CN120091975B - 一种二氧化硅粉末、树脂组合物以及分散体 - Google Patents

一种二氧化硅粉末、树脂组合物以及分散体

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Publication number
CN120091975B
CN120091975B CN202480004193.XA CN202480004193A CN120091975B CN 120091975 B CN120091975 B CN 120091975B CN 202480004193 A CN202480004193 A CN 202480004193A CN 120091975 B CN120091975 B CN 120091975B
Authority
CN
China
Prior art keywords
silica powder
particles
silica
mass
dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202480004193.XA
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English (en)
Chinese (zh)
Other versions
CN120091975A (zh
Inventor
渡边慧
水上菜绪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of CN120091975A publication Critical patent/CN120091975A/zh
Application granted granted Critical
Publication of CN120091975B publication Critical patent/CN120091975B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202480004193.XA 2023-10-03 2024-09-25 一种二氧化硅粉末、树脂组合物以及分散体 Active CN120091975B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-172291 2023-10-03
JP2023172291 2023-10-03
PCT/JP2024/034041 WO2025074910A1 (ja) 2023-10-03 2024-09-25 シリカ粉末、樹脂組成物および分散体

Publications (2)

Publication Number Publication Date
CN120091975A CN120091975A (zh) 2025-06-03
CN120091975B true CN120091975B (zh) 2025-12-30

Family

ID=95283170

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480004193.XA Active CN120091975B (zh) 2023-10-03 2024-09-25 一种二氧化硅粉末、树脂组合物以及分散体

Country Status (6)

Country Link
US (1) US20260008681A1 (https=)
JP (1) JP7780689B2 (https=)
KR (1) KR20250050114A (https=)
CN (1) CN120091975B (https=)
TW (1) TW202515820A (https=)
WO (1) WO2025074910A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003054935A (ja) * 2001-08-09 2003-02-26 Denki Kagaku Kogyo Kk 高濃度シリカスラリー及びシリカスラリーの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789080B2 (ja) * 2000-06-20 2011-10-05 日本アエロジル株式会社 非晶質微細シリカ粒子の製造方法
JP6112888B2 (ja) 2013-02-05 2017-04-12 株式会社トクヤマ 乾式シリカ微粒子
JP7075033B2 (ja) * 2017-08-29 2022-05-25 日本電気硝子株式会社 フィラー粉末の製造方法
US12286541B2 (en) * 2017-08-31 2025-04-29 Tokuyama Corporation Surface-treated sol-gel silica and method for producing same
JP7063710B2 (ja) 2018-04-27 2022-05-09 株式会社日本触媒 表面処理シリカ粒子及び表面処理シリカ粒子の製造方法
JP7430700B2 (ja) * 2019-02-28 2024-02-13 株式会社トクヤマ シリカ粉末、樹脂組成物および分散体
KR20220160018A (ko) * 2020-03-31 2022-12-05 덴카 주식회사 알루미나 분말, 수지 조성물, 및 방열 부품
WO2021215285A1 (ja) * 2020-04-24 2021-10-28 株式会社トクヤマ 表面処理シリカ粉末の製造方法
JP7584272B2 (ja) * 2020-10-21 2024-11-15 株式会社トクヤマ 樹脂組成物
KR20230128444A (ko) * 2021-01-14 2023-09-05 가부시끼가이샤 도꾸야마 다공질 구상 실리카 및 그 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003054935A (ja) * 2001-08-09 2003-02-26 Denki Kagaku Kogyo Kk 高濃度シリカスラリー及びシリカスラリーの製造方法

Also Published As

Publication number Publication date
CN120091975A (zh) 2025-06-03
WO2025074910A1 (ja) 2025-04-10
JPWO2025074910A1 (https=) 2025-04-10
US20260008681A1 (en) 2026-01-08
KR20250050114A (ko) 2025-04-14
JP7780689B2 (ja) 2025-12-04
TW202515820A (zh) 2025-04-16

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