JPWO2024237224A1 - - Google Patents

Info

Publication number
JPWO2024237224A1
JPWO2024237224A1 JP2025520577A JP2025520577A JPWO2024237224A1 JP WO2024237224 A1 JPWO2024237224 A1 JP WO2024237224A1 JP 2025520577 A JP2025520577 A JP 2025520577A JP 2025520577 A JP2025520577 A JP 2025520577A JP WO2024237224 A1 JPWO2024237224 A1 JP WO2024237224A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025520577A
Other languages
Japanese (ja)
Other versions
JPWO2024237224A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024237224A1 publication Critical patent/JPWO2024237224A1/ja
Publication of JPWO2024237224A5 publication Critical patent/JPWO2024237224A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2025520577A 2023-05-15 2024-05-13 Pending JPWO2024237224A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023080082 2023-05-15
PCT/JP2024/017577 WO2024237224A1 (ja) 2023-05-15 2024-05-13 樹脂組成物、フィルム、金属張積層板および回路基板

Publications (2)

Publication Number Publication Date
JPWO2024237224A1 true JPWO2024237224A1 (https=) 2024-11-21
JPWO2024237224A5 JPWO2024237224A5 (https=) 2026-01-22

Family

ID=93519656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025520577A Pending JPWO2024237224A1 (https=) 2023-05-15 2024-05-13

Country Status (5)

Country Link
JP (1) JPWO2024237224A1 (https=)
KR (1) KR20260008755A (https=)
CN (1) CN121175380A (https=)
TW (1) TW202502894A (https=)
WO (1) WO2024237224A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202532212A (zh) * 2023-12-12 2025-08-16 日商東洋鋼鈑股份有限公司 延伸液晶聚合物薄膜、層積體、電路基板、及延伸液晶聚合物薄膜的製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017150336A1 (ja) * 2016-02-29 2017-09-08 ポリプラスチックス株式会社 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法
WO2018181222A1 (ja) * 2017-03-31 2018-10-04 株式会社クラレ 熱可塑性液晶ポリマーおよびそのフィルム
JP2019163431A (ja) * 2018-03-20 2019-09-26 住友化学株式会社 液晶性ポリエステル液状組成物、液晶ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム
JP2020132849A (ja) * 2019-02-15 2020-08-31 住友化学株式会社 液晶ポリエステル粉末、液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法
JP2022011773A (ja) * 2020-06-30 2022-01-17 Ｅｎｅｏｓ株式会社 樹脂組成物および該樹脂組成物からなる樹脂成形品
WO2022138665A1 (ja) * 2020-12-21 2022-06-30 富士フイルム株式会社 ポリマーフィルム、並びに、積層体及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639756B2 (ja) 2003-11-05 2011-02-23 住友化学株式会社 芳香族液晶ポリエステルおよびそのフィルムならびにそれらの用途

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017150336A1 (ja) * 2016-02-29 2017-09-08 ポリプラスチックス株式会社 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法
WO2018181222A1 (ja) * 2017-03-31 2018-10-04 株式会社クラレ 熱可塑性液晶ポリマーおよびそのフィルム
JP2019163431A (ja) * 2018-03-20 2019-09-26 住友化学株式会社 液晶性ポリエステル液状組成物、液晶ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム
JP2020132849A (ja) * 2019-02-15 2020-08-31 住友化学株式会社 液晶ポリエステル粉末、液晶ポリエステル組成物、フィルムの製造方法、及び積層体の製造方法
JP2022011773A (ja) * 2020-06-30 2022-01-17 Ｅｎｅｏｓ株式会社 樹脂組成物および該樹脂組成物からなる樹脂成形品
WO2022138665A1 (ja) * 2020-12-21 2022-06-30 富士フイルム株式会社 ポリマーフィルム、並びに、積層体及びその製造方法

Also Published As

Publication number Publication date
CN121175380A (zh) 2025-12-19
WO2024237224A1 (ja) 2024-11-21
KR20260008755A (ko) 2026-01-16
TW202502894A (zh) 2025-01-16

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