KR20250136338A - 컴퓨터 프로그램, 분석 방법 및 분석 장치 - Google Patents

컴퓨터 프로그램, 분석 방법 및 분석 장치

Info

Publication number
KR20250136338A
KR20250136338A KR1020257025766A KR20257025766A KR20250136338A KR 20250136338 A KR20250136338 A KR 20250136338A KR 1020257025766 A KR1020257025766 A KR 1020257025766A KR 20257025766 A KR20257025766 A KR 20257025766A KR 20250136338 A KR20250136338 A KR 20250136338A
Authority
KR
South Korea
Prior art keywords
processing
value
substrates
substrate
processing step
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257025766A
Other languages
English (en)
Korean (ko)
Inventor
다이스케 오바
다카히로 나카무라
마사키 기츠네즈카
츠토무 무라타
노리후미 오미
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20250136338A publication Critical patent/KR20250136338A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L21/67276—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01L21/67253—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2123/00—Data types
    • G06F2123/02—Data types in the time domain, e.g. time-series data

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automation & Control Theory (AREA)
  • Testing And Monitoring For Control Systems (AREA)
KR1020257025766A 2023-01-12 2023-12-28 컴퓨터 프로그램, 분석 방법 및 분석 장치 Pending KR20250136338A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-003306 2023-01-12
JP2023003306 2023-01-12
PCT/JP2023/047301 WO2024150704A1 (ja) 2023-01-12 2023-12-28 コンピュータプログラム、分析方法及び分析装置

Publications (1)

Publication Number Publication Date
KR20250136338A true KR20250136338A (ko) 2025-09-16

Family

ID=91897046

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257025766A Pending KR20250136338A (ko) 2023-01-12 2023-12-28 컴퓨터 프로그램, 분석 방법 및 분석 장치

Country Status (6)

Country Link
US (1) US20250329564A1 (https=)
JP (1) JPWO2024150704A1 (https=)
KR (1) KR20250136338A (https=)
CN (1) CN120569802A (https=)
TW (1) TW202503443A (https=)
WO (1) WO2024150704A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026023476A1 (ja) * 2024-07-23 2026-01-29 東京エレクトロン株式会社 情報処理方法、コンピュータプログラム及び情報処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116453A (ja) 2012-12-10 2014-06-26 Hitachi Kokusai Electric Inc データ取得方法及び基板処理装置の管理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051269A (ja) * 2004-10-12 2005-02-24 Hitachi Ltd 半導体処理装置
JP4771855B2 (ja) * 2006-05-08 2011-09-14 東京エレクトロン株式会社 サーバ装置、およびプログラム
JP5273697B2 (ja) * 2006-08-01 2013-08-28 東京エレクトロン株式会社 サーバ装置およびプログラム
JP2017142634A (ja) * 2016-02-10 2017-08-17 株式会社日立ハイテクノロジーズ データ管理装置及びデータ管理装置の監視方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116453A (ja) 2012-12-10 2014-06-26 Hitachi Kokusai Electric Inc データ取得方法及び基板処理装置の管理装置

Also Published As

Publication number Publication date
TW202503443A (zh) 2025-01-16
WO2024150704A1 (ja) 2024-07-18
JPWO2024150704A1 (https=) 2024-07-18
CN120569802A (zh) 2025-08-29
US20250329564A1 (en) 2025-10-23

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Legal Events

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000