TW202517B - - Google Patents
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- TW202517B TW202517B TW081101258A TW81101258A TW202517B TW 202517 B TW202517 B TW 202517B TW 081101258 A TW081101258 A TW 081101258A TW 81101258 A TW81101258 A TW 81101258A TW 202517 B TW202517 B TW 202517B
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- Taiwan
- Prior art keywords
- composition
- item
- barium titanate
- dielectric
- patent application
- Prior art date
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical class [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 46
- 229910002113 barium titanate Inorganic materials 0.000 claims description 40
- 239000002245 particle Substances 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 19
- 239000002243 precursor Substances 0.000 claims description 19
- 239000011575 calcium Substances 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 13
- 239000011701 zinc Substances 0.000 claims description 13
- 229910052791 calcium Inorganic materials 0.000 claims description 12
- 229910052725 zinc Inorganic materials 0.000 claims description 12
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 11
- 239000003990 capacitor Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910052758 niobium Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 239000002491 polymer binding agent Substances 0.000 claims description 4
- OOSYCERWOGUQJY-UHFFFAOYSA-N calcium;dioxido(dioxo)manganese Chemical compound [Ca+2].[O-][Mn]([O-])(=O)=O OOSYCERWOGUQJY-UHFFFAOYSA-N 0.000 claims description 3
- 239000010419 fine particle Substances 0.000 claims description 2
- 241000219823 Medicago Species 0.000 claims 1
- 235000017587 Medicago sativa ssp. sativa Nutrition 0.000 claims 1
- 238000010009 beating Methods 0.000 claims 1
- 230000009969 flowable effect Effects 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
- 239000000843 powder Substances 0.000 description 34
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 239000011230 binding agent Substances 0.000 description 13
- 238000011049 filling Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 239000000654 additive Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000010304 firing Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 7
- 229910052788 barium Inorganic materials 0.000 description 7
- 239000013522 chelant Substances 0.000 description 7
- 239000010955 niobium Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- -1 barium nitride Chemical class 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000001354 calcination Methods 0.000 description 4
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 4
- 230000002079 cooperative effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000002738 chelating agent Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920005596 polymer binder Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- 102000040350 B family Human genes 0.000 description 2
- 108091072128 B family Proteins 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 150000001450 anions Chemical group 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical group CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 210000003625 skull Anatomy 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 241001672694 Citrus reticulata Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 241001331845 Equus asinus x caballus Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920001744 Polyaldehyde Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- KEUXLNUAJRPQNF-UHFFFAOYSA-N acetaldehyde;propan-2-one Chemical compound CC=O.CC(C)=O KEUXLNUAJRPQNF-UHFFFAOYSA-N 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 239000002519 antifouling agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Chemical group 0.000 description 1
- 229940006612 barium citrate Drugs 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- XBYNNYGGLWJASC-UHFFFAOYSA-N barium titanium Chemical class [Ti].[Ba] XBYNNYGGLWJASC-UHFFFAOYSA-N 0.000 description 1
- PAVWOHWZXOQYDB-UHFFFAOYSA-H barium(2+);2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Ba+2].[Ba+2].[Ba+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O PAVWOHWZXOQYDB-UHFFFAOYSA-H 0.000 description 1
- ZZCNKSMCIZCVDR-UHFFFAOYSA-N barium(2+);dioxido(dioxo)manganese Chemical compound [Ba+2].[O-][Mn]([O-])(=O)=O ZZCNKSMCIZCVDR-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 229960002380 dibutyl phthalate Drugs 0.000 description 1
- ASTZLJPZXLHCSM-UHFFFAOYSA-N dioxido(oxo)silane;manganese(2+) Chemical compound [Mn+2].[O-][Si]([O-])=O ASTZLJPZXLHCSM-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000016507 interphase Effects 0.000 description 1
- 239000011872 intimate mixture Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- LBSANEJBGMCTBH-UHFFFAOYSA-N manganate Chemical compound [O-][Mn]([O-])(=O)=O LBSANEJBGMCTBH-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000320 mechanical mixture Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N nitrate group Chemical group [N+](=O)([O-])[O-] NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000035935 pregnancy Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008433 xiaoji Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Inorganic Insulating Materials (AREA)
Description
02517 A 6 B6 經濟部屮央標準/t.;oc工消费合作社印製 五、發明説明（1) 發明節臁 本發明有關鈦酸鋇為主之組成物，其形成具小晶粒及 高介電常數之陶瓷體。 發明背暑 對降低多靥陶瓷電容器（ML C)之大小以在電路板 上佔用較少空間並減低成本一直有需求。尺寸及成本之降 低可藉發展高介電常數（K)之陶瓷材料並藉産製具薄介 電層，一般為25微米或更少，之MLC而完成。雖然具 15, ◦ 0 0或更大之K的陶瓷介電髏為已知，但此通常 基於高鉛材料諸如鈮酸鉛鎂，或鈮酸鉛鐵等。除了具高鉛 含量之加工粉末對健康之潛在損害外，此材料亦易有 MLC應用所不期望之某些性質，諸如極低機械強度，低 化學耐用性，及在MHz頻率之低K。 基於鈦酸鋇之高介電常數材料亦已知（例如Burn· Raad and Sasaki, Proceedings of the Capacitor and Resistor Technology Symposium (CARTS) . Amsterdam 1 989)。但是，晶粒一般大於5撖米，故橫跨各介電 層存有數晶粒，若層厚少於25微米則不足以達高可信度 。小晶粒之高介電常數載於由溼式化學加工諸如溼熱法（ Neirman. J. Mats. Sc. Vol· 2 3 , p . 3980» 1 9 8 8)或烷氧化物所製之鈦酸鋇及錯酸鋇固體溶液。 此種固髏溶液組成物不適於具薄層之MLC,因為居禮峰 (或居禮溫度）高於2 5^且介電常數隨溫度之變化急遽 本紙張尺度边用中國國家標準(CHS)甲4規格(210x297公；ίί：) (請先閲讀背面之注意事項再填寫本頁) 裝- -3 - 經 濟 部 屮 央 標 準 局 工 消 合 h 社 印 製 L0251? 五、發明説明（2) 。居禮溫度高於2 5*C之組成物就具薄膜之ML C言之損 耗因數（dissipatiogn factor)不適地高。因此，對具高 介電常數，細晶粒及低於2 5t：之居禮溫度的鈦酸鋇為主 之陶瓷介霜材料仍有需求。 先前技蓊 美國專利4，6 4 0, 9 0 5 (Burn)描述具下式以 鈦酸鋇為主之介電體 (1-X) [(Ba 1-x Pbx)Ti 1_(U+V) ZruSnv)〇3] + X [A(Zni/3Nb2/3)〇3 + Y [F] 式中A選自Pb, Ba及其混合物，F為摻鎂之硼酸鋅焊 劑，且X, u及v = 0至0. 125。掲示高達 1〇，300之介電常數。 美國專利4, 855, 266 (Burn)掲示鈦酸鋇為 主之組成物，其適用於具銅電極之多層陶瓷電容器。鈦酸 頭包括給予及收授兩添加劑及焊劑相。包括含Zr, Ζη 及Nb之摻雜鈦酸鋇之用途。得到高達9 0 0 0 — 10, 000之介電常數。 美國專利4, 8 2 0, 6 8 8 (Kato等人）描述K為 12, 000且燒成晶粒大小為0. 8—1微米之鈦酸鋇 為主之介電體。介電粉含Ca, Zr, Sn, Bi, Y, 及Pb摻雜物且由氮化鋇、氯化鈦及摻雜物之水溶液沈澱 (請先閲讀背面之注意事項再填寫本頁) 訂. 線·
A 6 B6 L02517 五、發明説明（3) 美國專利4，8 2 9, 0 3 3 (Menashi等人）及 4，643，9 84 (Abe 等人）掲不藉淫熱（hydroth-ermal)加工製得之包括摻雜鈦酸鋇的複合鈣鈦礦材料。 發明總論 本發明有關一種組成物，其用以形成介電常數至少 1 0, 000,居禮溫度低於2510,且晶徑為5徹米或 更少之致密介電體。主要地，發明針對一種組成物，其包 括 (a)經改質之鈦酸鋇細粒；及 (b ) (1)鈣及鈦之氧化物，其先質，或鈦酸鈣與 (2)氣化錳，其先質，鈦酸録或錳酸鈣之摻和物； 經改質之鈦酸鋇顆粒依以下化學式含有在原子刻度上 於整個顆粒中皆有分佈之Zr, Zn及Nb摻雜物
BaTii-(x+3y/2) (ZrxZny/2Nby) 〇3 式中 x = 0.01 - 0.20,且 y = 0.005 - 0.075 另一方面，發明有關一種上述組成物在有機介質中之 分散物，其可鑄成介電Μ。 另一方面，發明有關先燒烤上述介電Η以由彼蒸發有 機介質並藉燒結將無機固體致密化而製之介電層。 再另一方面，本發明有關一種電容器，其包括數個上 本紙張尺度逍时8 8家料(CHS)T根格⑵0x297公货)"' --- -5 - (請先閱讀背面之注意事項再填寫本頁) 裝- 線- 經濟部屮央標準A工消费合作社印製 ,0251? A6 B6 經濟部屮央標準XJCI:工消贤合作社印製 五、發明説明（4) 述介電層，其介於至少兩電極層間。 發明詳沭 在本發明中，鋅，鈮及結摻雜物在産製中包含於鈦酸 鋇中。鈦酸鋇製法掲示於共審理申請案，美國编號07/ 144, 835 (代理文件缠號CH — 1412)且包括 步驟： (a) 將有機金屬化合物，或有機金屬化合物之混合 物，其結構為T i Ln,式中L為可水解基，或此種基之 組合，其選自烷氧基，芳氣基，胺烷氧，乙醛氣，及乙醛 丙酮基，與化合物或化合物混合物，其通式為BaXy， 式中X為陰離子，或陰離子之組合，其選自氫氧基，氛基 ，硝酸根及乙酸根，之溶液在碱性，高端能之環境下混合 I (b) 將反應産物结晶；及 (c )單離晶髏。 此法之特佳例中，鈦酸鋇以下法製得： (a) 第一組份流之鈦酸四丁酯與第二組份流之氫氣 化錤溶液在8 0 — 8 5*0之溫度及高端能環境下反應，包 括將該組份流同時泵經同軸噴混器以形成漿液並將該漿卸 入含有碱水之排液容器中； (b) 在連缠攪拌下回流加熱使該漿結晶；及 (c )單離該結晶。 摻雜物諸如Zr, Nb及Zn可於製備中摻入鈦酸賴 (請先閲讀背面之注意事項再填寫本頁) 裝- 訂- -線. 本紙尺度逍用中國國家樣準(CNS)甲4規格(210x297公龙） 一 6 L02517 A 6 B6 經濟部屮央？I準i.Joc工消费合作社印51 五、發明説明（5) 中，其藉，例如，η —丙氧化結，氧化鈮，及無水氯化鋅 之混合物部分取代鈦酸四丁酯，如上述共審理案所詳述者 0 摻雜物取代鈦酸根結晶格子上之鈦，如未顯示第二柑 之清楚鈣鈦礦X射線繞射圖形所示。此種適當组合之摻雜 物將鈦酸鋇之居禮溫度（Curie temp)由純鈦酸鋇之約 1 3 0它移至2 5¾以下，較好為約5t：。含適當摻雜物 之經改質鈦酸鋇顆粒具下式： BaTil-(x+3y/2) (ZrxZny/2Nby) 〇3 式中x為Ο. 01至Ο. 20且y為〇. 005至 0. 075。較佳顆粒中，X約〇. 〇7且y約 0.0 2 7。 添加（1)鈣，及鈦之氣化物，其先質，或鈦酸鋇， 及（2)錳氧化物，其先質，錳酸鋇或錳酸鈣之摻和物於 經改質之鈦酸鋇顆粒。金屬氣'化物先質為在鍛燒或燒成時 轉化成金屬氣化物之化合物。此種先質包括碩酸鹽，氫氧 化及硝酸鹽。 先前技藝中己知在經摻雜鈦酸鋇中包含氣化鈣可調整 居禮峰（Curie peak)之寬度以降低介電常數對溫度之依 存性。但是，吾人發現適量鈣不能在上述製法中摻於經摻 雜之鈦酸鋇，因氫氣化鋇溶解度大於氫氧化鈣故使鋇比鈣 先反應。鈦酸鋇，或先質諸如碳酸鈣及氣化鈦之機械混合 物，添加於經接雜欽酸鋇以試圖調整居禮峰（Curie Peak (請先閲讀背面之注意事項再填寫本頁) 裝· _ 線- 本紙張尺度通用中H S家標準(CNS)甲4規格(210x25)7公茇) -7 - 經濟部屮央標準而只工消"合作社印51 L0251? A 6 ___ B6_ 五、發明説明（6) )之寬度。意外地，吾人發現，該添加在燒成時有利地抑 制晶粒成長並將居裡峰移至稍高溫而妨礙了摻雜物之效果 0 不幸地，經改質之鈦酸鋇及氣化鈣組成物具有低至無 法實用之絶緣電阻。為提高絶緣電阻，亦添加少置氧化锰 ，其先質，錳酸錤或錳酸0。因此，使用適量Zr, Zn 及Nb於鈦酸親中，及適量鈦酸鈣及錳酸頦或鈣，或先質 ,可將發明之介電材料設計成居禮點（Curie point)低於 2 5Ί0,燒成晶徑少於5微米，且在2 5¾之介電常數大 於15, 0◦0,其在85=減低少於約85%。 代之鈣，鈦及錳添加物與經摻雜鈦酸鋇之機械摻和， 添加物可藉共審理案號07/506, 966 (代理文件 编號CH — 1 757)中所述之方法塗於經摻雜鈦酸鋇粉 之表面，其包括步驟： (a) 製得金屬（即，添加物）螯合物之濃安定液； (b) 以控制速率添加金屬螯合物溶液於經摻雜鈦酸 鋇之乾粉，而在該粉之液髏極限下劇烈攪拌混合物；及 (c) 將該粉乾燥並煅燒以分解金屬螯合物並去除揮 發性殘留物。 金屬螯合物溶液藉將金屬化合物混合物溶於螯合劑之 濃水或水/有機溶液中製得。調整pH時，螯合劑可與金 屬離子形成可溶之金靥螯合物。螯合劑增加金屬化合物在 水或水/有機溶劑中之溶解度。此增加之溶解度是在粉末 液體極限下施加於乾粉時得到適當塗層所必需。 本紙張尺度逍用中國國家標準(CNS)甲4規格(210x297公釐) (請先閲讀背面之注意事項再填寫本頁) 裝· 線- -8 - 經濟部屮央櫺準局κχ工消费合作社印31 Α6 Β6 五、發明説明（7) 金屬螯合物溶液以控制下之速率添加於乾鈦酸鋇粉， 而在粉末之液髖極限下劇烈攪拌以在溶劑蒸發前後到顆粒 上之均勻分佈。液鳋極限意指在夜鼸及塑料態間之絶對極 限上包括陶瓷顆粒之粉末的水含置重量百分比。ASTM standard D43 1 8 — 84詳述關於土壊之液體極限的 標準試驗法，在此併為粉末參考。 將粉末乾燥並烺燒以分解金屬螯合物並在鈦酸鋇粉上 完全形成均勻塗靥。此法導致粉面上添加物分佈更均勻， 及比添加物與經摻雜鈦酸鋇機械摻雜時低之損耗因數值。 較佳添加物塗層具以下組成（最終組成物之wt%)： 〇.25 - 5. 0 C a 0 ； 0 . 2 5-5. 0 Ti〇2;及 0. 025-0. 20 Μ η 0 〇 發明之鈦酸鋇组成物可調配成介電生板。形成該板之 一法包括將在聚合物粘合劑及揮發性有機溶劑之溶液中之 陶瓷鈦酸鋇組成物之分散液薄於可撓基板上，諸如銷帶或 聚合膜，然後加熱鏵層以由彼去除揮發性溶劑。 其中分散有陶瓷固鼸之有機介質包括聚合粘合劑，其 溶於揮發明有機溶劑及，隨意地，其他溶解物諸如增塑劑 ,脱模劑，分散劑，剝離劑，防污劑及潤溼剤。 為得較佳粘合效果，較好使用至少5%wt聚合物粘 合劑於95%wt陶瓷固體。但是，更佳者為使用不多於 本紙張尺度遑用中S Η家標準(CNS)甲4規格(210x297公茇） (請先閲讀背面之注意事項再填寫本頁) 裝- 線· -9 -
0251? 經濟部中央標準局β工消Φ：合作社印M 五、發明説明（8) 2〇％wt聚合物粘合劑於80%wt陶瓷固膜。在此極 限中，期望使用相對於固髖之最少可能董之粘合劑以減少 必需以熱解去除之有機物的量。 以往，使用各種聚合材料為生板之粘合劑，例如，（ 聚）乙烯基丁醛，（聚）乙酸乙烯酯，（聚）乙烯醇，纖 維素聚合物諸如甲基纖維素，乙基繼維素，羥乙基繼維素 ，甲羥基一乙基纖維索，無規聚丙烯，聚乙烯，矽聚合物 諸如（聚）甲基矽氣烷，（聚）甲苯基矽氣烷，聚苯乙烯 ,丁二烯/苯乙烯共聚物，聚苯乙烯，（聚）乙烯基吡咯 烷酮，聚醛胺，高分子量聚醚，乙烯化氣及丙烯化氣之共 聚物，聚丙烯醛胺，及各種丙烯酸聚合物諸如聚丙烯酸納 ,(聚）丙烯酸低烷酯，（聚）異丁烯酸低烷酯及丙烯酸 低烷酯與異丁烯酸酯之共聚物及多聚物。異丁烯酸乙酯及 丙烯酸甲酯之共聚物及丙烯酸乙酯，異丁烯酸甲酯及異丁 烯酸之三聚物原已用為條狀鋳材之粘合劑。 最近，Usala ,在 U.S.P· 4, 613, 648 中掲 示一種有機粘合劑，其為〇—10〇%wt異丁烯酸 Ci-e烷酷，1 00 — 0%wt丙烯酸Ci-e院醋及0 — 5%wt烯未飽和羧酸或胺之相容多聚物的混合物。因該 聚合物可使用最少量粘合劑及最大置之介電固體，故其使 用有利於本發明之介電組成物。 鏵液之溶劑組份經選擇以得到聚合物之完全溶液及足 以在大氣壓下藉極少熱將溶劑由分散液蒸發之高揮發度。 此外，溶劑在有機介質中所含之任一種其他添加物之沸點 (請先閲讀背面之注意事項再填寫本頁) 裝· 訂- 線· 本紙張尺度逍用中a B家標準(CNS)甲4規格(210x297公¢) -10 - Α6 Β6 ,02οί: 五、發明説明（巧 (請先閲讀背面之注意事項再填寫本頁) 及分解溫度下必需充分沸騰。因此，最常使用大氣沸點低 於150Ό之溶劑。此種溶劑包括丙酮，二甲苯，甲醇， 乙醇，甲基乙基甲酮，1,1,1一三氛乙烷，四氣乙烯 ，乙酸戊酯，戊二醇一1, 3—單異丁酸2, 2,4—三 乙酯，甲苯及二氣甲烷。 有機介質亦常含少量，相對於拈合劑聚合物，增塑劑 ,其降低粘合劑聚合物之玻璃化溫度（Tg)。但是，此 種物質之使用應為最少置以降低在燒成由彼鑄得之膜時必 需移除之有機物的量。當然，增塑劑之選擇主要由必需改 質之聚合物決定。已用於各粘合劑条統之增塑劑為酞酸二 乙酯，酞酸二丁酯，酞酸辛酯，酞酸丁酯共酯，磷酸烷酯 ，聚伸烷甘醇，甘油，（聚）乙烯化氧，羥乙基化之烷酚 ,二硫代磷酸二烷酯及（聚）異丁烯。當然丙烯酸聚合； 物糸中最常用酞酸丁酯苄酯，因其可於極低濃度莠效。 經濟部中央標準沿β工消费合作社印製 多層裝置諸如電路及電容器可由生電子板及導電金屬 製得。例如，金屬可依期望圖案印於生板上。經印刷之板 堆叠，層積並裁成期望結構，然後將生組件燒成以由金屬 材料有效去除有機介質且由介電材料去除有機粘合劑。此 類材料之去除藉燒成操作中蒸發及熱分解之組合完成。在 某些情況下，亦可在燒成前加入預乾步驟。習慣上，未燒 介電板厚一般約18—30微米且燒成時厚度變約15— 2 5撖米。但是，本發明板厚可小至1 0撤米或更小。 期望之燒結溫度依介電質之物性及化性而定。一般燒 結溫度結選擇以得到介電質之最大致密化。但是，熟習電 本紙張尺度逍用中國Η家標準(CNS)甲4規格(210X297公澄) -11 - A6 B6 五、發明説明（lp 子裝置産製者已知並非始終需最大致密化。因此，V燒結 溫度"意指得到特定應用之介電質所霈之致密度的溫度（ 及對時間）。 發明之組成物在約1 24 t：及更高之溫度燒结成致密 陶瓷材料，當不包含流動添加物時。但是，為將燒結溫度 降至約1 125它，可添加硼酸鋅，或其他先前技藹已知 之稀釋劑，或藉共審理案07/506, 964 (代理文 件CH_ 1 6 7 6)所述之方法包含於經摻雜鈦酸鋇之塗 層中，其包括步驟： (a) 混合硼酸鋅流動組份先質與經Ca, Ti, Μη金屬塗覆之鈦酸鋇粉，由是硼酸鋅稀釋組份先質在各 顆粒上形成均勻塗曆；及 (b) 乾燥並隨意煅燒經塗覆之顆粒。 一種進行此流塗操作之塗法包括在粉末之液醱極限下 摻和並包括將流料均勻分佈於經金屬添加物塗佈之鈦酸鋇 粉粒表面上，其藉下者完成： 經濟部屮央櫺準^β工消费合作社印製 (請先閱讀背面之注意事項再填寫本頁) (a) 添加至少一種硼及一種鋅流動組份先質之濃液 於經金屬塗佈之鈦酸鋇粉，並將pH保持於預定範圍以防 止離子由鈦酸鋇粉粒表面解離； (b) 在鈦酸鋇粉之液體極限下劇烈攪拌混合物以將 顆粒均勻塗以流動組份先質；及 (c) 乾燥並隨意煅燒均勻塗佈之顆粒。 第二種進行流塗裝置之塗法為表面水解，其包括藉下 法將流料均勻分佈於經金屬塗佈之鈦酸鋇粉粒表面上： 本紙張尺度边用中國國家標準(CNS)甲4規格(210x297公釐) -12 - ,0251? A6 B6 五、發明説明（1)1 (a) 將羥化之金屬塗佈之鈦酸鋇粉分佈於至少一種 鋅及一種硼流動組份之可水解先質在水不溶混有機溶劑中 之溶液中； (b) 過濾分離，離心或傾析並洗滌顆粒；及 (c )乾燥並隨意煅燒均塗顆粒。 第三種進行流塗操作之塗法為表面核化，其包括以下 法在經金屬塗覆之鈦酸鋇粉末之表面上均勻分佈流料： (a) 將經金屬塗佈之鈦酸鋇粉分散於水中； (b) 以控制速率同時或依序添加至少一種鋅及一種 硼流動組份先質之水溶液於分散水溶液，而將分散液pH 保持在6 . 5至7 . 5之範圍且溫度在由5 0至7 0 t：之 範圍； (c) 回收鈦酸鋇粉粒；及 (d) 乾燥並隨意煅燒均塗顆粒。 燒結時間亦依介電質組成而定，但一般在燒結溫度約 2. 5小時為佳。完成燒結時，依化合物耐熱擊性而定小 心控制到達室溫之冷卻速率。 經濟部屮央櫺準杓只工消"合作社印製 (請先閱讀背面之注意事項再填寫本頁) 發明實例中，經改質之鈦酸鋇及金颶氣化物添加組成 物調配成形成單件式電容器之介電板。形成此單件式電容 器之較佳法包括順序步驟：（a)由上述組成物及有機粘 合劑形成生介電板；（2 )在多個生板上各施一層分散於 有機介質中之導電電極材料；（3)形成生板及電極材料 之交替層的組件；及（4)在高於1 000¾之溫度燒成 該組件以由彼去除有機介質及有機粘合劑並燒結導電電極 本紙度通用中國國家標準(CNS)甲4規格（210X297公垃) -13 - A 6 B6 ,02517 五、發明説明（1? (請先閲讀背面之注意事項再填窝本頁) 材料及介電材料。依此法形成之單件式電容器包括介電常 數至少10, 000且晶徑不大於5撤米且至少兩相間金 屬電極與陶瓷體接觸之陶瓷介電體。 奮施例 窨掄例1 使用摻有Zr, Ζη及Nb且藉前法製得之鈦酸鋇。 通稱組成（重量份數）為BaO 6 4. 4 4, T i Ο 2 29. 71, Z r Ο 2 3. 86, N b 2〇 s 1.51, 及ZnO 0. 463。化學分析所得組成如下：BaO 63. 79, T i Ο 2 29. 24, Z r Ο 2 3 . 84 ,N b 2〇 5 1.53, ZnO 0 . 4 4 4 , S r Ο 經濟部屮央櫺準^工消赀合作社印製 0. 3 1。粉末粒徑（D5。）為0. 4微米且在9001C 煅燒5小時。煅燒後之表面積為6. 2Μ2/gm。陶瓷 帶藉96. 52wt%經摻雜之鈦酸鋇，1. 79%碩酸 鈣（1. 00%CaO),1. 50%二氣化鈦及 0· 20%硪酸錳（0· 12MnO)之密混物漿液鑄造 而得。漿液藉在1, 1, 1 一三氯乙烷（lgm每gm粉 末）以 2%AB10 15 表面活性劑（Ε·Ι. du Pont de Nemours & Co.» Inc.. Wilmington DE ("Du Pont Co." )研磨粉末16小時，然後添加丙烯酸粘合劑溶液（30 gm每10 0 gm粉末）並再研磨4小時。粘合劑溶液為 在MEK中之9 1. 7%丙烯酸樹脂（5200粘合劑， Du Pont Co.)及8. 3%酞酸丁酯苄酯增塑劑之混合物 本紙張尺度逍用中國B家標準(CNS)甲4規格(210x297公釐) -14 - ,03517 A6 B6 五、發明説明（孕 〇 陶瓷帶與6値内電極及5個活性層製成MLC ( EIA尺寸1 209),在燒成時各約14微米。使用 P d電極漿（例如Du Pont 4820D)印刷電極。電 容器缓熱至5 5 ◦*0以去除有機粘合劑並在1 24 010之 氧化錯砂中將MLC燒成2. 5小時。燒成MLC之陶瓷 晶粒2 — 3微米。平均電容及在0. 5伏特測得之損耗因 數各為 0. 2 8 6 microfarads 及 2. 8%。在 25*C 之 絶緣電阻超過1 0 0 ohm.farads,且在1 2 5 υ 平均1 6 1 0 ohm. farads。居禮點約lot且在85t! 電容偏差為一81. 5%。計算之介電常數為 2 0, 5 0 0 〇 奮施例2 此例中，上述經摻雜粉藉前述塗法塗以1. 0% CaO, 1. 50%丁1〇2及0. 12%MnO。該粉
經濟部屮央標準XJK3C工消费合作社印M (請先閱讀背面之注意事項再填窝本頁) 於塗覆後在700它煅燒。生帶及MLC藉例1方法製自 此經塗覆粉末，除了MLC為EIA1206尺寸且燒成 時之帶厚為10撤米外。MLC如例1般燒成。燒成陶瓷 之晶粒仍為2 — 3徹米。平均電容為0· 2 9 3 microfarads 且在 0. 5 伏特測得 之損耗因數為 2· 0%。 絶緣 電阻在2 5 ΐ：超過1 0 0 , 0 0 0 ohm .far ads且在 125Ό 平均 8300 ohm.farads。居禮點（Curie p-oint)約10¾且在85C之電容偏差為一 83%。計算 本紙張尺度逍用中國國家標準(CNS)甲4規格(210x297公釐) -15 - 丨 0231 !7 A6 B6 五、發明説明（1并 之介電常數為21, 000。 奮施例3 此例同於例2,除塗靥中之氣化錳為0. 06%而非 ◦ · 12¾外。燒成陶瓷之晶粒約1撤米。平均電容 0. 3 2 6 microfarads且損耗因數為2. 6%。絶緣 電阻在25υ超過100, 000且在125它平均 3 5 0 0 ohm.farads。居箱黏（Curie point)約 1 0 t：且在8 5 C之電容偏差為一 8 4 %。計算之介電常數為 2 3,0 0 0。 奮施例4 此例中，經摻雜之鈦酸鋇如上塗以硼酸鋅。氣化鋅及 氧化硼量通稱0. 78%及0. 22%經摻和鈦酸鋇重。 鋅及硼化學分析産生0. 79%氣化鋅及0.19¾ 經濟部中央標準局爲工消费合作社印驳 (請先閲讀背面之注意事項再填寫本頁) 。塗以硼酸鋅之經摻雜鈦酸鋇與2. 50wt%鈦 酸鈣粉及0.l〇wt%硪酸鎂之密混物如上磨製。生帶 及MLC藉同於例1之方法製得，除了霄極漿為70% A g — 3 0 % P d (例如 Du Pont 4765 或 4803 ),非Pd,並使用1206號篩外。粘合劑燒完後， MLC在1125¾之氧化錯砂中燒成2. 5小時。介電 質厚在燒成後為12. 5撤米且晶徑約3微米。平均電容 為 0 . 3 2 4 microfarads 且在 1 . 〇 V 測得之 D F 為 6. 5%。在 0. IV 之 DF 為 2. 1%。在 25·^ 之絶 本紙張尺度逍用中國B家標準(CNS)甲4規格(210X297公龙) -16 - 7 A6 B6 五、發明説明（1)5 緣電阻平均76, ◦〇〇 ohm.farads且在125*C為 6 1 0 0 ohm.farads。居裡溫度（ Curie temp)約 1 〇 t!且在8 5Ί0之電容偏差為一 8 6%。計算之介電常數為 2 5, 0 0 0 〇
奮施例B MLC如例4般製得並燒成但不添加鈦酸鈣於介電組 成物。介電質厚13. 5撤米，但晶粒相當無規，某些晶 粒大於10撖米。平均電容為0. 09 microfarads 且 在1伏特測得之DF為3. 4%。絶緣電阻不定且在25 它平均 3 2 0 Ohm. fa rads 且在 125t：為 1019,某 些電容器之I R值< 1 ohm. farad。此較差之可信度可能 與陶瓷中存有大晶粒有關。居禮溫度（Curie temp)約0 它（即低於存有C a 0時）且在8 5 t之電容偏差為 一 70%。計算之介電常數（在251C)為8, 300。 (請先閱讀背面之注意事項再填寫本頁) 經濟部屮央標準沿β工消费合作社印製 本紙尺度逍用中國Β家樣準(CNS)甲4規格(210x297公煃) -17 _
Claims (1)
- .J A 7 B7 C7 D7 六、申請專利範園 附件一（A):第81101258號專利申請案 中文申請專利範圍修正本 先 «1 〇! 背 之 注 意 事 項 填 寫 本 页 民國81年10月修正 ll. 一種用以形成介電常數至少10，〇〇〇,居箱 溫度低於2 5 1C ,且粒度為5撤米或更少之致密介電髏的 組成物，該組成物包含 (a) 89. 8◦至99. 475重量％之經改質之 鈦酸鋇細粒；及 (b) 0. 525至10. 20重量％之由（1)鈣 及鈦之氣化物，其先質，或鈦酸鈣與（2)氧化錳，其先 質，鈦酸鋇或錳酸鈣所組成之摻和物； 經改質之鈦酸鋇顆粒依以下化學式含有在原子刻度上 於整個顆粒中皆有分佈之Zr, Zn及Nb揍雜物 BaTi1-(x+3y/2)(ZrxZny/2Nby) 03 式中 X = 0.01-0.20 _/ = 0:005-0.075. 且 經濟部Ψ央櫺準局B工消费合作社印M 2.如申請專利範圍第1項之組成物，其中氣化物或 其先質之摻和物包括，wt%組成物： ◦ .25-5.0wt% C a Ο ； Ο. 25-5. 0 w t 96 Ti〇2;及 0.025-0.20wt% Mn0o 本纸張尺度適用中B國家橾準(CNS)T4規格(210x297公釐) 1 A 7 B7 0·____Dr_ 六、中锜專利範00 3. 如申請專利範圍第2項之組成物，其中氣化物或 其先質之摻和物塗於經改質之鈦酸鋇顆粒表面上。 4. 如申請專柄範圍第3項之組成物，其中x= ◦ . 07 且 y = 0. 027。 5. 如申請專利範圍第1項之組成物，其另包括流動 劑。 6，如申請專利範圍第5項之組成物，其中流動剤包 括硼酸鋅。 7. 如申請專利範圍第1項之組成物，其另包括含有 揮發性有機溶劑及有機聚合物粘合劑之溶液的有機介質。 8. 如申請專利範圍第7項之组成物，其可用於形成 未經燒結或生的（green)介電板。 9. 如申請專利範圍第8項之組成物，其中該介電板 可用於形成經過繞結的介電陶瓷層。 10. 如申請專利範圍第9項之組成物，其中該介電 陶瓷層可用於形成多層元件。 11. 如申請專利範圍第10項之組成物，其中該多 層元件僳電容器。I 請先聞分背面之注意事'^ 1填寫本苜 .裝· .Λ" 經濟部屮央標準局貝工消贽合作社印製 •緣· 本纸朵尺度適用中S國家揉準（CNS)T4規格(210x297公it) -2 "
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| EP (1) | EP0578652B1 (zh) |
| JP (1) | JP3261130B2 (zh) |
| DE (1) | DE69211343T2 (zh) |
| TW (1) | TW202517B (zh) |
| WO (1) | WO1993015031A1 (zh) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0134555B1 (ko) * | 1994-07-27 | 1998-04-27 | 김은영 | 고주파용 유전체 재료 |
| US6268054B1 (en) * | 1997-02-18 | 2001-07-31 | Cabot Corporation | Dispersible, metal oxide-coated, barium titanate materials |
| CA2383020A1 (en) * | 1999-08-23 | 2001-03-01 | Cabot Corporation | Silicate-based sintering aid and method |
| JP3391322B2 (ja) * | 1999-12-10 | 2003-03-31 | 株式会社村田製作所 | 積層コンデンサ及びその製造方法 |
| US6526833B1 (en) | 2000-03-13 | 2003-03-04 | Massachusetts Institute Of Technology | Rhombohedral-phase barium titanate as a piezoelectric transducer |
| US6733740B1 (en) | 2000-10-12 | 2004-05-11 | Cabot Corporation | Production of dielectric particles |
| US6656590B2 (en) | 2001-01-10 | 2003-12-02 | Cabot Corporation | Coated barium titanate-based particles and process |
| US6673274B2 (en) | 2001-04-11 | 2004-01-06 | Cabot Corporation | Dielectric compositions and methods to form the same |
| US7914755B2 (en) * | 2001-04-12 | 2011-03-29 | Eestor, Inc. | Method of preparing ceramic powders using chelate precursors |
| US20030059366A1 (en) * | 2001-09-21 | 2003-03-27 | Cabot Corporation | Dispersible barium titanate-based particles and methods of forming the same |
| US6734127B2 (en) * | 2001-10-09 | 2004-05-11 | Dong-Hau Kuo | Ceramic materials for capacitors with a high dielectric constant and a low capacitance change with temperature |
| US20030215606A1 (en) * | 2002-05-17 | 2003-11-20 | Clancy Donald J. | Dispersible dielectric particles and methods of forming the same |
| DE10222746A1 (de) * | 2002-05-23 | 2003-12-04 | Philips Intellectual Property | Dielektrische Zusammensetzung auf Basis von Bariumtitanat |
| US20040052721A1 (en) * | 2002-09-13 | 2004-03-18 | Kerchner Jeffrey A. | Dielectric particles having passivated surfaces and methods of forming same |
| US20040121153A1 (en) * | 2002-12-20 | 2004-06-24 | Sridhar Venigalla | High tetragonality barium titanate-based compositions and methods of forming the same |
| KR100455890B1 (ko) * | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
| US7688569B2 (en) * | 2004-03-16 | 2010-03-30 | E. I. Du Pont De Nemours And Company | Thick-film dielectric and conductive compositions |
| EP1578179A3 (en) | 2004-03-16 | 2006-05-03 | E.I. du Pont de Nemours and Company | Thick-film dielectric and conductive compositions |
| CA2558594A1 (en) * | 2004-03-29 | 2005-10-06 | Nippon Chemical Industrial Co., Ltd. | Inorganic dielectric powder for composite dielectric material and composite dielectric material |
| US20060282999A1 (en) * | 2005-06-20 | 2006-12-21 | Diptarka Majumdar | Electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part II |
| US20060287188A1 (en) * | 2005-06-21 | 2006-12-21 | Borland William J | Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof |
| US7531416B2 (en) * | 2005-12-21 | 2009-05-12 | E. I. Du Pont De Nemours And Company | Thick film capacitors on ceramic interconnect substrates |
| US7993611B2 (en) * | 2006-08-02 | 2011-08-09 | Eestor, Inc. | Method of preparing ceramic powders using ammonium oxalate |
| US8853116B2 (en) | 2006-08-02 | 2014-10-07 | Eestor, Inc. | Method of preparing ceramic powders |
| US20100006841A1 (en) * | 2008-07-11 | 2010-01-14 | International Business Machines Corporation | Dual metal gate transistor with resistor having dielectric layer between metal and polysilicon |
| KR20110123782A (ko) * | 2009-02-27 | 2011-11-15 | 에스톨, 인코포레이티드 | 산화물 분말의 습식 화학 공침을 위한 반응 튜브 및 열수 처리 방법 |
| US20110128665A1 (en) * | 2009-11-30 | 2011-06-02 | Avx Corporation | Ceramic Capacitors for High Temperature Applications |
| EP2513926A2 (en) * | 2009-12-16 | 2012-10-24 | Apricot Materials Technologies LLC | Capacitor with three-dimensional high surface area electrode and methods of manufacture |
| EP2628166B1 (en) | 2010-10-12 | 2016-07-27 | Apricot Materials Technologies LLC | Ceramic capacitor and methods of manufacture |
| JP5337316B2 (ja) * | 2012-01-30 | 2013-11-06 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 高誘電絶縁性樹脂組成物 |
| JP6515758B2 (ja) * | 2015-09-15 | 2019-05-22 | Tdk株式会社 | 積層電子部品 |
| KR20210078011A (ko) | 2019-12-18 | 2021-06-28 | 삼성전기주식회사 | 유전체 자기 조성물의 제조 방법 및 이로부터 제조된 유전체 자기 조성물 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4463984A (en) * | 1978-11-20 | 1984-08-07 | Repco Limited | Vehicle cushion |
| JPS6022452B2 (ja) * | 1982-08-13 | 1985-06-01 | 三菱鉱業セメント株式会社 | 誘電体磁器組成物 |
| US4536535A (en) * | 1983-06-07 | 1985-08-20 | E. I. Du Pont De Nemours And Company | Castable ceramic compositions |
| JPH0665603B2 (ja) * | 1985-04-17 | 1994-08-24 | 株式会社村田製作所 | 複合酸化物セラミツク粉末の製造方法 |
| US4640905A (en) * | 1985-05-01 | 1987-02-03 | E. I. Du Pont De Nemours And Company | Dielectric compositions |
| US4829033A (en) * | 1986-05-05 | 1989-05-09 | Cabot Corporation | Barium titanate powders |
| WO1988008830A1 (en) * | 1986-11-03 | 1988-11-17 | Dean Terence C | Dielectric ceramic with high k, low df and flat tc |
| US4855266A (en) * | 1987-01-13 | 1989-08-08 | E. I. Du Pont De Nemours And Company | High K dielectric composition for use in multilayer ceramic capacitors having copper internal electrodes |
| US5087437A (en) * | 1988-01-15 | 1992-02-11 | E. I. Du Pont De Nemours And Company | Process for preparing crystalline mixed metal oxides |
| JP2800017B2 (ja) * | 1989-04-05 | 1998-09-21 | 株式会社村田製作所 | 積層セラミックスコンデンサ |
-
1990
- 1990-06-29 US US07/564,586 patent/US5155072A/en not_active Expired - Fee Related
-
1992
- 1992-01-31 JP JP50620692A patent/JP3261130B2/ja not_active Expired - Fee Related
- 1992-01-31 DE DE69211343T patent/DE69211343T2/de not_active Expired - Fee Related
- 1992-01-31 EP EP92906118A patent/EP0578652B1/en not_active Expired - Lifetime
- 1992-01-31 WO PCT/US1992/000406 patent/WO1993015031A1/en active IP Right Grant
- 1992-02-20 TW TW081101258A patent/TW202517B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO1993015031A1 (en) | 1993-08-05 |
| EP0578652A1 (en) | 1994-01-19 |
| DE69211343D1 (de) | 1996-07-11 |
| US5155072A (en) | 1992-10-13 |
| JP3261130B2 (ja) | 2002-02-25 |
| JPH06506086A (ja) | 1994-07-07 |
| DE69211343T2 (de) | 1996-12-05 |
| EP0578652B1 (en) | 1996-06-05 |
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