TW202515820A - 二氧化矽粉末、樹脂組合物以及分散體 - Google Patents

二氧化矽粉末、樹脂組合物以及分散體 Download PDF

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Publication number
TW202515820A
TW202515820A TW113137288A TW113137288A TW202515820A TW 202515820 A TW202515820 A TW 202515820A TW 113137288 A TW113137288 A TW 113137288A TW 113137288 A TW113137288 A TW 113137288A TW 202515820 A TW202515820 A TW 202515820A
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TW
Taiwan
Prior art keywords
silica powder
particles
particle size
silica
dispersion
Prior art date
Application number
TW113137288A
Other languages
English (en)
Chinese (zh)
Inventor
渡邊慧
水上菜緒
Original Assignee
日商德山股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商德山股份有限公司 filed Critical 日商德山股份有限公司
Publication of TW202515820A publication Critical patent/TW202515820A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113137288A 2023-10-03 2024-09-30 二氧化矽粉末、樹脂組合物以及分散體 TW202515820A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-172291 2023-10-03
JP2023172291 2023-10-03

Publications (1)

Publication Number Publication Date
TW202515820A true TW202515820A (zh) 2025-04-16

Family

ID=95283170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113137288A TW202515820A (zh) 2023-10-03 2024-09-30 二氧化矽粉末、樹脂組合物以及分散體

Country Status (6)

Country Link
US (1) US20260008681A1 (https=)
JP (1) JP7780689B2 (https=)
KR (1) KR20250050114A (https=)
CN (1) CN120091975B (https=)
TW (1) TW202515820A (https=)
WO (1) WO2025074910A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789080B2 (ja) * 2000-06-20 2011-10-05 日本アエロジル株式会社 非晶質微細シリカ粒子の製造方法
JP4716621B2 (ja) * 2001-08-09 2011-07-06 電気化学工業株式会社 高濃度シリカスラリー及びシリカスラリーの製造方法
JP6112888B2 (ja) 2013-02-05 2017-04-12 株式会社トクヤマ 乾式シリカ微粒子
JP7075033B2 (ja) * 2017-08-29 2022-05-25 日本電気硝子株式会社 フィラー粉末の製造方法
US12286541B2 (en) * 2017-08-31 2025-04-29 Tokuyama Corporation Surface-treated sol-gel silica and method for producing same
JP7063710B2 (ja) 2018-04-27 2022-05-09 株式会社日本触媒 表面処理シリカ粒子及び表面処理シリカ粒子の製造方法
JP7430700B2 (ja) * 2019-02-28 2024-02-13 株式会社トクヤマ シリカ粉末、樹脂組成物および分散体
KR20220160018A (ko) * 2020-03-31 2022-12-05 덴카 주식회사 알루미나 분말, 수지 조성물, 및 방열 부품
WO2021215285A1 (ja) * 2020-04-24 2021-10-28 株式会社トクヤマ 表面処理シリカ粉末の製造方法
JP7584272B2 (ja) * 2020-10-21 2024-11-15 株式会社トクヤマ 樹脂組成物
KR20230128444A (ko) * 2021-01-14 2023-09-05 가부시끼가이샤 도꾸야마 다공질 구상 실리카 및 그 제조 방법

Also Published As

Publication number Publication date
CN120091975A (zh) 2025-06-03
WO2025074910A1 (ja) 2025-04-10
CN120091975B (zh) 2025-12-30
JPWO2025074910A1 (https=) 2025-04-10
US20260008681A1 (en) 2026-01-08
KR20250050114A (ko) 2025-04-14
JP7780689B2 (ja) 2025-12-04

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