JPWO2024150704A1 - - Google Patents
Info
- Publication number
- JPWO2024150704A1 JPWO2024150704A1 JP2024570166A JP2024570166A JPWO2024150704A1 JP WO2024150704 A1 JPWO2024150704 A1 JP WO2024150704A1 JP 2024570166 A JP2024570166 A JP 2024570166A JP 2024570166 A JP2024570166 A JP 2024570166A JP WO2024150704 A1 JPWO2024150704 A1 JP WO2024150704A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0612—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32926—Software, data control or modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2123/00—Data types
- G06F2123/02—Data types in the time domain, e.g. time-series data
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Automation & Control Theory (AREA)
- Testing And Monitoring For Control Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023003306 | 2023-01-12 | ||
| PCT/JP2023/047301 WO2024150704A1 (ja) | 2023-01-12 | 2023-12-28 | コンピュータプログラム、分析方法及び分析装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024150704A1 true JPWO2024150704A1 (https=) | 2024-07-18 |
Family
ID=91897046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024570166A Pending JPWO2024150704A1 (https=) | 2023-01-12 | 2023-12-28 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250329564A1 (https=) |
| JP (1) | JPWO2024150704A1 (https=) |
| KR (1) | KR20250136338A (https=) |
| CN (1) | CN120569802A (https=) |
| TW (1) | TW202503443A (https=) |
| WO (1) | WO2024150704A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026023476A1 (ja) * | 2024-07-23 | 2026-01-29 | 東京エレクトロン株式会社 | 情報処理方法、コンピュータプログラム及び情報処理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051269A (ja) * | 2004-10-12 | 2005-02-24 | Hitachi Ltd | 半導体処理装置 |
| JP4771855B2 (ja) * | 2006-05-08 | 2011-09-14 | 東京エレクトロン株式会社 | サーバ装置、およびプログラム |
| JP5273697B2 (ja) * | 2006-08-01 | 2013-08-28 | 東京エレクトロン株式会社 | サーバ装置およびプログラム |
| JP2014116453A (ja) | 2012-12-10 | 2014-06-26 | Hitachi Kokusai Electric Inc | データ取得方法及び基板処理装置の管理装置 |
| JP2017142634A (ja) * | 2016-02-10 | 2017-08-17 | 株式会社日立ハイテクノロジーズ | データ管理装置及びデータ管理装置の監視方法 |
-
2023
- 2023-12-28 JP JP2024570166A patent/JPWO2024150704A1/ja active Pending
- 2023-12-28 WO PCT/JP2023/047301 patent/WO2024150704A1/ja not_active Ceased
- 2023-12-28 CN CN202380090325.0A patent/CN120569802A/zh active Pending
- 2023-12-28 KR KR1020257025766A patent/KR20250136338A/ko active Pending
-
2024
- 2024-01-05 TW TW113100564A patent/TW202503443A/zh unknown
-
2025
- 2025-07-03 US US19/258,918 patent/US20250329564A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN120569802A (zh) | 2025-08-29 |
| KR20250136338A (ko) | 2025-09-16 |
| US20250329564A1 (en) | 2025-10-23 |
| WO2024150704A1 (ja) | 2024-07-18 |
| TW202503443A (zh) | 2025-01-16 |