KR20250050114A - 실리카 분말, 수지 조성물 및 분산체 - Google Patents
실리카 분말, 수지 조성물 및 분산체 Download PDFInfo
- Publication number
- KR20250050114A KR20250050114A KR1020257009835A KR20257009835A KR20250050114A KR 20250050114 A KR20250050114 A KR 20250050114A KR 1020257009835 A KR1020257009835 A KR 1020257009835A KR 20257009835 A KR20257009835 A KR 20257009835A KR 20250050114 A KR20250050114 A KR 20250050114A
- Authority
- KR
- South Korea
- Prior art keywords
- silica powder
- particles
- silica
- mass
- dispersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2023-172291 | 2023-10-03 | ||
| JP2023172291 | 2023-10-03 | ||
| PCT/JP2024/034041 WO2025074910A1 (ja) | 2023-10-03 | 2024-09-25 | シリカ粉末、樹脂組成物および分散体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250050114A true KR20250050114A (ko) | 2025-04-14 |
Family
ID=95283170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257009835A Pending KR20250050114A (ko) | 2023-10-03 | 2024-09-25 | 실리카 분말, 수지 조성물 및 분산체 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260008681A1 (https=) |
| JP (1) | JP7780689B2 (https=) |
| KR (1) | KR20250050114A (https=) |
| CN (1) | CN120091975B (https=) |
| TW (1) | TW202515820A (https=) |
| WO (1) | WO2025074910A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014152048A (ja) | 2013-02-05 | 2014-08-25 | Tokuyama Corp | 乾式シリカ微粒子 |
| JP2019189509A (ja) | 2018-04-27 | 2019-10-31 | 株式会社日本触媒 | 表面処理シリカ粒子及び表面処理シリカ粒子の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4789080B2 (ja) * | 2000-06-20 | 2011-10-05 | 日本アエロジル株式会社 | 非晶質微細シリカ粒子の製造方法 |
| JP4716621B2 (ja) * | 2001-08-09 | 2011-07-06 | 電気化学工業株式会社 | 高濃度シリカスラリー及びシリカスラリーの製造方法 |
| JP7075033B2 (ja) * | 2017-08-29 | 2022-05-25 | 日本電気硝子株式会社 | フィラー粉末の製造方法 |
| US12286541B2 (en) * | 2017-08-31 | 2025-04-29 | Tokuyama Corporation | Surface-treated sol-gel silica and method for producing same |
| JP7430700B2 (ja) * | 2019-02-28 | 2024-02-13 | 株式会社トクヤマ | シリカ粉末、樹脂組成物および分散体 |
| KR20220160018A (ko) * | 2020-03-31 | 2022-12-05 | 덴카 주식회사 | 알루미나 분말, 수지 조성물, 및 방열 부품 |
| WO2021215285A1 (ja) * | 2020-04-24 | 2021-10-28 | 株式会社トクヤマ | 表面処理シリカ粉末の製造方法 |
| JP7584272B2 (ja) * | 2020-10-21 | 2024-11-15 | 株式会社トクヤマ | 樹脂組成物 |
| KR20230128444A (ko) * | 2021-01-14 | 2023-09-05 | 가부시끼가이샤 도꾸야마 | 다공질 구상 실리카 및 그 제조 방법 |
-
2024
- 2024-09-25 JP JP2025505854A patent/JP7780689B2/ja active Active
- 2024-09-25 US US19/117,276 patent/US20260008681A1/en active Pending
- 2024-09-25 CN CN202480004193.XA patent/CN120091975B/zh active Active
- 2024-09-25 WO PCT/JP2024/034041 patent/WO2025074910A1/ja active Pending
- 2024-09-25 KR KR1020257009835A patent/KR20250050114A/ko active Pending
- 2024-09-30 TW TW113137288A patent/TW202515820A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014152048A (ja) | 2013-02-05 | 2014-08-25 | Tokuyama Corp | 乾式シリカ微粒子 |
| JP2019189509A (ja) | 2018-04-27 | 2019-10-31 | 株式会社日本触媒 | 表面処理シリカ粒子及び表面処理シリカ粒子の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120091975A (zh) | 2025-06-03 |
| WO2025074910A1 (ja) | 2025-04-10 |
| CN120091975B (zh) | 2025-12-30 |
| JPWO2025074910A1 (https=) | 2025-04-10 |
| US20260008681A1 (en) | 2026-01-08 |
| JP7780689B2 (ja) | 2025-12-04 |
| TW202515820A (zh) | 2025-04-16 |
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