 (substrate) that supports the semiconductor chip 20, a plurality of conductive bumps 70 (terminals), and a molded portion 17 (sealing portion) that seals the semiconductor chip 20.
• the interposer 30 is an insulating substrate made of various resin materials, such as polyimide, epoxy resin, cyanate resin, and bismaleimide triazine resin (BT resin).
• the planar shape of the interposer 30 can be, for example, a quadrilateral such as a square or rectangle.
• Terminals 41 made of a conductive metal material such as copper are provided in a predetermined shape on the top surface of the interposer 30.
• interposer 30 multiple vias (through holes) and through-wiring (not shown) are formed in the interposer 30, penetrating it in the thickness direction.
• Each bump 70 protrudes from the underside of the interposer 30.
• Each bump 70 is electrically connected to a terminal 41 via a through-wiring.
• Such bumps 70 are primarily made of a brazing material such as solder, silver solder, copper solder, or phosphorus copper solder.
• Terminals 41 provided on the interposer 30 are electrically connected to terminals 21 of the semiconductor chip 20 via connection parts 81.
• the gap between the semiconductor chip 20 and the interposer 30 is filled with an underfill material.
• the hardened underfill material forms a sealing layer 80.
• This sealing layer 80 improves the bonding strength between the semiconductor chip 20 and the interposer 30 and prevents the intrusion of foreign matter, moisture, etc. into the gap.
• a molded portion 17 is provided on the upper side of the interposer 30 to cover the semiconductor chip 20 and interposer 30.
• the molded portion 17 is made of a hardened semiconductor sealing material (sealant). By providing the molded portion 17, the semiconductor chip 20 is sealed, preventing the intrusion of foreign matter, moisture, etc. into the semiconductor chip 20.
• the semiconductor chip 20 (semiconductor element) has a semiconductor chip body 23 (semiconductor element body) and terminals 21 provided on the underside of the semiconductor chip body 23.
• a circuit (not shown) is formed on the upper surface of the semiconductor chip body 23. Examples of materials that can be used to form the semiconductor chip body 23 include semiconductor materials such as Si, SiC, GaN, and Ga2O3 .
• FIGS. 2 and 3 are vertical cross-sectional views illustrating a method for manufacturing a semiconductor device 10 using the adhesive tape 100 according to the embodiment.
• the upper side of each figure will be referred to as “top” and the lower side will be referred to as “bottom.”
• FIG. 1A First, prepare a semiconductor substrate 7 (semiconductor wafer) with protective tape 500 attached, as shown in Figure 2(a).
• Protective tape 500 is attached to the surface 71 of the semiconductor substrate 7, and protects the circuit formation area (not shown) included on the surface 71 from each of the processes described below.
• the circuit formation area (not shown) includes multiple individual circuits, and will be divided into multiple areas in the processes described below.
• the upper surface of the protective tape 500 is fixed to the chuck table 600 of a back grinding device (back grinder). Then, the back surface 72 of the semiconductor substrate 7 shown in FIG. 2(b) is ground (back-grinded). This allows the semiconductor substrate 7 to be thinned.
• the thickness of the semiconductor substrate 7 after back-grinding is not particularly limited, but is, for example, approximately 40 to 600 ⁇ m.
• the adhesive tape 100 shown in FIG. 2(c) has a substrate 4 and an adhesive layer 2 laminated on the substrate 4.
• the outer periphery 121 of the adhesive layer 2 of the adhesive tape 100 is fixed with a wafer ring 9.
• the back surface 72 of the semiconductor substrate 7 semiconductor wafer is attached to the center portion 122 of the adhesive layer 2.
• the protective tape 500 is peeled off. By peeling off the protective tape 500, the surface 71 of the semiconductor substrate 7 is exposed, as shown in FIG. 2(d).
• the surface 71 of the semiconductor substrate 7 is cleaned with cleaning solution CS (surface cleaning process).
• the cleaning solution CS supplied to the surface 71 acts on the adhesive remaining on the surface 71, removing it and cleaning it.
• the cleaning solution CS also acts on the adhesive tape 100.
• the adhesive layer 2 may be deformed, such as swollen. If this occurs, after the semiconductor substrate 7 is singulated in the process described below, the adhesive tape 100 is irradiated with energy rays such as ultraviolet light to peel off (pick up) the singulated semiconductor chips 20.
• energy rays such as ultraviolet light to peel off (pick up) the singulated semiconductor chips 20.
• there is a risk that the adhesive strength of the adhesive layer 2 will not be sufficiently reduced even when irradiated with energy rays, and there is also a risk that the adhesive will adhere to the semiconductor chips 20.
• the adhesive tape 100 (the adhesive tape according to the embodiment) is required to have good resistance to the cleaning solution CS.
• Cleaning solution CS may be, for example, a hydrocarbon solvent, a ketone solvent, an ester solvent, an alcohol solvent, an amide solvent, or an ether solvent, and may be used alone or in combination with two or more of these. Examples include N-methyl-2-pyrrolidone, N,N-dimethylacetamide, dimethyl sulfoxide (DMSO), N,N-dimethylformamide, hexamethylphosphoric triamide, and 1,3-dimethyl-2-imidazolidinone.
• the cleaning solution CS may be rinsed away with a rinse solution.
• a solvent with a lower boiling point than the cleaning solution CS is preferably used as the rinse solution, such as alcohols such as methanol, ethanol, and propanol, or ketones such as acetone, diethyl ketone, and methyl ethyl ketone.
• the semiconductor substrate 7 is cut into individual pieces (dicing process).
• multiple semiconductor chips 20 are obtained on the adhesive tape 100, as shown in FIG. 3(b).
• the adhesive tape 100 has a strong adhesive force that holds the semiconductor substrate 7 in place and prevents the semiconductor substrate 7 from shaking, thereby preventing cracks, chips, etc. from occurring in the semiconductor substrate 7.
• the cut marks made by the dicing saw reach the base material 4, as shown in FIG. 3(b). This ensures that the semiconductor substrate 7 can be individually separated.
• water may be supplied to the semiconductor substrate 7 while cutting. This helps prevent the scattering of dust and overheating of the semiconductor substrate 7 that occurs when cutting the semiconductor substrate 7.
• energy rays E such as ultraviolet rays
• the adhesive strength of the adhesive layer 2 of the adhesive tape 100 irradiated with energy rays E is reduced. This allows the semiconductor chip 20 to be easily picked up in the pick-up process described below.
• the adhesive tape 100 with the semiconductor substrate 7 attached is placed on the expanding table 300.
• the expanding table 300 has an expanding stage 310 corresponding to the center of the semiconductor substrate 7 and a holding base 320 corresponding to the outer periphery of the semiconductor substrate 7.
• the expanding stage 310 is pushed upward against the holding base 320 of the expanding table 300. This causes the adhesive tape 100 to be stretched radially, forming gaps between the semiconductor chips 20 obtained by singulation (expanding process).
• the adhesive tape 100 with the expanded semiconductor substrate 7 attached is placed on the pickup table 400. Then, as shown in FIG. 3(e), the semiconductor chip 20 is picked up using a suction tool (not shown) such as a vacuum collet or air tweezers. During the pickup process, the semiconductor chip 20 may also be pushed up from below using a needle (not shown).
• a suction tool such as a vacuum collet or air tweezers.
• the semiconductor chip 20 may also be pushed up from below using a needle (not shown).
• individual semiconductor chips 20 are obtained.
• the individual semiconductor chips 20 are placed on, for example, the interposer 30 shown in FIG. 1.
• a sealing layer 80 and a molded portion 17 are provided. This results in the semiconductor device 10 shown in FIG. 1.
• Adhesive Tape Fig. 4 is a vertical cross-sectional view showing an adhesive tape 100 according to an embodiment.
• the upper side in Fig. 4 will be referred to as “top” and the lower side will be referred to as “bottom”.
• the adhesive tape 100 is an adhesive tape used to temporarily fix a semiconductor substrate 7, and as shown in FIG. 4, comprises a substrate 4 and an adhesive layer 2.
• the adhesive layer 2 is laminated on the upper surface (one surface) of the substrate 4.
• the adhesive layer 2 contains a double bond-introduced acrylic resin (A) and a curable resin (B).
• the double bond-introduced acrylic resin (A) is an acrylic resin having an unsaturated double bond in its side chain. Both the double bond-introduced acrylic resin (A) and the curable resin (B) provide adhesiveness. They are cured by irradiation with energy rays.
• the blending ratio of the curable resin (B) is more than 0 parts by mass and not more than 180 parts by mass per 100 parts by mass of the double bond-introduced acrylic resin (A).
• the double-bond-introduced acrylic resin (A) in the peripheral portion of the semiconductor substrate 7 swells, and the low-molecular-weight curable resin (B) dissolves into the cleaning solution CS, the double-bond-introduced acrylic resin (A) itself can be cured with energy rays, so the releasability is not lost (this can trigger peeling). Furthermore, since the curable resin (B) does not dissolve from the adhesive layer 2 in contact with the semiconductor substrate 7, the releasability is improved by the curable resin (B).
• the curable resin (B) maintains high adhesive strength before the energy ray irradiation process, ensuring reliable fixation of the semiconductor substrate 7. Even after the energy ray irradiation process, low adhesive strength is obtained without losing releasability. This reduces the occurrence of defects during the dicing and pick-up processes.
• Each part of the adhesive tape 100 will be described in detail below.
• Substrate examples of materials that can be used for the substrate 4 include resin materials.
• resin materials that can be used for the substrate 4 include thermoplastic resins such as olefin resins, polyester resins (ester polymers) such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, and polybutylene naphthalate, polyvinyl chloride resins, polyurethanes, polyimides, polyamides, polyether ketones such as polyether ether ketone, polyethersulfones, polystyrenes, fluororesins, silicone resins, cellulose resins, styrene-based thermoplastic elastomers (styrene-based polymers), acrylic resins, polyester-based thermoplastic elastomers, polyvinyl isoprene, and polycarbonates (carbonate-based polymers), as well as mixtures containing these thermoplastic resins.
• thermoplastic resins such as olefin resins, polyester
• These resin materials are capable of transmitting energy rays such as visible light, near-infrared rays, ultraviolet rays, X-rays, and electron beams, so that in the energy ray irradiation process described above, the irradiated energy rays penetrate the substrate 4 and are irradiated onto the adhesive layer 2. This makes it possible to more reliably reduce the adhesive strength of the adhesive layer 2.
• the substrate 4 may contain softeners such as mineral oil, fillers such as calcium carbonate, silica, talc, mica, and clay, antioxidants, light stabilizers, lubricants, dispersants, neutralizers, colorants, etc.
• softeners such as mineral oil, fillers such as calcium carbonate, silica, talc, mica, and clay, antioxidants, light stabilizers, lubricants, dispersants, neutralizers, colorants, etc.
• the resin material content in the substrate 4 is preferably 50% by mass or more, and more preferably 80% by mass or more. This ensures good flexibility of the substrate 4 and good adhesion of the substrate 4 to the adhesive layer 2.
• the thickness of the substrate 4 is not particularly limited, but is preferably between 30 ⁇ m and 200 ⁇ m, and more preferably between 40 ⁇ m and 150 ⁇ m. By keeping the thickness of the substrate 4 within this range, the mechanical properties of the substrate 4 are optimized, allowing the substrate 4 to more reliably perform its functions. This makes it possible to prevent breakage of the substrate 4 during dicing, expanding, pick-up, and other processes.
• the surface roughness Ra of the substrate 4 is preferably, for example, 0.2 ⁇ m or more and 2.0 ⁇ m or less, and more preferably 0.5 ⁇ m or more and 1.5 ⁇ m or less. When the surface roughness Ra of the substrate 4 is within this range, the adhesion between the substrate 4 and the adhesive layer 2 is improved. This makes it possible to prevent peeling between the substrate 4 and the adhesive layer 2 during the pick-up process.
• the adhesive layer 2 has enough adhesiveness to support the semiconductor substrate 7 during the dicing process and to allow the semiconductor chip 20 to be picked up properly during the pick-up process.
• the adhesive layer 2 contains a double bond-introduced acrylic resin (A) as a base resin that hardens when irradiated with energy rays, and a curable resin (B).
• A double bond-introduced acrylic resin
• B curable resin
• Double bond-introduced acrylic resin (A) The double bond-introduced acrylic resin (A) is an adhesive and imparts adhesiveness to the semiconductor substrate 7 to the adhesive layer 2.
• the double bond-introduced acrylic resin (A) is an acrylic resin having an unsaturated double bond in its side chain.
• the unsaturated double bond is not particularly limited as long as it is an unsaturated double bond, but is preferably a polymerizable carbon-carbon double bond (ethylenically unsaturated double bond) that can be three-dimensionally crosslinked by irradiation with energy rays.
• a group containing such a polymerizable carbon-carbon double bond in its side chain three-dimensional crosslinking can be more reliably formed within the polymer main chain of the double bond-introduced acrylic resin (A) or between polymer main chains.
• groups containing a polymerizable carbon-carbon double bond include (meth)acryloyl groups, (meth)acryloyloxy groups, (meth)acryloylamino groups, allyl groups, 1-propenyl groups, and vinyl groups.
• acrylic resin refers to a polymer (homopolymer or copolymer) containing (meth)acrylic acid ester as a monomer component.
• (meth)acrylic acid includes both acrylic acid and methacrylic acid. Therefore, for example, (meth)acrylic acid ester includes both acrylic acid ester and methacrylic acid ester.
• the double bond-introduced acrylic resin (A) is a polymer containing a structure derived from a (meth)acrylic acid ester as the main structural unit, and is an acrylic resin having a polymer main chain and a side chain bonded to the polymer main chain and containing an unsaturated double bond.
• the double bond-introduced acrylic resin (A) is synthesized, for example, by a method including the steps of copolymerizing one or more (meth)acrylic acid esters (A1-1) with one or more polymerizable compounds (A1-2) having a reactive functional group in the side chain to obtain an acrylic resin having a reactive functional group, and reacting one or more compounds (A1-3) having a functional group reactive with the reactive functional group and an unsaturated double bond with the aforementioned acrylic resin.
• double bond-introduced acrylic resin (A) Since such double bond-introduced acrylic resin (A) has unsaturated double bonds in its side chains, it forms three-dimensional crosslinks within and between polymer main chains. Therefore, even when double bond-introduced acrylic resin (A) is used alone, it hardens when irradiated with energy rays. This gives the adhesive layer 2 good resistance to cleaning solution CS. Furthermore, the adhesive layer 2 containing double bond-introduced acrylic resin (A) and curable resin (B) can maintain good releasability through energy ray irradiation even after contact with cleaning solution.
• Examples of (meth)acrylic acid esters (a1) include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, and decyl (meth)acrylate.
• (meth)acrylic acid alkyl esters such as isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, and octadecyl (meth)acrylate; (meth)acrylic acid cycloalkyl esters such as cyclohexyl (meth)acrylate; and (meth)acrylic acid aryl esters such as phenyl (meth)acrylate. These may be used alone or in combination of two or more.
• (meth)acrylic acid alkyl esters such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and octyl (meth)acrylate are preferably used as the (meth)acrylic acid ester (a1).
• (Meth)acrylic acid alkyl esters have excellent heat resistance and are relatively easy and inexpensive to obtain.
• the proportion of the (meth)acrylic acid ester (A1-1) in the double bond-introduced acrylic resin (A) is preferably 50% by mass or more and 99% by mass or less, and more preferably 70% by mass or more and 95% by mass or less, based on the total mass of the monomer components constituting the double bond-introduced acrylic resin (A).
• the polymerizable compound (A1-2) is a polymerizable compound having a reactive functional group.
• reactive functional groups include a carboxy group, a hydroxyl group, an amino group, a mercapto group, a cyclic acid anhydride group, and an epoxy group.
• the reactive functional group is a carboxy group, a hydroxyl group, an amino group, a mercapto group, or a cyclic acid anhydride group
• the compound (A1-2) has good reactivity with, for example, a compound (A1-3) having an epoxy group or an isocyanate group as a functional group.
• the compound (A1-3) has good reactivity with, for example, a compound (A1-3) having a carboxy group, a hydroxyl group, an amino group, a mercapto group, or a functional group.
• Examples of the polymerizable compound (A1-2) having an epoxy group as a reactive functional group include glycidyl (meth)acrylate and 3,4-epoxycyclohexyl (meth)acrylate.
• polymerizable compounds (A1-2) having a hydroxyl group as a reactive functional group examples include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and glycerin mono(meth)acrylate.
• Examples of the polymerizable compound (A1-2) having a carboxyl group as a reactive functional group include (meth)acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid.
• the acrylic resin may contain other polymerizable compounds as monomer units.
• examples of other polymerizable compounds include aromatic vinyl compounds such as styrene and vinyltoluene.
• Compound (A1-3) is a compound having a functional group that reacts with the reactive functional group of polymerizable compound (A1-2) and an unsaturated double bond.
• Examples of the compound (A1-3) having a carboxyl group include (meth)acrylic acid, a dimer of (meth)acrylic acid, caprolactone-modified (meth)acrylic acid, a compound obtained by the ring-opening reaction of a (meth)acrylate having a hydroxyl group with a carboxylic acid anhydride, and ⁇ -acryloyloxyethyl hydrogen succinate.
• Examples of compounds (A1-3) having an isocyanate group include methacryloyloxyethyl isocyanate.
• Examples of the compound (A1-3) having an epoxy group include glycidyl (meth)acrylate and allyl glycidyl ether.
• the double bond-introduced acrylic resin (A) can be produced by polymerizing a single monomer component or a mixture of two or more monomer components. Furthermore, the polymerization of these monomer components can be carried out using polymerization methods such as solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization.
• the double bond-introduced acrylic resin (A) have a low content of low-molecular-weight substances.
• the weight-average molecular weight of the double bond-introduced acrylic resin (A) is preferably 300,000 to 2,000,000, more preferably 400,000 to 1,800,000, and even more preferably 500,000 to 1,500,000. Note that if the weight-average molecular weight of the double bond-introduced acrylic resin (A) is below the lower limit, depending on the type of monomer component, the contamination prevention properties for the semiconductor substrate 7 and the like may be reduced, resulting in the risk of adhesives and the like adhering to the semiconductor chip 20.
• the weight-average molecular weight of the double bond-introduced acrylic resin (A) is above the upper limit, the viscosity of the composition for forming the adhesive layer 2 may increase, which may increase the difficulty of manufacturing the adhesive tape 100.
• the weight-average molecular weight is calculated as a standard polystyrene equivalent by gel permeation chromatography (GPC).
• the glass transition temperature Tg of the double bond-introduced acrylic resin (A) is preferably -80°C or higher and -10°C or lower, more preferably -70°C or higher and -15°C or lower, and even more preferably -60°C or higher and -20°C or lower. This allows the adhesive strength of the adhesive layer 2 to be optimized. Note that if the glass transition temperature Tg is below the lower limit, the double bond-introduced acrylic resin (A) will not easily aggregate, which may result in the adhesive or the like adhering to the picked-up semiconductor chip 20. On the other hand, if the glass transition temperature Tg is above the upper limit, the adhesive strength of the adhesive layer 2 will be insufficient, which may result in defects during the dicing process.
• the glass transition temperature Tg is adjusted appropriately depending on the monomer components and molecular weight of the double bond-introduced acrylic resin (A).
• the glass transition temperature Tg is measured using a differential scanning calorimeter (DSC) at a heating rate of 0.1°C/min.
• the acid value of the double bond-introduced acrylic resin (A) is preferably greater than 0 mgKOH/g and less than 30 mgKOH/g, more preferably from 0.2 mgKOH/g to 25 mgKOH/g, and even more preferably from 0.5 mgKOH/g to 20 mgKOH/g.
• the acid value of the double bond-introduced acrylic resin (A) tends to reflect its storage stability and reactivity. Therefore, if the acid value is within the above range, the adhesive layer 2 can achieve both storage stability and curability. If the acid value is below the lower limit, the reactivity of the double bond-introduced acrylic resin (A) may decrease, potentially reducing the releasability of the adhesive layer 2 after energy beam irradiation. On the other hand, if the acid value exceeds the upper limit, the storage stability of the double bond-introduced acrylic resin (A) may decrease, potentially increasing the adhesive layer 2's susceptibility to denaturation, such as swelling, upon contact with cleaning fluids.
• the acid value of double bond-introduced acrylic resin (A) is the solid content acid value (the number of milligrams of potassium hydroxide required to neutralize the free fatty acids present in 1 g of the solid content of double bond-introduced acrylic resin (A)), and is measured in accordance with the method specified in JIS K 0070:1992.
• the hydroxyl value of the double bond-introduced acrylic resin (A) is preferably greater than 0 mgKOH/g and less than 50 mgKOH/g, more preferably from 3 mgKOH/g to 45 mgKOH/g, and even more preferably from 5 mgKOH/g to 40 mgKOH/g.
• the hydroxyl value of the double bond-introduced acrylic resin (A) tends to reflect adhesion and curability. Therefore, if the hydroxyl value is within the above range, an adhesive layer 2 is obtained that maintains adhesion and curability even after contact with a cleaning solution. Note that if the hydroxyl value is below the above lower limit, the peelability of the adhesive layer 2 may decrease after energy beam irradiation treatment. On the other hand, if the hydroxyl value is above the above upper limit, the adhesive strength of the adhesive layer 2 may be insufficient.
• the hydroxyl value of double bond-introduced acrylic resin (A) is the solid content hydroxyl value (the number of milligrams of potassium hydroxide required to neutralize the acetic acid bonded to the hydroxyl group when 1 g of the solid content of double bond-introduced acrylic resin (A) is acetylated), and is measured in accordance with the method specified in JIS K 0070:1992.
• the above acid value and hydroxyl value can be controlled by adjusting the amount of compound (A1-3) added when preparing the double bond-introduced acrylic resin (A).
• the unsaturated double bond equivalent weight of the double bond-introduced acrylic resin (A) is preferably 200 or more and 4000 or less, more preferably 250 or more and 3000 or less.
• the unsaturated double bond equivalent weight of the double bond-introduced acrylic resin (A) tends to reflect the adhesiveness, curability, and retention of the curable resin (B). Therefore, if the unsaturated double bond equivalent weight is within the above range, an adhesive layer 2 can be obtained that has excellent resistance to cleaning solutions and exhibits good adhesiveness and curability even after contact with cleaning solutions. Note that if the unsaturated double bond equivalent weight is below the above lower limit, the peelability of the adhesive layer 2 may decrease after energy beam irradiation treatment. On the other hand, if the unsaturated double bond equivalent weight exceeds the above upper limit, the adhesiveness of the adhesive layer 2 may be insufficient.
• the unsaturated double bond equivalent of double bond-introduced acrylic resin (A) is calculated by dividing the molecular weight by the number of unsaturated double bonds in the same molecule.
• the content of double bond-introduced acrylic resin (A) in the resin composition constituting adhesive layer 2 is preferably 30% by mass or more and 90% by mass or less, and more preferably 40% by mass or more and 80% by mass or less, of the total solid content of the resin composition.
• the curable resin (B) is a resin having a curing property that is cured by irradiation with energy rays.
• the curable resin (B) may be a resin having a polymerizable functional group that polymerizes by irradiation with energy rays, but is preferably a resin having a group containing a polymerizable carbon-carbon double bond that can be three-dimensionally crosslinked by irradiation with energy rays.
• groups containing a polymerizable carbon-carbon double bond include (meth)acryloyl groups, (meth)acryloyloxy groups, (meth)acryloylamino groups, allyl groups, 1-propenyl groups, and vinyl groups.
• the curable resin (B) examples include low-molecular-weight compounds having at least two groups in the molecule containing polymerizable carbon-carbon double bonds that can undergo three-dimensional crosslinking upon irradiation with energy rays.
• Specific examples of the compound include esters of (meth)acrylic acid and polyhydric alcohols such as trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, 1,4-buty
• the curable resin (B) includes a benzene ring skeleton, the heat resistance and chemical resistance of the adhesive layer 2 can be improved. Furthermore, this tendency can be made even more pronounced when the resin includes multiple benzene ring skeletons or a bisphenol A-type structure.
• the number of functional groups (the number of groups containing a polymerizable carbon-carbon double bond) per molecule of the curable resin (B) may be 2 or more, preferably 2 or more and 20 or less, and more preferably 2 or more and 15 or less. This increases the reactivity of the curable resin (B), and more reliably achieves good releasability in the adhesive layer 2 after energy beam irradiation and suppresses defects during the pick-up process.
• the weight-average molecular weight of the curable resin (B) is not particularly limited as long as it is smaller than the weight-average molecular weight of the double bond-introduced acrylic resin (A), but is preferably 100 or more and 1,000 or less, and more preferably 200 or more and 500 or less.
• the weight-average molecular weight is measured by gel permeation chromatography (GPC) in terms of standard polystyrene.
• the blending ratio of the curable resin (B) is more than 0 parts by mass and not more than 180 parts by mass, preferably 3 parts by mass or more and not more than 160 parts by mass, more preferably 5 parts by mass or more and not more than 140 parts by mass, and even more preferably 8 parts by mass or more and not more than 120 parts by mass, per 100 parts by mass of the double bond-introduced acrylic resin (A).
• This achieves the effect of using the double bond-introduced acrylic resin (A) and the curable resin (B) in combination.
• a sufficiently high adhesive strength can be ensured before the adhesive layer 2 hardens, and the adhesive strength can be sufficiently reduced after hardening.
• the adhesive layer 2 will have insufficient adhesive strength before curing and will be difficult to cure, resulting in reduced peelability during energy ray irradiation and defects during pickup processing. Furthermore, a lack of curable resin (B) will cause poor appearance of the adhesive tape 100, such as wrinkles and slack, after the surface cleaning process. On the other hand, if the blending ratio of curable resin (B) is above the upper limit, the curable resin (B) will be in excess, making it more likely for the curable resin (B) to dissolve in the cleaning solution, which may lead to contamination of the semiconductor substrate 7 by the curable resin (B).
• the adhesive layer 2 preferably contains a photopolymerization initiator, which facilitates initiation of polymerization of the double bond-introduced acrylic resin (A) and the curable resin (B).
• photopolymerization initiators examples include 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- ⁇ 4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl ⁇ -2-methyl-propan-1-one, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, 4-(2-hydroxyethoxy)phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, 1-hydroxycyclohexyl phenyl ketone, and Michler's Ketones, acetophenone, methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio
• the photopolymerization initiator is preferably blended in an amount of 0.1 to 50 parts by mass, and more preferably 0.5 to 10 parts by mass, per 100 parts by mass of the double bond-introduced acrylic resin (A).
• the resin composition constituting the adhesive layer 2 may contain a crosslinking agent. By containing a crosslinking agent, the adhesive layer 2 can be adjusted to have an appropriate hardness.
• the crosslinking agent is not particularly limited, but examples include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, urea resin-based crosslinking agents, methylol-based crosslinking agents, chelate-based crosslinking agents, aziridine-based crosslinking agents, melamine-based crosslinking agents, polyvalent metal chelate-based crosslinking agents, acid anhydride-based crosslinking agents, polyamine-based crosslinking agents, and carboxyl group-containing polymer-based crosslinking agents. Of these, isocyanate-based crosslinking agents are preferred.
• Isocyanate-based crosslinking agents are not particularly limited, but examples include polyisocyanate compounds of polyvalent isocyanates, trimers of polyisocyanate compounds, trimers of isocyanate-terminated compounds obtained by reacting a polyisocyanate compound with a polyol compound, and blocked polyisocyanate compounds in which isocyanate-terminated urethane prepolymers are blocked with phenols, oximes, etc.
• polyisocyanates examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-[2,2-bis(4-phenoxyphenyl)propane]diisocyanate, and 2,2,4-trimethyl-hexamethylene diisocyanate, and these can be used alone or in combination of two or more.
• the crosslinking agent is preferably blended in an amount of 0.01 to 30 parts by mass, and more preferably 0.1 to 20 parts by mass, per 100 parts by mass of the double bond-introduced acrylic resin (A).
• the crosslinking agent can be made to reliably exhibit the functions that are exhibited by adding the crosslinking agent to the resin composition.
• the thickness of the adhesive layer 2 is not particularly limited, but is preferably 5 ⁇ m to 100 ⁇ m, more preferably 5 ⁇ m to 50 ⁇ m. By setting the thickness of the adhesive layer 2 within this range, it is possible to achieve an adhesive layer 2 that exhibits good adhesion to the semiconductor substrate 7 during the dicing process and good releasability during the pick-up process.
• the adhesive layer 2 may be composed of a laminate (multilayer body) made up of multiple layers composed of different resin compositions.
• the adhesive tape 100 is immersed in the cleaning solution for 30 minutes with DMSO as the cleaning solution and ethanol as the rinsing solution while the outer periphery of the adhesive layer 2 is fixed to a ring frame, and the haze of the adhesive tape 100 measured after being removed is defined as Ha.
• the haze measured before being immersed in the cleaning solution is defined as Hb.
• the haze difference calculated by (Ha - Hb) for the adhesive tape 100 is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less.
• Adhesive tape 100 with a small difference in haze can minimize appearance defects caused by contact with cleaning fluid. This is thought to be because swelling of the adhesive layer 2 and elution of low molecular weight components from the adhesive layer 2 can be minimized.
• Haze can be measured using a haze meter in accordance with the measurement method specified in JIS K 7136:2000.
• the method for manufacturing the substrate 4 is not particularly limited, but examples include common molding methods such as extrusion molding methods such as the calendar method, inflation extrusion method, and T-die extrusion method, and wet casting method.
• the upper surface of the substrate 4 may be previously subjected to a surface treatment such as corona treatment, chromic acid treatment, matte treatment, ozone exposure treatment, flame exposure treatment, high-voltage shock exposure treatment, ionizing radiation treatment, primer treatment, or anchor coat treatment. This can improve the adhesion between the substrate 4 and the adhesive layer 2.
• a surface treatment such as corona treatment, chromic acid treatment, matte treatment, ozone exposure treatment, flame exposure treatment, high-voltage shock exposure treatment, ionizing radiation treatment, primer treatment, or anchor coat treatment. This can improve the adhesion between the substrate 4 and the adhesive layer 2.
• Adhesive layer 2 is formed on the top surface of substrate 4.
• Adhesive layer 2 is formed by coating or spraying a liquid material made by dissolving a resin composition in a solvent to form a varnish on the top surface of a film such as polyethylene terephthalate, then evaporating the solvent to form a layer, and then transferring that layer to substrate 4.
• the solvent is not particularly limited, but examples include methyl ethyl ketone, acetone, toluene, ethyl acetate, dimethyl formaldehyde, etc., and one or more of these can be used in combination.
• liquid material can be applied or sprayed onto the substrate 4 using methods such as die coating, curtain die coating, gravure coating, comma coating, bar coating, and lip coating.
• the adhesive tape 100 is obtained.
• the pressure-sensitive adhesive tape 100 is a pressure-sensitive adhesive tape that includes a substrate 4 and a pressure-sensitive adhesive layer 2 laminated on one surface of the substrate 4, and is used to temporarily fix a semiconductor substrate 7 (substrate).
• the pressure-sensitive adhesive layer 2 contains a double-bond-introduced acrylic resin (A) having an unsaturated double bond in a side chain, and a curable resin (B) that is cured by irradiation with energy rays.
• the blending ratio of the curable resin (B) to 100 parts by mass of the double-bond-introduced acrylic resin (A) is more than 0 parts by mass and not more than 180 parts by mass.
• This configuration results in an adhesive tape 100 that has good resistance to cleaning solutions and maintains good releasability after energy beam irradiation. This reduces the occurrence of defects during dicing and pick-up processes.
• the curable resin (B) has a polymerizable carbon-carbon double bond that can be three-dimensionally crosslinked by irradiation with energy rays. Furthermore, it is preferable that the number of functional groups per molecule of the curable resin (B) is two or more.
• This configuration increases the reactivity of the curable resin (B), more reliably achieving good peelability in the adhesive layer 2 after energy beam irradiation and suppressing defects during the pickup process.
• the curable resin (B) contains at least one of an ester of (meth)acrylic acid and a polyhydric alcohol, a urethane acrylate, and an epoxy acrylate.
• the curable resin (B) can be more reliably cured by irradiation with energy rays. This allows the adhesive layer 2 to achieve good releasability through energy ray irradiation treatment and suppress the occurrence of defects during the pickup process.
• the curable resin (B) contains bisphenol A epoxy acrylate.
• the curable resin (B) can be more reliably cured by irradiation with energy rays. This allows the adhesive layer 2 to achieve good releasability through energy ray irradiation treatment and suppress the occurrence of defects during the pickup process.
• the double bond-introduced acrylic resin (A) preferably has a polymerizable carbon-carbon double bond in the side chain that can be three-dimensionally crosslinked by irradiation with energy rays.
• each layer of the adhesive tape of the present invention may contain components other than those described in the above embodiment.
• the adhesive tape of the present invention may have an optional layer added to the layer configuration described in the above embodiment.
• the location of the additional layer is not particularly limited, and may be on the upper surface of the adhesive layer, on the lower surface of the substrate, or between the adhesive layer and the substrate.
• the substrate may be composed of multiple layers.
• the substrates temporarily fixed with the adhesive tape of the present invention are not limited to the semiconductor substrates (semiconductor wafers) described above, but may also include, for example, glass substrates such as soda-lime glass, borosilicate glass, and quartz glass; ceramic substrates such as alumina, silicon nitride, and titanium oxide; resin substrates such as acrylic, polycarbonate, and rubber; single crystal substrates such as quartz and sapphire; and metal plates. Also included in the substrates temporarily fixed with adhesive tape are components such as chips obtained by cutting semiconductor wafers and other substrates.
• Adhesive Tape An adhesive tape was prepared using the following materials.
• Table 1 shows the base resin, curable resin, photopolymerization initiator, and crosslinking agent used to prepare the adhesive layer.
• Each base resin was synthesized as follows. 6.1.1. Synthesis of Base Resin a1-1 An acrylic copolymer was obtained by copolymerizing 48.3 parts by mass (solids equivalent: hereinafter the same), 14.0 parts by mass of methyl methacrylate, 30.0 parts by mass of hydroxyethyl acrylate, 0.64 parts by mass of acrylic acid, and 7.06 parts by mass of dimethylacrylamide. The obtained acrylic copolymer was then reacted with 2-methacryloyloxyethyl isocyanate (MOI) to obtain a (meth)acrylic acid ester copolymer (base resin a1-1) having an energy ray-curable group (methacryloyl group) introduced into the side chain. The two were reacted so that the MOI was 38.7 g per 100 g of the acrylic copolymer.
• MOI 2-methacryloyloxyethyl isocyanate
• the weight average molecular weight (Mw) of the obtained (meth)acrylic acid ester copolymer was 600,000. In all of the following examples and comparative examples, the weight average molecular weight (Mw) of the (meth)acrylic acid ester copolymer was also 600,000.
• Base Resin a1-2 65.86 parts by mass of butyl acrylate, 3.5 parts by mass of methyl methacrylate, 30.0 parts by mass of hydroxyethyl acrylate, and 0.64 parts by mass of acrylic acid were copolymerized to obtain an acrylic copolymer.
• the resulting acrylic copolymer was then reacted with 2-methacryloyloxyethyl isocyanate (MOI) to obtain a (meth)acrylic acid ester copolymer (base resin a1-2) having an energy ray-curable group (methacryloyl group) introduced into the side chain. The two were reacted so that the MOI was 38.7 g per 100 g of the acrylic copolymer.
• MOI 2-methacryloyloxyethyl isocyanate
• Base Resin a1-3 An acrylic copolymer was obtained by copolymerizing 66.43 parts by mass of butyl acrylate, 1.0 part by mass of methyl methacrylate, 30.0 parts by mass of hydroxyethyl acrylate, and 2.57 parts by mass of acrylic acid. The obtained acrylic copolymer was then reacted with 2-methacryloyloxyethyl isocyanate (MOI) to obtain a (meth)acrylic acid ester copolymer (base resin a1-3) having an energy ray-curable group (methacryloyl group) introduced into the side chain. The two were reacted so that the MOI was 31.8 g per 100 g of the acrylic copolymer.
• MOI 2-methacryloyloxyethyl isocyanate
• Base Resin a1-4 69.36 parts by mass of 2-ethylhexyl acrylate, 10.00 parts by mass of methyl methacrylate, 20.00 parts by mass of hydroxyethyl acrylate, and 0.64 parts by mass of acrylic acid were copolymerized to obtain an acrylic copolymer.
• the resulting acrylic copolymer was then reacted with 2-methacryloyloxyethyl isocyanate (MOI) to obtain a (meth)acrylic acid ester copolymer (base resin a1-4) having an energy ray-curable group (methacryloyl group) introduced into its side chain. The two were reacted such that the MOI was 25.4 g per 100 g of the acrylic copolymer.
• MOI 2-methacryloyloxyethyl isocyanate
• Base resin a2 An acrylic copolymer (base resin a2) was obtained by copolymerizing 85.0 parts by mass of butyl acrylate, 13.33 parts by mass of methyl methacrylate, 1.03 parts by mass of hydroxyethyl acrylate, and 0.64 parts by mass of acrylic acid.
• Base resin a3 An acrylic copolymer (base resin a3) was obtained by copolymerizing 66.2 parts by mass of butyl acrylate, 23.0 parts by mass of methyl methacrylate, 3.1 parts by mass of hydroxyethyl acrylate, 7.06 parts by mass of dimethylacrylamide, and 0.64 parts by mass of acrylic acid.
• each base resin is a double-bond-introduced acrylic resin with an unsaturated double bond in the side chain, it is marked with a circle in Table 1; if no unsaturated double bond is introduced in the side chain, it is marked with an ⁇ in Table 1.
• Table 1 also shows the main monomer component, acid value, hydroxyl value, glass transition temperature Tg (theoretical Tg before the introduction of side-chain double bonds) of the backbone polymer, and weight-average molecular weight Mw of each base resin.
• the main monomer component refers to the component with the highest mass content among all monomer components.
• Each base resin was synthesized by changing the blend of monomer components so that these physical properties would achieve the values shown in Table 1.
• the double bond equivalent weight of the double-bond-introduced acrylic resins was in the range of 200 to 4,000.
• BA stands for butyl acrylate
• 2-EHA stands for 2-ethylhexyl acrylate.
• curable resins b1, b2, and b3 The number of functional groups in curable resins b1, b2, and b3 is shown in Table 1. Details of each curable resin shown in Table 1 are as follows:
• Curable resin b1 As the curable resin b1, bisphenol A type epoxy acrylate (manufactured by Daicel Allnex Corporation, product number: EBECRYL600) was prepared.
• Curable resin b2 As the curable resin b2, urethane acrylate (manufactured by Miwon Specialty Chemical Co., Ltd., product number: SC2152) was prepared.
• Curable resin b3 As the curable resin b3, dipentaerythritol hexaacrylate (manufactured by Daicel Allnex Corporation, product number: DPHA), which is an esterification product of (meth)acrylic acid and polyhydric alcohol, was prepared.
• DPHA dipentaerythritol hexaacrylate
• a liquid material was prepared by blending the raw materials shown in Tables 2 and 3 in a predetermined ratio. Next, this liquid material was bar-coated onto the substrates shown in Tables 2 and 3 so that the thickness after drying was the value shown in Tables 2 and 3. The resulting coating was dried at 80°C for 1 minute to obtain an adhesive layer.
• Tables 2 and 3 show the thickness of the substrate 1 used to produce the adhesive tape.
• A The haze difference is 20% or less.
• B The haze difference is more than 20% and 40% or less.
• C The haze difference is more than 40%.
• A Almost no wrinkles or looseness (less than 5% of the area inside the ring frame)
• B Few wrinkles or sagging (5% to less than 20% of the area inside the ring frame)
• C Lots of wrinkles and sagging (more than 20% of the area inside the ring frame)
• A Little residue adheres (less than 5% of the outer periphery of the tip)
• B A little bit of residue adhered (5% or more but less than 20% of the outer periphery of the tip)
• C A large amount of residue adheres (20% or more of the outer periphery of the tip)
• adhesive tapes with a width of 25 mm for each of the Examples and Comparative Examples were attached to the surface of a silicon wafer whose surface had been polished with a #2000 polishing grit.
• the adhesive tape and silicon wafer were then held at 23°C for 1 hour.
• the adhesive tape attached to the silicon wafer was irradiated with ultraviolet light at an ultraviolet illuminance of 55 W/ cm2 and an ultraviolet exposure dose of 200 mJ/ cm2 to cure the adhesive layer.
• a peel test was conducted in an environment of 23°C, in which one end of the adhesive tape was held and pulled at a 180° angle at a rate of 300 mm/min.
• peel strength A1 peel strength A1
• a tensile tester TENSILON RTG-1310, manufactured by A&D Co., Ltd.
• the measured values were evaluated according to the following evaluation criteria. The evaluation results are shown in Tables 2 and 3.
• A The measured value is 500 mN/25 mm or less.
• B The measured value is greater than 500 mN/25 mm and less than or equal to 800 mN/25 mm.
• C The measured value is greater than 800 mN/25 mm.
• the present invention provides an adhesive tape that has good resistance to cleaning solutions and maintains good releasability when irradiated with energy rays even after contact with the cleaning solution. Therefore, the present invention has industrial applicability.
• Adhesive layer 4 Base material 7
• Semiconductor substrate 9 Wafer ring 10
• Semiconductor device 17 Molded portion 20
• Semiconductor chip 21 Terminal 23
• Interposer 41 Terminal 70 Bump 71
• Sealing layer 81 Connection portion 100
• Adhesive tape 121 Peripheral portion 122 Central portion 200
• Dicer table 300 Expand table 310 Expansion stage 320 Holder 400 Pickup table 500 Protective tape 600

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