JP7780689B2 - シリカ粉末、樹脂組成物および分散体 - Google Patents

シリカ粉末、樹脂組成物および分散体

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Publication number
JP7780689B2
JP7780689B2 JP2025505854A JP2025505854A JP7780689B2 JP 7780689 B2 JP7780689 B2 JP 7780689B2 JP 2025505854 A JP2025505854 A JP 2025505854A JP 2025505854 A JP2025505854 A JP 2025505854A JP 7780689 B2 JP7780689 B2 JP 7780689B2
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JP
Japan
Prior art keywords
silica powder
particles
silica
mass
dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025505854A
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English (en)
Japanese (ja)
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JPWO2025074910A1 (https=
Inventor
慧 渡邊
菜緒 水上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
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Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of JPWO2025074910A1 publication Critical patent/JPWO2025074910A1/ja
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Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2025505854A 2023-10-03 2024-09-25 シリカ粉末、樹脂組成物および分散体 Active JP7780689B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023172291 2023-10-03
JP2023172291 2023-10-03
PCT/JP2024/034041 WO2025074910A1 (ja) 2023-10-03 2024-09-25 シリカ粉末、樹脂組成物および分散体

Publications (2)

Publication Number Publication Date
JPWO2025074910A1 JPWO2025074910A1 (https=) 2025-04-10
JP7780689B2 true JP7780689B2 (ja) 2025-12-04

Family

ID=95283170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025505854A Active JP7780689B2 (ja) 2023-10-03 2024-09-25 シリカ粉末、樹脂組成物および分散体

Country Status (6)

Country Link
US (1) US20260008681A1 (https=)
JP (1) JP7780689B2 (https=)
KR (1) KR20250050114A (https=)
CN (1) CN120091975B (https=)
TW (1) TW202515820A (https=)
WO (1) WO2025074910A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019044929A1 (ja) 2017-08-31 2019-03-07 株式会社トクヤマ 表面処理ゾルゲルシリカ及びその製造方法
WO2021215285A1 (ja) 2020-04-24 2021-10-28 株式会社トクヤマ 表面処理シリカ粉末の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789080B2 (ja) * 2000-06-20 2011-10-05 日本アエロジル株式会社 非晶質微細シリカ粒子の製造方法
JP4716621B2 (ja) * 2001-08-09 2011-07-06 電気化学工業株式会社 高濃度シリカスラリー及びシリカスラリーの製造方法
JP6112888B2 (ja) 2013-02-05 2017-04-12 株式会社トクヤマ 乾式シリカ微粒子
JP7075033B2 (ja) * 2017-08-29 2022-05-25 日本電気硝子株式会社 フィラー粉末の製造方法
JP7063710B2 (ja) 2018-04-27 2022-05-09 株式会社日本触媒 表面処理シリカ粒子及び表面処理シリカ粒子の製造方法
JP7430700B2 (ja) * 2019-02-28 2024-02-13 株式会社トクヤマ シリカ粉末、樹脂組成物および分散体
KR20220160018A (ko) * 2020-03-31 2022-12-05 덴카 주식회사 알루미나 분말, 수지 조성물, 및 방열 부품
JP7584272B2 (ja) * 2020-10-21 2024-11-15 株式会社トクヤマ 樹脂組成物
KR20230128444A (ko) * 2021-01-14 2023-09-05 가부시끼가이샤 도꾸야마 다공질 구상 실리카 및 그 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019044929A1 (ja) 2017-08-31 2019-03-07 株式会社トクヤマ 表面処理ゾルゲルシリカ及びその製造方法
WO2021215285A1 (ja) 2020-04-24 2021-10-28 株式会社トクヤマ 表面処理シリカ粉末の製造方法

Also Published As

Publication number Publication date
CN120091975A (zh) 2025-06-03
WO2025074910A1 (ja) 2025-04-10
CN120091975B (zh) 2025-12-30
JPWO2025074910A1 (https=) 2025-04-10
US20260008681A1 (en) 2026-01-08
KR20250050114A (ko) 2025-04-14
TW202515820A (zh) 2025-04-16

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