TW202503443A - 電腦程式、分析方法及分析裝置 - Google Patents

電腦程式、分析方法及分析裝置 Download PDF

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Publication number
TW202503443A
TW202503443A TW113100564A TW113100564A TW202503443A TW 202503443 A TW202503443 A TW 202503443A TW 113100564 A TW113100564 A TW 113100564A TW 113100564 A TW113100564 A TW 113100564A TW 202503443 A TW202503443 A TW 202503443A
Authority
TW
Taiwan
Prior art keywords
processing
value
substrate
substrates
values
Prior art date
Application number
TW113100564A
Other languages
English (en)
Chinese (zh)
Inventor
大場大輔
中村隆央
狐塚正樹
村田勉
大見則文
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202503443A publication Critical patent/TW202503443A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2123/00—Data types
    • G06F2123/02—Data types in the time domain, e.g. time-series data

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automation & Control Theory (AREA)
  • Testing And Monitoring For Control Systems (AREA)
TW113100564A 2023-01-12 2024-01-05 電腦程式、分析方法及分析裝置 TW202503443A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-003306 2023-01-12
JP2023003306 2023-01-12

Publications (1)

Publication Number Publication Date
TW202503443A true TW202503443A (zh) 2025-01-16

Family

ID=91897046

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113100564A TW202503443A (zh) 2023-01-12 2024-01-05 電腦程式、分析方法及分析裝置

Country Status (6)

Country Link
US (1) US20250329564A1 (https=)
JP (1) JPWO2024150704A1 (https=)
KR (1) KR20250136338A (https=)
CN (1) CN120569802A (https=)
TW (1) TW202503443A (https=)
WO (1) WO2024150704A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026023476A1 (ja) * 2024-07-23 2026-01-29 東京エレクトロン株式会社 情報処理方法、コンピュータプログラム及び情報処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051269A (ja) * 2004-10-12 2005-02-24 Hitachi Ltd 半導体処理装置
JP4771855B2 (ja) * 2006-05-08 2011-09-14 東京エレクトロン株式会社 サーバ装置、およびプログラム
JP5273697B2 (ja) * 2006-08-01 2013-08-28 東京エレクトロン株式会社 サーバ装置およびプログラム
JP2014116453A (ja) 2012-12-10 2014-06-26 Hitachi Kokusai Electric Inc データ取得方法及び基板処理装置の管理装置
JP2017142634A (ja) * 2016-02-10 2017-08-17 株式会社日立ハイテクノロジーズ データ管理装置及びデータ管理装置の監視方法

Also Published As

Publication number Publication date
CN120569802A (zh) 2025-08-29
KR20250136338A (ko) 2025-09-16
US20250329564A1 (en) 2025-10-23
WO2024150704A1 (ja) 2024-07-18
JPWO2024150704A1 (https=) 2024-07-18

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