TW202502894A - 樹脂組成物、薄膜、覆金屬積層板及電路基板 - Google Patents

樹脂組成物、薄膜、覆金屬積層板及電路基板 Download PDF

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Publication number
TW202502894A
TW202502894A TW113117870A TW113117870A TW202502894A TW 202502894 A TW202502894 A TW 202502894A TW 113117870 A TW113117870 A TW 113117870A TW 113117870 A TW113117870 A TW 113117870A TW 202502894 A TW202502894 A TW 202502894A
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TW
Taiwan
Prior art keywords
resin composition
liquid crystal
crystal polymer
thermoplastic liquid
film
Prior art date
Application number
TW113117870A
Other languages
English (en)
Chinese (zh)
Inventor
杉井浩晃
白神基
井手彩矢佳
小野寺稔
Original Assignee
日商可樂麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商可樂麗股份有限公司 filed Critical 日商可樂麗股份有限公司
Publication of TW202502894A publication Critical patent/TW202502894A/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/025Electric or magnetic properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/12Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW113117870A 2023-05-15 2024-05-15 樹脂組成物、薄膜、覆金屬積層板及電路基板 TW202502894A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023080082 2023-05-15
JP2023-080082 2023-05-15

Publications (1)

Publication Number Publication Date
TW202502894A true TW202502894A (zh) 2025-01-16

Family

ID=93519656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113117870A TW202502894A (zh) 2023-05-15 2024-05-15 樹脂組成物、薄膜、覆金屬積層板及電路基板

Country Status (5)

Country Link
JP (1) JPWO2024237224A1 (https=)
KR (1) KR20260008755A (https=)
CN (1) CN121175380A (https=)
TW (1) TW202502894A (https=)
WO (1) WO2024237224A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202532212A (zh) * 2023-12-12 2025-08-16 日商東洋鋼鈑股份有限公司 延伸液晶聚合物薄膜、層積體、電路基板、及延伸液晶聚合物薄膜的製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639756B2 (ja) 2003-11-05 2011-02-23 住友化学株式会社 芳香族液晶ポリエステルおよびそのフィルムならびにそれらの用途
JP6295013B2 (ja) * 2016-02-29 2018-03-14 ポリプラスチックス株式会社 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法
KR102612138B1 (ko) * 2017-03-31 2023-12-08 주식회사 쿠라레 열가소성 액정 폴리머 및 그 필름
JP6991083B2 (ja) * 2018-03-20 2022-01-12 住友化学株式会社 液晶性ポリエステル液状組成物、液晶ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム
JP7390127B2 (ja) * 2019-02-15 2023-12-01 住友化学株式会社 液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法
JP7703301B2 (ja) * 2020-06-30 2025-07-07 株式会社Eneosマテリアル 樹脂組成物および該樹脂組成物からなる樹脂成形品
TW202239833A (zh) * 2020-12-21 2022-10-16 日商富士軟片股份有限公司 聚合物膜以及積層體及其製造方法

Also Published As

Publication number Publication date
CN121175380A (zh) 2025-12-19
WO2024237224A1 (ja) 2024-11-21
KR20260008755A (ko) 2026-01-16
JPWO2024237224A1 (https=) 2024-11-21

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